Phenyl vinyl MQ resin and preparation method thereof

A technology of phenylvinyl and diphenyldimethoxysilane, which is applied in the field of phenylvinyl MQ resin and its preparation, can solve the problems of poor compatibility, decreased light transmittance and low refractive index of LED packaging adhesives , to achieve the effects of mild reaction, short preparation route and simple preparation process

Inactive Publication Date: 2015-12-09
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the technical problems of low refractive index (about 1.4) of the above-mentioned methyl vinyl MQ silicone resin, poor compatibility with LED encapsulants, etc., which lead to a decrease in light transmittance of the LED encapsulant, and provide a Phenylvinyl MQ resin with high refractive index, good compatibility with LED encapsulation adhesive, high light transmittance of LED encapsulation adhesive after mixing, and easy large-scale production and preparation method thereof, in the molecular structure of the phenylvinyl MQ resin At the same time, it contains vinyl, phenyl, etc., and its molecular structure is similar to that of phenyl vinyl silicone resin and crosslinking agent. Compared with methyl vinyl MQ silicone resin, the content of benzene ring is increased to make it compatible with encapsulant Improved

Method used

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  • Phenyl vinyl MQ resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] A kind of phenyl vinyl MQ resin, calculated in parts by weight, its composition and content are as follows:

[0038] Tetraethyl silicate 40 parts

[0039] 12 parts of hexamethyldisiloxane

[0040] 33 parts of diphenyldimethoxysilane

[0041] 2.3 parts of hydrochloric acid

[0042] 8.87 parts of distilled water

[0043] 60 parts of solvent

[0044] 5 parts ethanol

[0045] Described solvent is calculated by weight ratio by toluene and benzene, namely toluene: benzene is the mixture that the ratio of 1:1 forms;

[0046] The preparation method of above-mentioned a kind of phenyl vinyl MQ resin, step is as follows:

[0047] Add 20g of ethyl orthosilicate, 2.5g of ethanol, 6g of hexamethyldisiloxane, 16.5g of diphenyldimethoxysilane, 4.435g of distilled water, 30g of solvent, and 1.15g of hydrochloric acid into the container in sequence to obtain a mixed solution, then heated up to 60°C and stirred at a constant temperature for 3 hours, then added hexamethyldisiloxane...

Embodiment 2

[0056] A kind of phenyl vinyl MQ resin, calculated in parts by weight, its composition and content are as follows:

[0057] Tetraethyl silicate 50 parts

[0058] Hexamethyldisiloxane 17 parts

[0059] 66 parts of diphenyldimethoxysilane

[0060] 5.3 parts of hydrochloric acid

[0061] 10 parts distilled water

[0062] 100 parts of solvent

[0063] 30 parts of ethanol

[0064] Described solvent is toluene;

[0065] Described hydrochloric acid is the hydrochloric acid aqueous solution that mass percent concentration is 38%.

[0066] The preparation method of above-mentioned a kind of phenyl vinyl MQ resin, step is as follows:

[0067] Add 50g of ethyl orthosilicate, 30g of ethanol, 17g of hexamethyldisiloxane, 66g of diphenyldimethoxysilane, 10g of distilled water, 100g of solvent, and 5.3g of hydrochloric acid into the container in order to obtain a mixed solution, and then Raise the temperature to 80°C and stir at a constant temperature for 5 hours, then add hexamethyl...

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Abstract

The invention discloses phenyl vinyl MQ resin and a preparation method thereof. The phenyl vinyl MQ resin is prepared by sequentially adding, by weight, 40-50 parts of tetraethoxysilane, 12-17 parts of hexamethyldisiloxane, 33-66 parts of diphenyldimethoxysilane, 2.3-5.3 parts of hydrochloric acid, 8.87-10 parts of distilled water, 60-100 parts of solvent and 5-30 parts of ethyl alcohol into a container, raising the temperature to 60-80 DEG C, conducting stirring for 3-5 h at the constant temperature, adding hexamethyldisiloxane as extract liquor to obtain MQ resin mixed liquor, standing to achieve layering, adding a methylbenzene and potassium hydroxide aqueous solution to an obtained upper layer solution, conducting dehydration condensation polymerization for 3-4 h at the temperature of 90-100 DEG C to obtain an MQ resin methylbenzene solution, adding calcium chloride for drying after the pH value is regulated to 7, and then conducting vacuum filtration and reduced pressure distillation.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a phenylvinyl MQ resin and a preparation method thereof. Background technique [0002] With the rapid development of the LED packaging industry, the development of packaging materials that are resistant to thermal shock, non-yellowing, high light transmittance, and high refractive index is an important key technology that urgently needs to be solved in the manufacture of power-type white light LEDs. At present, the encapsulation resin for high-power white LEDs uses silicone resin with high light transmittance, high refractive index, good thermal stability, low stress, low moisture absorption and excellent heat resistance. [0003] The encapsulation of LED is generally cured by vinyl phenyl silicone resin and cross-linking agent under the action of catalyst, so as to obtain a practical encapsulation material. However, due to the non-polar characteristics of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/20C08G77/06
Inventor 张英强张轩凝梁华丽吴明刚
Owner SHANGHAI INST OF TECH
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