Thick film circuit insulating dielectric slurry for aluminum substrates, and preparation method thereof

A thick-film circuit and insulating medium technology, which is applied in the field of high-power metal aluminum substrate thick-film circuit insulating medium slurry and its preparation, can solve the problems of inability to use high-temperature sintering process, slow heating rate of stainless steel substrate, and large thermal expansion coefficient of metal aluminum, etc. Problems, to achieve the effect of large-scale industrial production, good insulation performance, high breakdown voltage

Inactive Publication Date: 2015-12-23

NINGBO POLYTECHNIC

1 Cites 8 Cited by

AI-Extracted Technical Summary

Problems solved by technology

However, the heating rate of the stainless steel substrate is slow, the density is high, the electric heating element is bulky, and the firing temperature of the thick film circuit element is high, while the metal aluminum substrate has the advantages of light weight, good thermal conductivity, and easy processing. It is very suitable as a high-power ele...

Abstract

The present invention discloses a thick film circuit insulating dielectric slurry for aluminum substrates, and a preparation method thereof. The preparation method comprises: uniformly mixing Ba3(PO4)2, AlPO4, Zn3(PO4)2, Sn2P2O7, Rb2O, B2O3 and Nb2O5 according to a certain ratio, placing into a high temperature electric furnace, heating to a temperature of 1000-1600 DEG C according to a certain temperature increase program, carrying out thermal insulation for 1-6 h, carrying out water quenching, carrying out ball milling on the material to achieve 1-5 [mu] mu to obtain aluminum substrate thick film circuit insulating dielectric composite glass-ceramic powder, mixing the glass-ceramic powder and an organic liquid carrier comprising terpineol, tributyl citrate, ethyl cellulose, span 85 and hydrogenated castor oil according to a certain ratio, and repeatedly rolling by using a three-roller rolling mill to obtain the metal aluminum substrate thick film circuit insulating dielectric slurry. The insulating dielectric slurry has characteristics of good bonding force with the metal aluminum substrate, high breakdown voltage resistance and good insulating property, and meets the requirements of the high-power metal aluminum substrate thick film circuit insulating dielectric material.

Application Domain

Quartz/glass/vitreous enamels

Technology Topic

Electric furnacesOrganic fluid +14

Examples

Experimental program(2)

Example Embodiment

[0016] Example 1

[0017] Weigh 32gBa accurately 3 (PO 4 ) 2 , 11gAlPO 4 , 5gZn 3 (PO 4 ) 2 , 4gSn 2 P 2 O 7 , 26gRb 2 O, 20gB 2 O 3 , 2gNb 2 O 5.

[0018] The organic liquid carrier components are terpineol, tributyl citrate, ethyl cellulose, Span 85, 1,4-butyrolactone, hydrogenated castor oil, and the mass ratio is 73:12:4:6:4:1 .

[0019] Mix the raw materials uniformly according to the ratio, put them in a high-temperature electric furnace, heat to 1350°C at a heating rate of 5°C/min, hold for 3 hours, then perform water quenching, put the solids in the corundum tank of the planetary ball mill, and then add deionization Water is used as the mixing medium and ball milled for 4 hours to obtain composite glass-ceramic powder with a particle size of 1 to 4 μm; the composite glass-ceramic powder and the organic liquid carrier are made into a slurry at a mass ratio of 75:25, and repeated with a three-roll mill Rolling.

[0020] The film is printed on the metal aluminum substrate with a silk screen. After sintering at 560℃, the thickness of the dielectric film is 112μm, and the breakdown voltage (AC)> 1500V, insulation resistance (500V)> 10MΩ, leakage current (250V) <2mA.

Example Embodiment

[0021] Example 2

[0022] Accurately weigh 25gBa 3 (PO 4 ) 2 , 15gAlPO 4 , 4gZn 3 (PO 4 ) 2 , 8gSn 2 P 2 O 7 , 30gRb 2 O, 15gB 2 O 3 , 3gNb 2 O 5.

[0023] The organic liquid carrier components are terpineol, tributyl citrate, ethyl cellulose, Span 85, 1,4-butyrolactone, hydrogenated castor oil, and the mass ratio is 75:10:5:5:3:2 .

[0024] Mix the raw materials uniformly according to the ratio, place them in a high-temperature electric furnace, heat to 1400°C at a heating rate of 8°C/min, hold for 2h, then perform water quenching, put the solids in the corundum tank of the planetary ball mill, and then add deionization Water is used as the mixed grinding medium and ball milled for 3 hours to obtain composite glass-ceramic powder with a particle size of 2-5μm; the composite glass-ceramic powder and organic liquid carrier are made into a slurry at a mass ratio of 78:22, and repeated with a three-roll mill Rolling.

[0025] The film is printed on the metal aluminum substrate with a silk screen. After sintering at 560℃, the thickness of the dielectric film is 118μm, and the breakdown voltage (AC)> 1500V, insulation resistance (500V)> 10MΩ, leakage current (250V) <2mA.

PUM

Property	Measurement	Unit
Particle size	1.0 ~ 4.0	µm
Thickness	112.0	µm
Breakdown voltage	>= 1500.0	V

Description & Claims & Application Information

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AI-Extracted Technical Summary

Problems solved by technology

Abstract

Examples

Example Embodiment

Example Embodiment

PUM

Description & Claims & Application Information

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