Thick film circuit insulating dielectric slurry for aluminum substrates, and preparation method thereof
A thick-film circuit and insulating medium technology, which is applied in the field of high-power metal aluminum substrate thick-film circuit insulating medium slurry and its preparation, can solve the problems of inability to use high-temperature sintering process, slow heating rate of stainless steel substrate, and large thermal expansion coefficient of metal aluminum, etc. Problems, to achieve the effect of large-scale industrial production, good insulation performance, high breakdown voltage
Inactive Publication Date: 2015-12-23
NINGBO POLYTECHNIC
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Abstract
The present invention discloses a thick film circuit insulating dielectric slurry for aluminum substrates, and a preparation method thereof. The preparation method comprises: uniformly mixing Ba3(PO4)2, AlPO4, Zn3(PO4)2, Sn2P2O7, Rb2O, B2O3 and Nb2O5 according to a certain ratio, placing into a high temperature electric furnace, heating to a temperature of 1000-1600 DEG C according to a certain temperature increase program, carrying out thermal insulation for 1-6 h, carrying out water quenching, carrying out ball milling on the material to achieve 1-5 [mu] mu to obtain aluminum substrate thick film circuit insulating dielectric composite glass-ceramic powder, mixing the glass-ceramic powder and an organic liquid carrier comprising terpineol, tributyl citrate, ethyl cellulose, span 85 and hydrogenated castor oil according to a certain ratio, and repeatedly rolling by using a three-roller rolling mill to obtain the metal aluminum substrate thick film circuit insulating dielectric slurry. The insulating dielectric slurry has characteristics of good bonding force with the metal aluminum substrate, high breakdown voltage resistance and good insulating property, and meets the requirements of the high-power metal aluminum substrate thick film circuit insulating dielectric material.
Application Domain
Quartz/glass/vitreous enamels
Technology Topic
Electric furnacesOrganic fluid +14
Examples
- Experimental program(2)
Example Embodiment
Example Embodiment
PUM
Property | Measurement | Unit |
Particle size | 1.0 ~ 4.0 | µm |
Thickness | 112.0 | µm |
Breakdown voltage | >= 1500.0 | V |
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