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Environment-friendly and low-filling conductive silver paste and preparation method thereof

A low-filling, conductive silver paste technology, used in cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as poor reliability, complex process, and difficult processing, and reduce consumption. , the preparation method is simple, the effect of improving the conductivity

Active Publication Date: 2016-01-13
YUNNAN NORMAL UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to reduce costs, some researchers use silver-plated copper powder or other base metal powders to replace pure silver powders as conductive fillers to save costs. For example, the invention patent with application number 201310294279.4 discloses a low silver content composite conductive silver paste and its preparation The method comprises 5-15 parts of silver-plated copper powder, 30-50 parts of silver-plated glass powder, 5-15 parts of polymer resin, 20-40 parts of organic solvent, and 1-5 parts of other additives. By using silver-plated copper powder and Silver-plated glass powder replaces pure silver powder, which reduces the production cost of silver paste, but this alternative has problems such as complex process, easy oxidation, poor reliability, and difficult processing.

Method used

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  • Environment-friendly and low-filling conductive silver paste and preparation method thereof
  • Environment-friendly and low-filling conductive silver paste and preparation method thereof
  • Environment-friendly and low-filling conductive silver paste and preparation method thereof

Examples

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Effect test

Embodiment 1

[0037] An environmentally friendly, low-filling conductive silver paste, including the following raw material components in mass percentages:

[0038] Silver powder 10%;

[0039] Resin 12%;

[0040] Thickener 2%;

[0041] Additive 2%;

[0042] Thinner 74%;

[0043] Described silver powder is the flaky silver powder with smooth surface, and its average particle diameter is 5 μm, and thickness is 50nm, and described resin is phenolic resin, and described thickener is hydroxyethyl cellulose, and described additive is malonic acid, so The diluent is a dibasic acid ester.

[0044] The preparation method of conductive silver paste comprises the steps:

[0045] S1: Mix all the resin and part of the diluent at a mass ratio of 6:9, that is, mix 12wt% resin and 18wt% diluent, place at a constant temperature of 35°C for 24h and stir every 0.5h to obtain a preliminary organic carrier;

[0046] S2: Add all the thickeners to the preliminary organic vehicle in step S1, and stir for 15...

Embodiment 2

[0051] An environmentally friendly, low-filling conductive silver paste, including the following raw material components in mass percentages:

[0052] Silver powder 25%;

[0053] Resin 8.6%;

[0054] Thickener 0.1%;

[0055] Additive 1.2%;

[0056] Thinner 65.1%;

[0057] Described silver powder is the flaky silver powder with smooth surface, and its average particle diameter is 15 μm, and thickness is 100nm, and described resin is polyurethane resin, and described thickener is methyl hydroxypropyl cellulose, and described additive is propylene glycol, so The diluent is isopropanol.

[0058] The preparation method of conductive silver paste comprises the steps:

[0059] S1: Mix the resin and part of the diluent at a mass ratio of 6:14, place at a constant temperature of 45°C for 72 hours and stir once every 1 hour to obtain a preliminary organic carrier;

[0060] S2: Add the thickener to the preliminary organic vehicle in step S1, and stir for 25 minutes to obtain a unifor...

Embodiment 3

[0065] An environmentally friendly, low-filling conductive silver paste, including the following raw material components in mass percentages:

[0066] Silver powder 17.5%;

[0067] Resin 10%;

[0068] Thickener 1.1%;

[0069] Additive 1.9%;

[0070] Thinner 69.5%;

[0071] The silver powder is a smooth flaky silver powder with an average particle diameter of 10 μm and a thickness of 75nm. The resin is a phenolic resin and a polyurethane resin with a mass ratio of 8:2. The thickener is acetic acid butyric acid Cellulose and methylcellulose, the mass ratio of the two is 3:7, the additive is silane coupling agent and malonic acid, the mass ratio of the two is 1:1, and the diluent is ethanol and dibasic acid ester, the mass ratio of the two is 3:7.

[0072] The preparation method of conductive silver paste comprises the steps:

[0073] S1: Mix the resin and part of the diluent at a mass ratio of 6:12, place at a constant temperature of 40°C for 48 hours and stir once every 1...

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Abstract

The invention discloses environment-friendly and low-filling conductive silver paste, comprising the following raw materials in percentage by mass: 10-25% of silver powder, 7.6-12% of resin, 0.1-2% of thickener, 1.2-2.5% of additive and 64-74% of diluent. According to the conductive silver paste, the content of the silver powder is greatly reduced, so that the production cost is lowered; and the emission of VOC (Volatile Organic Compounds) is reduced, so the conductive silver paste is environment-friendly. The invention further discloses a preparation method of the environment-friendly and low-filling conductive silver paste. The preparation method is simple, and is safe and convenient in operation; and the prepared conductive silver paste can be widely applied in the production fields of thin film switches, intelligent packages, electronics, circuits and the like.

Description

technical field [0001] The invention relates to the field of electronic materials, in particular to an environment-friendly, low-filling conductive silver paste and a preparation method thereof. Background technique [0002] Electronic paste is a functional material formed by relying on materials, chemical industry, electronics, metallurgy and other multi-disciplinary professional technologies. base material. [0003] Silver powder is widely used in the electronic paste industry as a conductive filler because of its excellent electrical conductivity and stable chemical properties. At present, the microelectronics industry is in a stage of rapid development, and the demand for silver and other precious metals is increasingly strong. A large amount of silver powder is filled in the conductive silver paste, which leads to a gradual increase in the cost of the conductive silver paste. Therefore, a lower-cost conductive silver paste has been developed. , to meet the urgent need...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 王君石凯
Owner YUNNAN NORMAL UNIV