Preparation method for metal nano-particle ordered microstructure

A technology of metal nanoparticles and microstructures, applied in metal processing equipment, metal material coating technology, manufacturing tools, etc., can solve the problems of increased cost, ineffective use of metal films, expensive raw materials, etc., and achieve economical use , high efficiency, simple preparation process and method

Active Publication Date: 2016-01-06
胡万谦
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this method prepares periodic microstructures, the use of raw materials is relatively expensive, such as the use of gold and platinum, and after the perio

Method used

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  • Preparation method for metal nano-particle ordered microstructure
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  • Preparation method for metal nano-particle ordered microstructure

Examples

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Effect test

Embodiment 1

[0031] A method for preparing an ordered microstructure of gold nanoparticles, comprising the following steps:

[0032] Step 1. Ultrasonic cleaning of a transparent substrate with pure water, detergent, acetone and ethanol for 10 minutes, and then drying with high-pressure nitrogen with a purity of 99.9%; the ultrasonic frequency of ultrasonic cleaning is 20KHZ, and the power is 700W;

[0033] Step 2. Prepare the metal film by magnetron sputtering process. The working conditions are: first vacuum the magnetron sputtering apparatus to less than 5Pa, then turn on the molecular pump, and turn on the high vacuum gauge after 50 minutes to check the vacuum in the sputtering vacuum chamber. degree until the vacuum degree in the sputtering vacuum chamber is less than 4×10 -4 Pa; use argon and oxygen with a volume ratio of 100:1 as the background gas, place the transparent substrate on the aluminum dielectric target to be sputtered, and then open the background gas valve switch to feed...

Embodiment 2

[0037] A method for preparing an ordered microstructure of gold nanoparticles, comprising the following steps:

[0038] Step 1. Ultrasonic cleaning of a transparent substrate with pure water, detergent, acetone and ethanol for 10 minutes, and then drying with high-pressure nitrogen with a purity of 99.9%; the ultrasonic frequency of ultrasonic cleaning is 30KHZ, and the power is 800W;

[0039] Step 2, using the electron beam evaporation process to prepare the metal thin film, the method is: put the copper film material in the crucible of the electron beam evaporation equipment, put the transparent substrate on the heating electric furnace of the electron beam evaporation equipment, and make the transparent substrate Located 25cm directly above the crucible; in a vacuum of 5×10 -3 Coating under Pa, the temperature of the transparent substrate is controlled at 50°C, the electron beam is adjusted to minimize the spots on the copper film material, the beam current value is control...

Embodiment 3

[0043] A method for preparing an ordered microstructure of platinum nanoparticles, comprising the following steps:

[0044] Step 1. Ultrasonic cleaning of a transparent substrate with pure water, detergent, acetone and ethanol for 10 minutes, and then drying with high-pressure nitrogen with a purity of 99.9%; the ultrasonic frequency of ultrasonic cleaning is 25KHZ, and the power is 800W;

[0045] Step 2. Prepare the metal film by magnetron sputtering process. The working conditions are: first vacuum the magnetron sputtering apparatus to less than 5Pa, then turn on the molecular pump, and turn on the high vacuum gauge after 50 minutes to check the vacuum in the sputtering vacuum chamber. degree until the vacuum degree in the sputtering vacuum chamber is less than 4×10 -4 Pa; use argon and oxygen with a volume ratio of 100:1 as the background gas, place the transparent substrate on the aluminum dielectric target to be sputtered, and then open the background gas valve switch to ...

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Abstract

The invention discloses a preparation method for a metal nano-particle ordered microstructure. The preparation method comprises the following steps that (1) a transparent substrate is cleaned up; (2) a layer of metal thin film is prepared on the surface of the transparent substrate by adopting a film coating process; (3) a reception substrate is taken and placed on a three-dimensional mobile platform controlled by a computer, the side, deposited with the metal thin film, of the transparent substrate makes contact with the reception substrate, irradiation is conducted from the side without the thin film with picosecond laser, and the ordered microstructure is deposited on the reception substrate; and (4) the reception substrate deposited with the ordered microstructure is added to a chemical compound solution containing AuCl-4 or PtCl2-6, mixing is conducted, a reaction is stopped when the color of the solution changes, and in this way, the gold or platinum nano-particle ordered microstructure is obtained on the surface of the reception substrate. According to the preparation method, the theories of picosecond laser pulses and metal replacement reactions are adopted, and metal with high reduction potential is replaced by metal with low reduction potential; the metal nano-particle ordered microstructure with the line width below 500 nm can be obtained. The preparation process is simple, high in efficiency and low in cost.

Description

technical field [0001] The invention relates to a method for preparing an ordered microstructure composed of metal nanoparticles, in particular to a method for preparing an ordered microstructure composed of metal nanoparticles by combining picosecond laser deposition and replacement reaction. Background technique [0002] Due to their small size, metal nanoparticles exhibit different physical and chemical properties such as electrical, optical, magnetic and catalytic properties of their corresponding bulk materials, making them have important applications in catalysis, nonlinear optics, electronic devices, biosensing, etc. , especially ordered nanomaterials, are of great significance to nanotechnology, such as the construction of nanoelectronic circuits. At present, the conventional preparation methods of ordered microstructures of metal thin films include electron beam lithography and nanosecond pulse laser direct writing, etc., but there are obvious shortcomings. Resist ...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/30C23C14/16B23K26/00
Inventor 胡万谦
Owner 胡万谦
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