Conductive slurry

A technology of conductive paste and conductive metal, applied in the direction of multilayer capacitors, fixed capacitor electrodes, fixed capacitor parts, etc., can solve the problems of deterioration of cutability, insufficient removal of acidic dispersants, and increased peeling force. , to achieve the effect of inhibiting sheet erosion, inhibiting poor peeling of green sheets, and small viscosity change with time

Active Publication Date: 2016-02-10
SUMITOMO METAL MINING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the thickness of the ceramic green sheet is as thin as about 5 μm, if such sheet erosion occurs, the butyral resin in the ceramic green sheet dissolves, and the ceramic green sheet expands and dissolves. When laminating dielectric green sheets, pinholes are formed in the printed portion of the conductive paste, or delamination (delamination) occurs between the dielectric layer and the internal electrode layer during firing.
[0016] In addition, in order to improve the dispersibility of the conductive metal powder, there are also cases where an acidic dispersant such as stearic acid is added to the conductive paste (for example, refer to Patent Document 5). The acidic dispersant cannot be sufficiently removed in the drying process, and in the lamination process, when the green sheet is peeled from the PET film, the acidic dispersant remaining after printing and drying penetrates into the green sheet and imparts plasticity to it. When the sheet is green, the peeling force increases and the sheet may be damaged
In addition, since the dry film becomes soft, it may cause deterioration of cuttability

Method used

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  • Conductive slurry
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0101] As shown in Table 2, 47.0% by mass of nickel powder (Ni) having a particle size of 0.3 μm as a conductive metal powder, 11.6% by mass of barium titanate (BT) having a particle size of 0.06 μm as a ceramic powder, 20.0% by mass of the above-mentioned organic vehicle 1 and dispersant 1 composed of 0.2% by mass of acidic dispersant and 0.4% by mass of salt-based dispersant were dissolved in 20.8% by mass of organic solvent 1 to prepare a conductive paste.

Embodiment 2

[0103] As shown in Table 2, 47.0% by mass of nickel powder (Ni) having a particle size of 0.3 μm as a conductive metal powder, 11.6% by mass of barium titanate (BT) having a particle size of 0.06 μm as a ceramic powder, 20.0% by mass of the above-mentioned organic vehicle 1 and dispersant 2 composed of 0.3% by mass of acidic dispersant and 0.4% by mass of salt-based dispersant were dissolved in 20.7% by mass of organic solvent 1 to prepare a conductive paste.

Embodiment 3

[0105] As shown in Table 2, 47.0% by mass of nickel powder (Ni) having a particle size of 0.3 μm as a conductive metal powder, 11.6% by mass of barium titanate (BT) having a particle size of 0.06 μm as a ceramic powder, 20.0% by mass of the above-mentioned organic vehicle 1 and dispersant 3 composed of 0.4% by mass of acidic dispersant and 0.4% by mass of salt-based dispersant were dissolved in 20.6% by mass of organic solvent 1 to prepare a conductive paste.

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Abstract

The invention provides a conductive slurry which is used in the stacking ceramic electronic member for forming an internal electrode; the conductive slurry is a compound that does not produce sheet erosion and has viscosity that decreases along with the time change. The conductive slurry used for the stacking ceramic device contains conductive metal powder, ceramic powder, resin binder, dispersant and organic solvent. The organic solvent is formed by at least one of dihydroabietic alcohol acetate, isobornyl acetate, isobonyl propionate, butyrate isobornyl thiocyanoacetate and isobutyric acid isobornyl thiocyanoacetate. The above dispersant contains the acid dispersant with the weight being over the 0.4% of the total conductive slurry.

Description

technical field [0001] The present invention relates to a conductive paste used in laminated ceramic devices, and more specifically, to a conductive paste that does not cause sheet erosion and green sheet peeling, and has a small change in viscosity over time. Background technique [0002] As electronic devices such as mobile phones and digital devices become thinner and smaller, multilayer ceramic devices such as multilayer ceramic capacitors (Multilayered Ceramic Capacitors, hereinafter referred to as MLCC) as chip components are also expected to be miniaturized, higher in capacity, and higher in performance. . In order to realize these requirements, the most effective means is to thin the internal electrode layer and the dielectric layer to realize multilayering. [0003] MLCCs are generally manufactured in the following manner. First, barium titanate (BaTiO 3 ) and other dielectric ceramic powders and organic binders such as polyvinyl butyral to form a dielectric gree...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/008H01G4/30
Inventor 礒野修
Owner SUMITOMO METAL MINING CO LTD
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