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Modified bismaleimide resin and preparation method thereof

A bismaleimide, modified technology, applied in the field of high-performance polymers, can solve the problems of unreported dielectric properties, poor stability, etc., achieve good dispersion and interfacial force, and small grain size , the effect of good moisture resistance and mechanical properties

Active Publication Date: 2016-03-23
SUZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this study did not report work on dielectric properties; in addition, the MOF-5 used was not stable in a humid environment, and the local structure collapsed after being exposed to humid air for 2 days (see literature: JiangJ ,FengY,ChenM,etal.Synthesisandhydrogen-storageperformanceofinterpenetratedMOF-5 / MWCNTshybridcompositewithhighmesoporosity[J].InternationalJournalofhydrogenEnergy,2013,38(25):10950-10955)
[0007] In summary, the existing technology has made great progress in the research and development of high-performance resins, and obtained resin varieties that have been significantly improved in a certain performance. However, in terms of heat resistance, toughness, dielectric properties, etc. performance needs to be further improved

Method used

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  • Modified bismaleimide resin and preparation method thereof
  • Modified bismaleimide resin and preparation method thereof
  • Modified bismaleimide resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1. Preparation of amidated metal-organic frameworks

[0032] Under nitrogen protection, dissolve 0.272g of 2-aminoterephthalic acid in 62mL of N,N-dimethylformamide; add 0.724g of AlCl at a temperature of 110°C with stirring 3 ·6H 2 O, stirred until dissolved, and then kept at 110°C for 12 hours; after the reaction, naturally cooled to room temperature, filtered, washed with ethanol, and centrifuged, then activated with ethanol for 24 hours at 90°C. Vacuum drying yields amidated metal-organic frameworks. Its X-ray diffraction diagram, infrared spectrogram, SEM, TEM diagram and isothermal adsorption-desorption curve diagram are respectively shown in the attached figure 1 , 2 , 3 and 4.

[0033] 2. Preparation of modified bismaleimide resin cured product

[0034] Add 0.087g of amidated metal-organic framework prepared in step 1 of Example 1 to 37g of 2,2'-diallyl bisphenol A, and disperse with ultrasonic stirring for 30min to obtain mixture A; 50g of N,N'-4,4' - Diphe...

Embodiment 2

[0041] Preparation of Cured Product of Modified Bismaleimide Resin

[0042] Add 0.261g of the amidated metal-organic framework prepared in Example 1 to 37g of 2,2'-diallyl bisphenol A, and disperse with ultrasonic stirring for 30min to obtain mixture A; 50g of N,N'-4,4'-di Benzene bismaleimide was added to mixture A, stirred evenly, and the bismaleimide was melted at 140°C. After prepolymerization for 45 minutes, a prepolymer was obtained, and the prepolymer was vacuum degassed at 140°C for 10 minutes. , and then pour the prepolymer into the preheated mold, and then vacuum defoam at 140°C for 20min; A modified bismaleimide resin is obtained after curing and post-treatment respectively at 240° C. / 4 hours. Its dielectric constant-frequency curve, dielectric loss-frequency curve, impact strength, storage modulus-temperature change curve and bending strength refer to the attached Figure 5 , 6 , 7, 8 and 9.

Embodiment 3

[0050] 1. Preparation of amidated metal-organic frameworks

[0051] Under nitrogen protection conditions, dissolve 0.217g of 2-aminoterephthalic acid in 31mL of N,N-dimethylformamide; at a temperature of 110°C and stirring conditions, add 0.724g of AlCl 3 ·6H 2 O, stirred for 4 hours, and kept at a temperature of 110°C for 12 hours; after the reaction, naturally cooled to room temperature, filtered, washed with ethanol, and centrifuged; then activated with ethanol for 22 hours at 90°C, and freeze-dried to obtain Aminated metal-organic frameworks.

[0052] 2. Preparation of modified bismaleimide resin cured product

[0053] Add 0.080 g of the amidated metal-organic framework prepared in step 1 of Example 3 to 30 g of 2,2'-diallyl bisphenol A, and disperse with ultrasonic stirring for 30 minutes to obtain mixture A; 50 g of N,N'-4, Add 4'-diphenylmethane bismaleimide to mixture A, stir evenly, and melt the bismaleimide at 130°C. After prepolymerization for 45 minutes, a prepo...

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Abstract

The invention discloses modified bismaleimide resin and a preparation method of the modified bismaleimide resin. The preparation method comprises the steps of dissolving a 2-aminoterephthalic acid in N,N-dimethyl formamide, carrying out activating treatment by using alcohol after a reaction is carried out by adding AlCl3.6H2O, and obtaining an amination metal organic framework; then mixing the amination metal organic framework with a diallyl phenyl compound, adding bismaleimide, and obtaining the modified bismaleimide resin through solidification and after-treatment. According to the modified bismaleimide resin disclosed by the invention, the amination metal organic framework is small in duct size and low in specific surface area, a cavity structure is enabled to be reserved in the modified bismaleimide resin, and low-dielectric constants are facilitated to be obtained; good moisture resistance and good mechanical property of the modified bismaleimide resin are ensured; meanwhile, the metal organic framework carries aminos, hydroxyls and carboxyls and has a good reactivity and a good physical interaction with bismaleimide, a good dispersing and interface force is obtained by the metal organic framework in resin, the polarity density in cured resin is reduced, and the dielectric loss is facilitated to be reduced.

Description

technical field [0001] The invention relates to a thermosetting resin and a preparation method thereof, in particular to a modified bismaleimide resin and a preparation method thereof, and belongs to the technical field of high-performance polymers. Background technique [0002] With the rapid development of technology in the new generation of microelectronics industry, the demand for high-performance resins is increasing. In addition to the requirements of high heat resistance and high toughness, more requirements are put forward for low dielectric constant and low dielectric loss. Require. Bismaleimide (BMI) resin is one of the typical representatives of heat-resistant thermosetting resins, however, its toughness and dielectric properties need to be further improved. [0003] Generally, the dielectric constant of polymers can be reduced by reducing the polar density of molecules. Since the dielectric constant of air is 1, introducing porous materials or porogens into pol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/12
CPCC08G73/12
Inventor 梁国正韩贤超顾嫒娟袁莉
Owner SUZHOU UNIV
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