Urea-formaldehyde modified resin adhesive for bagasse shaving boards and preparation method thereof
A technology for modifying resin and particleboard, applied in the direction of adhesives, aldehyde/ketone condensation polymer adhesives, adhesive types, etc., can solve the problem of no supply of melamine-urea-formaldehyde resin, loss of bond strength, and high bonding requirements problem, to achieve the effect of stable and easy control of the reaction process, improved reaction degree, and good color coordination
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Embodiment 1
[0032] A urea-aldehyde-modified resin glue for bagasse particleboard and a preparation method thereof, the parts by weight of each component are as follows: 3300 parts of formaldehyde, 60 parts of diethylene glycol, 1600 parts of urea, 20 parts of caprolactam, and 2 parts of sodium hydroxide , 450 parts of water.
[0033] The preparation method is as follows: mix formaldehyde with water, adjust the pH value to about 7.5 (adjusted by sodium hydroxide, the amount added is generally 1 part, the same below), add urea, add diethylene glycol, heat up, at 88°C-97°C Heat preservation, measure the fog point in water at 30 degrees, adjust the pH to about 7.0 after the fog point (adjusted by sodium hydroxide, generally 1 part), when the temperature drops to 75°, add secondary urea and water, and keep warm for 15-20 minutes; Then add caprolactam and keep warm for another 15-20 minutes, continue to cool down to 40° to stop cooling, and discharge the material to get ready.
[0034] In the ...
Embodiment 2
[0044] A urea-aldehyde modified resin glue for bagasse particleboard and a preparation method thereof, the parts by weight of each component are as follows: 3500 parts of formaldehyde, 80 parts of diethylene glycol, 1800 parts of urea, 40 parts of caprolactam, and 5 parts of sodium hydroxide , 600 parts of water.
[0045] The preparation method is as follows: mix formaldehyde with water, adjust the pH value to about 7.5, add urea, add diethylene glycol, heat up, keep warm at 88°C-97°C, measure the fog point in 30°C water, adjust the pH to 7 after the fog point .0, when the temperature drops to 75°, add secondary urea and water, and keep warm for 15-20 minutes; then add caprolactam and keep warm for 15-20 minutes, continue to cool down to 40°, stop cooling, and discharge, that is.
[0046] In the above-mentioned preparation method, the first batch of addition of urea is 1050 parts, and the first batch of addition of water is 300 parts.
[0047] The resin technical index of emb...
Embodiment 3
[0056] A urea-aldehyde modified resin glue for bagasse particleboard and a preparation method thereof, the parts by weight of each component are as follows: 3350 parts of formaldehyde, 65 parts of diethylene glycol, 1650 parts of urea, 25 parts of caprolactam, and 4 parts of sodium hydroxide , 500 parts of water.
[0057] The preparation method is as follows: mix formaldehyde with water, adjust the pH value to about 7.5, add urea, add diethylene glycol, heat up, keep warm at 88°C-97°C, measure the fog point in 30°C water, adjust the pH to 7 after the fog point .0, when the temperature drops to 75°, add secondary urea and water, and keep warm for 15-20 minutes; then add caprolactam and keep warm for 15-20 minutes, continue to cool down to 40°, stop cooling, and discharge, that is.
[0058] In the above-mentioned preparation method, the first batch of addition of urea is 1050 parts, and the first batch of addition of water is 300 parts.
[0059] The resin technical index of emb...
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