Production method for damp-proof ceiling decoration density board

一种生产方法、密度板的技术，应用在粘合剂类型、家用元件、应用等方向，能够解决易起鼓、变形、板材翘曲变形、使用寿命短等问题，达到提高耐水性、提高密封性能、防潮性能好的效果

Inactive Publication Date: 2015-12-16
钱秀英
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Particleboard and MDF have poor water resistance, and after absorbing moisture, the board will warp due to the difference in expansion force. The ceiling is a building structure that is most vulnerable to moisture attack. Therefore, the ceiling decoration materials made of particleboard and MDF currently used Easy to bulge and deform, short service life

Method used

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  • Production method for damp-proof ceiling decoration density board

Examples

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Effect test

Embodiment 1

[0022] The production of urea-formaldehyde resin includes the following steps: Pre-polymerization stage: add formaldehyde solution to the polymerization reactor at one time, adjust the pH value to 2-2.5 with formic acid, add urea with 15% weight of the formaldehyde solution, heat up to 46°C, and keep warm for 60 minutes .

[0023] Polymerization stage: at the end of the pre-polymerization stage, add alkali to adjust the pH value of the reaction solution to 8-8.5, add urea with 30% weight of formaldehyde solution, and complete the addition within 40-60 minutes, then raise the temperature of the reaction solution to 88-92°C, and keep it warm for 90 minutes .

[0024] Post-polymerization stage: at the end of the polymerization stage, add urea with 30-40% of the weight of formaldehyde solution, and finish adding within 40-60 minutes, then lower the reaction temperature to 70-85°C, react for 60-90 minutes, and cool down to room temperature to obtain urea-formaldehyde resin; 46 par...

Embodiment 2

[0026] Add the moisture-proof urea-formaldehyde resin adhesive that 150kg embodiment 1 obtains to 1m3 sawdust, stir evenly with a mixer, put into the plate mold, compress with compressor under normal temperature, the pressure is 2.5Mpa; Then put into the hot press, at 130 ~135°C, hot pressing at 1.5Mpa; put the plate into a constant temperature room for natural ventilation and cooling for 3~4h, compress it with a compressor at room temperature, the pressure is 2.5Mpa; put it in a hot press, and press it for the second time at 125 ~130°C, pressure 1.5Mpa, put the board in a constant temperature room for natural ventilation and cooling for 3~4h; compress it with a compressor at room temperature, the pressure is 2.5Mpa; put it into a hot press, and press it for the third time, the temperature is 120 ~120°C, pressure 1.5Mpa; then heat up to 150°C, paste melamine-impregnated paper on both sides of the board under a pressure of 1.5Mpa, cool to room temperature by blowing air, and obt...

Embodiment 3

[0028] Add 180kg of the moisture-proof urea-formaldehyde resin adhesive obtained in Example 1 to 1m3 nut shell particles, stir evenly with a mixer, put it into a plate mold, compress it with a compressor at normal temperature, and the pressure is 2.5Mpa; 130~135℃, hot pressing at 1.8Mpa; put the plate in a constant temperature room for natural ventilation and cooling for 3~4 hours, and compress it with a compressor at room temperature, with a pressure of 2.5Mpa; 125~130℃, the pressure is 1.8Mpa, put the plate into the constant temperature room for natural ventilation and cooling for 3~4 hours; use a compressor to compress at room temperature, the pressure is 2.5Mpa; then put it into the hot press, and heat the third time, the temperature is 120~120℃, the pressure is 1.8Mpa; then the temperature is raised to 150℃, the two sides of the board are covered with aluminum oxide wear-resistant paper under the pressure of 1.5Mpa, and the air blast is cooled to room temperature a to obta...

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Abstract

The invention provides a production method for a damp-proof ceiling decoration density board. The production method includes the steps that broken wood materials or broken gains such as various types of straw and nutshells which are generated after crops are harvested and damp-proof urea-formaldehyde resin adhesives are mixed and pressed into a board, and the board and melamine-soaked paper or aluminium oxide wear-resistant paper are pressed and attached at a high temperature to form the damp-proof ceiling decoration density board. Three times of cold pressing, three times of hot pressing and two times of heat dissipation regimens are adopted for board forming. The cold pressing temperature is the room temperature, the cold pressing pressure is 2.5 MPa, and the hot pressing pressure is 1.5-2.0 MPa. The temperature of the first time of hot pressing is 130-135 DEG C. The temperature of the second time of hot pressing is 125-130 DEG C. The temperature of the third time of hot pressing is 120-125 DEG C. The heat dissipation regiments are achieved by lowering the temperature of a constant temperature room to the room temperature through natural ventilation cooling, and the time ranges from 3 h to 4 h. The melamine-soaked paper or the aluminium oxide wear-resistant paper is attached to the surface of the board at a temperature of 150 DEG C and under the pressure of 1.5 MPa.

Description

[0001] This application is a divisional application for an invention patent with an application date of "August 28, 2013", an application number of "201310380105X", and a title of "Production Method of Moisture-proof Ceiling Decorative Board". technical field [0002] The invention relates to a production method of a wood-based panel, in particular to a production method of a wood-based panel for producing ceiling decoration materials with excellent moisture resistance. Background technique [0003] At present, the decoration material of smallpox mainly adopts gypsum board. It is a building material with light weight, high strength, thin thickness, convenient processing, sound insulation, heat insulation and fire prevention. It is one of the new lightweight boards that are currently focused on development. one. As the state encourages the production of sawdust, shavings, bark, sanding powder, branches and branches in forestry production, wood processing, bamboo processing an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/06B27N3/10C09J161/24C09J133/04C09J11/08C09J11/04C08G12/12
Inventor 钱秀英
Owner 钱秀英
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