Smelting device and preparing method for antioxidant tin solder alloy

Abstract

The invention provides a smelting device for antioxidant tin solder alloy. The smelting device for the antioxidant tin solder alloy comprises a furnace body, a furnace cover, a stirring machine, a stirring support, a guide rail support, a feeding system, a temperature control system, a nitrogen system and a lifting system. The furnace cover is fixed to the liftable stirring support. The feeding device, a thermoelectric couple and a nitrogen pipe are installed on the furnace cover. A stirring shaft passes through the center of the furnace cover. A cooling device is arranged at the front end of the feeding device. The stirring support is fixed to the guide rail support through a sliding rail and can move up and down. The guide rail support and the furnace body are fixed together. The exterior of the furnace body is made of metal. The interior of the furnace body is made of refractory heat-insulation materials. Electric heating wires are fixed in grooves built through refractory materials. A stainless steel or iron-cast crucible is arranged on the furnace body. According to the smelting device for the antioxidant tin solder alloy, by the adoption of the way that the furnace cover can rise and fall, nitrogen in the furnace body is at the positive pressure, a microelement feed inlet is formed, and the cooling device is arranged, the alloy element of tin solder can be effectively controlled, and the oxidation resistance is improved and stabilized.

Description

technical field [0001] The invention relates to the technical field of automatic equipment, in particular to a melting device for an anti-oxidation tin solder alloy and a preparation method thereof. Background technique [0002] Welding is an important process in electronic assembly. Wave soldering realizes the automation of circuit board welding and greatly reduces the manufacturing cost of electronic products. It is the main welding method in electronic assembly at present. Compared with manual soldering and dip soldering, wave soldering has higher efficiency and better soldering quality. However, during the wave soldering process, the molten liquid tin solder is constantly gushing out, and the solder at the bottom is sucked up by the tin pump and continuously ejected from the nozzle, and a large amount of oxidized tin slag is produced in contact with air. In order to reduce the slag rate of tin solder and reduce loss, researchers found that adding elements such as phosph...

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Problems solved by technology

[0003] For above problem, application number is that 200610013240.0 has announced the formula principle of a kind of lead-free solder alloy, but is not specific for the preparation process description; The preparation process of the alloy is described in detail, but the preparation device is not described, and some problems arising in the preparation process of various alloys are not considered, such as the ignition point of P is 40 ° C, how to ensure that P is added from room temperature to over 300 The ℃ melting furnace will not be burned during the process; the application number is 201420428296.2, which discloses a high-efficiency numerical control tin solder production equipment. The equipment of this patent technology is a melting furnace with good airtight performance. The materials are added from the feeding funnel and passed through the vacuum Stirring ensures that the raw materials will not be burned during the mixing process, but the limitation of this patent is that for elements such as P with a low ignition point, during the feeding process, most of the P will be exposed to high-temperature air during the period before the furnace is completely evacuated In addition, the feeding port of the device is small, which is not suitable for mass production in factories. Because the main raw material tin is generally in the form of ingots, the feeding funnel can only add small-sized powdery and granular raw materials. , unable to add ingot-shaped bulk ingredients

In summary, there are still some technical problems in the preparation process of solder alloys, and the problem of precise solder ratio needs to be solved urgently

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