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Epoxy-resin-based material high in heat resistance and preparation method thereof

A technology of epoxy resin and base material, applied in the field of high heat-resistant epoxy resin base material and its preparation, can solve the problems of poor heat resistance of epoxy resin base material, etc., and achieve the effect of good heat resistance and wide application range

Inactive Publication Date: 2015-12-30
SUZHOU KUANWEN ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved is: in order to solve the problems of poor heat resistance of epoxy resin-based materials, etc., to provide a high heat-resistant epoxy resin-based material and its preparation method

Method used

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  • Epoxy-resin-based material high in heat resistance and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0017] A high heat-resistant epoxy resin-based material, consisting of the following components in parts by mass: 65 parts of modified epoxy resin, 30 parts of polyimide, 12 parts of 2-mercaptobenzothiazole, 6 parts of nano-alumina, 2 parts of aluminate cement, 3 parts of micropowder silica gel, 3 parts of mica powder, 20 parts of curing agent and 25 parts of solvent. In parts by mass, the modified epoxy resin is prepared from the following raw materials: 45 parts of bisphenol S-type epoxy resin, 15 parts of silicone resin emulsion, 10 parts of phenolic resin emulsion, 5 parts of silicon dioxide, 3 parts of dioctyltin parts and 6 parts of ethanol.

[0018] Wherein, the curing agent is ethylenediamine. The solvent is butanone.

[0019] A preparation method of a high heat-resistant epoxy resin-based material, the method comprising the following steps:

[0020] (1) Modification of epoxy resin: Dissolve bisphenol S-type epoxy resin in ethanol, add silicone resin emulsion, pheno...

Embodiment 2

[0024] A high heat-resistant epoxy resin-based material, consisting of the following components in parts by mass: 100 parts of modified epoxy resin, 50 parts of polyimide, 27 parts of 2-mercaptobenzothiazole, 16 parts of nano-alumina, 13 parts of aluminate cement, 15 parts of micropowder silica gel, 10 parts of mica powder, 40 parts of curing agent and 50 parts of solvent. In parts by mass, the modified epoxy resin is prepared from the following raw materials: 60 parts of bisphenol S epoxy resin, 28 parts of silicone resin emulsion, 22 parts of phenolic resin emulsion, 10 parts of silicon dioxide, 18 parts of dioctyltin parts and 20 parts of ethanol.

[0025] Wherein, the curing agent is polyethylene polyamine. The solvent is ethanol.

[0026] A preparation method of a high heat-resistant epoxy resin-based material, the method comprising the following steps:

[0027] (1) Modification of epoxy resin: Dissolve bisphenol S-type epoxy resin in ethanol, add silicone resin emulsi...

Embodiment 3

[0031] A high heat-resistant epoxy resin-based material, consisting of the following components in parts by mass: 82 parts of modified epoxy resin, 40 parts of polyimide, 20 parts of 2-mercaptobenzothiazole, 11 parts of nano-alumina, 7 parts of aluminate cement, 9 parts of micropowder silica gel, 6 parts of mica powder, 30 parts of curing agent and 37 parts of solvent. In parts by mass, the modified epoxy resin is prepared from the following raw materials: 52 parts of bisphenol S-type epoxy resin, 21 parts of silicone resin emulsion, 16 parts of phenolic resin emulsion, 7 parts of silicon dioxide, 10 parts of dioctyltin parts and 13 parts of ethanol.

[0032] Wherein, the curing agent is xylylenediamine. The solvent is isopropanol.

[0033] A preparation method of a high heat-resistant epoxy resin-based material, the method comprising the following steps:

[0034] (1) Modification of epoxy resin: Dissolve bisphenol S-type epoxy resin in ethanol, add silicone resin emulsion,...

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Abstract

The invention discloses an epoxy-resin-based material high in heat resistance and a preparation method thereof. The epoxy-resin-based material is prepared from, by mass, modified epoxy resin, polyimide, 2-mercaptobenzothiazole, nanometer aluminum oxide, aluminate cement, superfine silica powder, mica powder, curing agents and solvent; the modified epoxy resin is prepared from bisphenol S epoxy resin, silicon resin emulsion, bakelite emulsion, silica, dioctyltin and ethyl alcohol. The epoxy-resin-based material prepared through the method is high in heat deformation temperature, good in displayed heat resistance and wide in application scope.

Description

technical field [0001] The invention belongs to the field of electronic materials, in particular to a high heat-resistant epoxy resin-based material and a preparation method thereof. Background technique [0002] Copper clad laminates have now become an important part of basic materials in electronic information products. With the development of electronic information and communication industry, copper clad laminate manufacturing industry has broad prospects. The development history of electronics industry technology in the past hundred years shows that copper clad laminate technology is often one of the key aspects to promote the development of electronics industry. Its progress and development are driven by the innovation and development of electronic complete machine products, semiconductor manufacturing technology, electronic installation technology, and printed circuit board manufacturing technology. Epoxy resin is a widely used resin matrix for copper clad laminates....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L79/08C08L83/04C08L61/06C08K13/02C08K3/36C08K3/34C08K5/47C08K3/22C08K5/57
Inventor 翁宇飞李力南
Owner SUZHOU KUANWEN ELECTRONICS SCI & TECH