Production method of moisture-proof ceiling decorative board
A production method and technology for decorative panels, applied in the types of adhesives, household components, applications, etc., can solve the problems of easy bulging, deformation, warping and deformation of plates, short service life, etc., to improve water resistance, improve sealing performance, the effect of avoiding the gel effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0026] The production of urea-formaldehyde resin comprises the steps:
[0027] Pre-polymerization stage: Add formaldehyde solution to the polymerization reactor at one time, adjust the pH value to 2-2.5 with formic acid, add urea with 15% weight of the formaldehyde solution, raise the temperature to 46°C, and keep the temperature for 60 minutes.
[0028] Polymerization stage: at the end of the pre-polymerization stage, add alkali to adjust the pH value of the reaction solution to 8-8.5, add urea with 30% weight of formaldehyde solution, and complete the addition within 40-60 minutes, then raise the temperature of the reaction solution to 88-92°C, and keep it warm for 90 minutes .
[0029] Post-polymerization stage: at the end of the polymerization stage, add urea with a weight of 30-40% of the formaldehyde solution, finish adding within 40-60 minutes, then lower the reaction temperature to 70-85°C, react for 60-90 minutes, and cool down to room temperature to obtain urea-forma...
Embodiment 2
[0032] Add the moisture-proof urea-formaldehyde resin adhesive that 150kg embodiment 1 obtains to 1m3 sawdust, stir evenly with a mixer, put into the plate mold, compress with compressor under normal temperature, the pressure is 2.5Mpa; Then put into the hot press, at 130 ~135°C, hot pressing at 1.5Mpa; put the plate into a constant temperature room for natural ventilation and cooling for 3~4h, compress it with a compressor at room temperature, the pressure is 2.5Mpa; put it in a hot press, and press it for the second time at 125 ~130°C, pressure 1.5Mpa, put the board in a constant temperature room for natural ventilation and cooling for 3~4h; compress it with a compressor at room temperature, the pressure is 2.5Mpa; put it into a hot press, and press it for the third time, the temperature is 120 ~120°C, pressure 1.5Mpa; then heat up to 150°C, paste melamine-impregnated paper on both sides of the board under a pressure of 1.5Mpa, cool to room temperature by blowing air, and obt...
Embodiment 3
[0034] Add 180kg of the moisture-proof urea-formaldehyde resin adhesive obtained in Example 1 to 1m3 nut shell particles, stir evenly with a mixer, put it into a plate mold, compress it with a compressor at normal temperature, and the pressure is 2.5Mpa; 130~135℃, hot pressing at 1.8Mpa; put the plate in a constant temperature room for natural ventilation and cooling for 3~4 hours, and compress it with a compressor at room temperature, with a pressure of 2.5Mpa; 125~130℃, the pressure is 1.8Mpa, put the plate into the constant temperature room for natural ventilation and cooling for 3~4 hours; use a compressor to compress at room temperature, the pressure is 2.5Mpa; then put it into the hot press, and heat the third time, the temperature is 120~120℃, the pressure is 1.8Mpa; then the temperature is raised to 150℃, the two sides of the board are covered with aluminum oxide wear-resistant paper under the pressure of 1.5Mpa, and the air blast is cooled to room temperature to obtain...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com