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Toughened phenolic foamed resin with Si-O side group and preparation method thereof

A foaming resin and phenolic resin technology, which is applied in the field of resin and its preparation, can solve the problems of difficult long-term toughening of phenolic foaming resin, loose structure of nanomaterials, and easy agglomeration, etc., to achieve increased molecular weight, improved toughness, and comprehensive performance. Improved effect

Inactive Publication Date: 2015-11-25
SHENYANG INSTITUTE OF CHEMICAL TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, nanomaterials have shortcomings such as loose structure and easy agglomeration; and the prepared phenolic resin composite material is only intermolecular force, the force is not strong, and it is difficult to toughen the phenolic foamed resin for a long time.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] 1) Preparation of modifier: mix 1.15mol potassium cyanate, 1mol N,N-dimethylformamide and 1.1mol caprolactam, stir to make it completely mixed uniformly, slowly heat up to 125℃, add 1.0mol chlorine dropwise to the mixture Propyl triethoxy silane, the reaction temperature is maintained at 130 ℃; after the end of dripping, the temperature is kept for 5 hours. After the reaction, the filtrate was obtained by filtration; the vacuum in the reaction device was subjected to vacuum distillation at 700 MPa to obtain 3-isocyanatopropyltriethoxysilane.

[0047] 2) Preparation of the expandable phenolic resin with Si-O side groups: add 80g phenol, 15g isocyanatopropyltriethoxysilane, 1g saturated sodium hydroxide solution into the reaction kettle, and add 45g in batches at 65℃ in water bath Control the addition of solid paraformaldehyde for half an hour, continue the reaction for half an hour, increase the temperature to 90°C, continue the reaction for 70 minutes, and then keep the va...

Embodiment 2

[0051] 1) Preparation of modifier: mix 1.15mol potassium cyanate, 1mol N,N-dimethylformamide and 1.1mol caprolactam, stir to make it completely mixed uniformly, slowly heat up to 125℃, add 1.0mol chlorine dropwise to the mixture Propyl triethoxy silane, the reaction temperature is maintained at 130 ℃; after the end of dripping, the temperature is kept for 5 hours. After the reaction, the filtrate was obtained by filtration; the vacuum in the reaction device was subjected to vacuum distillation at 700 MPa to obtain 3-isocyanatopropyltriethoxysilane.

[0052] 2) Preparation of the expandable phenolic resin with Si-O side groups: add 80g phenol, 15g isocyanatopropyltriethoxysilane, 1g saturated sodium hydroxide solution into the reaction kettle, and add 45g in batches at 65℃ in water bath Control the addition of solid paraformaldehyde for half an hour, continue the reaction for half an hour, increase the temperature to 90°C, continue the reaction for 70 minutes, and then keep the va...

Embodiment 3

[0056] 1) Preparation of modifier: mix 1.15mol potassium cyanate, 1mol N,N-dimethylformamide and 1.1mol caprolactam, stir to make it completely mixed uniformly, slowly heat up to 125℃, add 1.0mol chlorine dropwise to the mixture Propyl triethoxy silane, the reaction temperature is maintained at 130 ℃; after the end of dripping, the temperature is kept for 5 hours. After the reaction, the filtrate was obtained by filtration; the vacuum in the reaction device was subjected to vacuum distillation at 700 MPa to obtain 3-isocyanatopropyltriethoxysilane.

[0057] 2) Preparation of the expandable phenolic resin with Si-O side groups: add 80g phenol, 15g isocyanatopropyltriethoxysilane, 1g saturated sodium hydroxide solution into the reaction kettle, and add 45g in batches at 65℃ in water bath Control the addition of solid paraformaldehyde for half an hour, continue the reaction for half an hour, increase the temperature to 90°C, continue the reaction for 70 minutes, and then keep the va...

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PUM

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Abstract

The invention discloses a toughened phenolic foamed resin with Si-O side group and a preparation method thereof, which relate to a resin and a preparation method thereof. The modified phenolic foamed resin adopts isocyanate propyl triethoxysilane as modifier, the Si-O flexible side group is added into phenolic resin, and thereby the toughened phenolic foamed resin is obtained. The relative contents of phenolic hydroxyl and moisture in the phenolic resin prepared by the method are reduced, so that the heat stability and mechanical property of the modified thermoplastic phenolic resin are improved to a certain degree, and thereby the phenolic resin which has small grain size, uniform molecular weight distribution and less volatile matter is prepared. The toughness of phenolic foam boards prepared by adopting the toughened phenolic foamed resin with the Si-O side group is increased greatly, the comprehensive properties of phenolic foam, such as thermal conductivity, are improved, so that the phenolic foam can be applied not only in the external thermal insulation of external walls of buildings but also in other suitable fields, and thereby the application range of the phenolic foam boards is broadened.

Description

Technical field [0001] The invention relates to a resin and a preparation method thereof, in particular to a toughened phenolic foamed resin with Si-O side groups and a preparation method thereof. Background technique [0002] Phenolic foam is a new type of foam plastic developed in recent years. Compared with polyurethane foam and polystyrene foam, phenolic foam has obvious advantages in high temperature resistance. Phenolic foam can be used for a long time in the temperature range of -196~200℃ Without deformation and degradation. Phenolic foam also has the advantages of light weight, heat insulation, low smoke during combustion, low toxicity, no obvious flame, no dripping, low thermal conductivity, good insulation performance, excellent electrical insulation performance, and chemical corrosion resistance. It has broad application prospects in building insulation, petrochemical industry, and aerospace vehicle insulation. However, phenolic foam has the shortcomings of high brit...

Claims

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Application Information

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IPC IPC(8): C08L61/14C08J9/14C08G8/28
Inventor 葛铁军王佳肖尚雄段玉琦
Owner SHENYANG INSTITUTE OF CHEMICAL TECHNOLOGY