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Room-temperature curing adhesive based on silazane and modified silazane polymer and preparation method thereof

A room temperature curing, polymer technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of high curing temperature of adhesives, limited power of curing equipment, insufficient curing depth, etc., to achieve High shear strength, good toughness, wide range of effects

Active Publication Date: 2015-12-02
INST OF CHEM CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] In view of the above analysis, the present invention aims to provide a room temperature curing adhesive based on silazane and its modified polymer and its preparation method, in order to solve the problem of curing the adhesive based on silazane and its modified polymer. Problems such as high temperature, single use and insufficient curing depth due to limited power of curing equipment

Method used

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  • Room-temperature curing adhesive based on silazane and modified silazane polymer and preparation method thereof
  • Room-temperature curing adhesive based on silazane and modified silazane polymer and preparation method thereof
  • Room-temperature curing adhesive based on silazane and modified silazane polymer and preparation method thereof

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preparation example Construction

[0031] The preparation process of the binder is:

[0032] Add a certain amount of auxiliary filler to 100 parts of silazane and its modified polymer and mix evenly, then add the corresponding curing agent, mix thoroughly and degas for 5-10 minutes, then it can be used as a room temperature curing high temperature resistant adhesive , curing at room temperature for 3 to 7 days.

[0033] Silazane and its modified polymers are pyrolyzed into ceramic materials at high temperatures, which have excellent temperature resistance and oxidation resistance. It is precisely because of the excellent properties of the precursor polymer itself that it can be prepared by compounding corresponding fillers. High temperature resistant adhesive.

Embodiment 1

[0036] Add 100 parts of polysilazane with a viscosity of 45,000 centipoise, 5 parts of TDI, and 100 parts of SiO in a beaker 2 , 50 parts ZrB 2 , 5 parts of SiC, 15 parts of TiC, 3 parts of SiO 2 Chopped Fiber, 5 parts Fe 2 o 3 As a pigment, after fully mixing, it is used for the bonding of plastics, metals, graphite, ceramics and their composite materials. After curing at room temperature, the bonding performance is measured.

[0037] Table 1 shows the room temperature bonding strength of the polysilazane binder to metals, graphite, polymer materials, ceramics and composite materials.

[0038] Table 1 The bonding strength of silicone adhesives to metals, polymer materials, ceramics and composite materials

[0039]

Embodiment 2

[0041] According to the ratio of the components of the binder given in Table 2, the viscosity of the polyborosilazane polymer is 950 centipoise, after mixing and degassing, it is used as the binder of the graphite matrix material to make Five groups of bonded parts were tested for room temperature and high temperature performance, and the results are shown in Table 3.

[0042] The composition and proportioning of table 2 binder

[0043]

[0044] Note: Polyborosilazane polymer viscosity is 950 centipoise

[0045] Table 3 Shear Strength of Adhesives at Room Temperature and 1000°C

[0046]

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Abstract

The invention discloses room-temperature curing adhesive based on silazane and modified silazane polymer and a preparation method thereof. The silazane and the modified silazane polymer refer to one or more of polysilazane, polyborosilazane, polycarbosilazane, polysiloxazane and ceramic precursor polymer containing silicon-nitrogen bonds. The silazane-based ceramic precursor polymer can achieve room-temperature curing under the action of isocyanate, and room-temperature curing high-temperature-resistant organic silicone adhesive is prepared by compounding corresponding packing. The adhesive has high temperature resistance and still has quite high shearing strength at 1,000 DEG C. The adhesive has good thermostability, mechanical performance and adhesive performance, and the temperature resistance of the adhesive is superior to that of phenolic resin; compared with inorganic adhesive, the adhesive has excellent toughness.

Description

technical field [0001] The invention relates to the technical field of high-temperature adhesives, in particular to a room-temperature-curing high-temperature-resistant adhesive based on silazane and a modified polymer thereof and a preparation method thereof. Background technique [0002] Silicone adhesives are widely used in aerospace, machinery manufacturing, electronics and chemical industries due to their heat resistance and corrosion resistance. However, in recent years, the temperature resistance of ordinary silicone adhesives has been unable to meet social needs. [0003] Ceramic precursors have attracted widespread attention due to their technological characteristics of polymer materials and the excellent high temperature resistance of ceramic materials formed by pyrolysis. Silazane and its modified polymers not only have the properties of the above-mentioned ceramic precursors, but also contain polar silicon-nitrogen bonds that make them have good adhesion to vario...

Claims

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Application Information

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IPC IPC(8): C09J183/16C09J11/06C09J11/04
Inventor 罗永明王林曾凡徐彩虹
Owner INST OF CHEM CHINESE ACAD OF SCI
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