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Weather-resisting chemico-mechanical polishing pad

A chemical-mechanical, weather-resistant technology, applied in grinding/polishing equipment, wheels with flexible working parts, abrasives, etc., can solve problems such as unfavorable material storage and use, material aging and damage, affecting appearance, etc., Achieve the effect of extending storage and service life, preventing aging and damage, and improving strength

Active Publication Date: 2015-12-23
HUBEI DINGLONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, the polishing layer of polishing pads commonly used in the market is easy to change color under the radiation of sunlight (mainly ultraviolet rays), affects the appearance, and easily causes aging and damage of materials, which is not conducive to the storage and use of materials. People expect to study a A polishing pad with excellent weather resistance

Method used

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  • Weather-resisting chemico-mechanical polishing pad

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Under the condition of 40°C oil bath, put 100g of 1,6-hexamethylene diisocyanate into a three-necked flask, and the stirring speed is 300 rpm; Hours later, the reactants were subjected to vacuum defoaming treatment to obtain weather-resistant polyurethane prepolymer A1 with a viscosity of 22000 mPa·S.

[0027] Weigh 5g of functional filler and add it to A1 above, and mix evenly; then add 53.4g of curing agent and mix evenly at high speed, pour the mixture into a mold, and then put the product in an oven at 90°C for 16 hours to obtain a polyurethane polishing pad Polishing layer (polishing layer 1 for short).

Embodiment 2

[0029]Under the condition of 40°C oil bath, put 100g of isophorone diisocyanate into a three-necked flask, and the stirring speed is 300 rpm; then add 400g of polyether polyol dropwise into isophorone diisocyanate and react for 2 hours Afterwards, the reactants were subjected to vacuum defoaming treatment to obtain weather-resistant polyurethane prepolymer A2 with a viscosity of 35000mPa·S.

[0030] Weigh 4g of functional filler and add it to A2 above, and mix evenly; then add 13.4g of curing agent and mix evenly at high speed, pour the mixture into a mold, and then put the product in an oven at 90°C for 16 hours to obtain a polyurethane polishing pad Polishing layer (abbreviated as polishing layer 2).

Embodiment 3

[0032] Under the condition of 40°C oil bath, put 100g of xylylene diisocyanate into a three-necked flask, and the stirring speed is 300 rpm; then add 400g of polyether polyol dropwise into xylylene diisocyanate, and After 2 hours, the reactants were subjected to vacuum defoaming treatment to obtain weather-resistant polyurethane prepolymer A3 with a viscosity of 28000 mPa·S.

[0033] Weigh 4.5g of functional filler and add it to A3 above, and mix evenly; then add 35g of curing agent and mix evenly at high speed, pour the mixture into a mold, and then put the product in an oven at 90°C for 16 hours to obtain a polyurethane polishing pad Polishing layer (polishing layer 3 for short).

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Abstract

The invention discloses a weather-resisting chemico-mechanical polishing pad. The problem that an existing polishing pad is poor in weather resistance is solved through the weather-resisting chemico-mechanical polishing pad. The weather-resisting chemico-mechanical polishing pad at least comprises a polishing layer, a buffering layer and a transparent bottom pad body from top to bottom. All the layers are bonded through pressure sensitive adhesives or tackiness agents. The weather-resisting chemico-mechanical polishing pad is characterized in that the polishing layer is formed by mixing and solidifying a weather-resisting polyurethane prepolymer, a curing agent and a functional filler, the weather-resisting polyurethane prepolymer is formed by conducting a reaction between polyol and weather-resisting multifunctional isocyanate, and the molecular structure of the weather-resisting multifunctional isocyanate does not contain a benzene ring, or an isocyanate group in the molecular structure is indirectly connected with a benzene ring. The weather-resisting chemico-mechanical polishing pad is simple in process and low in cost and has excellent weather resistance.

Description

technical field [0001] The invention relates to the technical field of chemical-mechanical planarization treatment polishing, in particular to a weather-resistant chemical-mechanical polishing pad. Background technique [0002] Chemical mechanical planarization, or chemical mechanical polishing (CMP), is a common technique used to planarize semiconductor wafers, substrates such as sapphire. In conventional CMP, a wafer is mounted on a holder assembly and brought into contact with a polishing pad in the CMP apparatus. The support assembly provides controlled pressure on the wafer, pressing the wafer against the polishing pad. The external driving force makes the polishing pad rotate relative to the wafer. At the same time, a chemical composition or other polishing solution is provided between the wafer and the polishing pad. Thus, the surface of the wafer is polished and flattened by the chemical and mechanical action of the polishing pad surface and the slurry. [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/24C08G18/10C08G18/73C08G18/75C08G18/76C08G18/48
CPCB24B37/24C08G18/10C08G18/48C08G18/73C08G18/755C08G18/7671B24D13/147B24D18/0009C08G18/724C08G18/7642C08G18/3814C08G18/75C08G18/76C08K3/013C08K5/0008
Inventor 朱顺全梅黎黎李云峰
Owner HUBEI DINGLONG CO LTD
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