Carbon fiber-reinforced resin composition, pellets, molded product, and housing for electronic equipment

A resin composition and carbon fiber technology, applied in the fields of electronic equipment housings and molded products, can solve the problems of decreased mechanical properties, difficulty, easy deterioration of thermal stability of polyamide resin, etc., and achieve excellent thin-wall formability and good surface appearance. , the effect of excellent water absorption properties

Inactive Publication Date: 2018-01-16
TORAY IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to achieve the same rigidity as metal, it is necessary to fill a high degree of fibrous filler, but in the case of using glass fiber, it is necessary to compound a large amount significantly, and it is actually difficult to achieve the same rigidity as metal
On the other hand, when carbon fiber is used, mechanical properties such as rigidity are significantly improved compared with glass fiber, but molded products highly filled with carbon fiber will have wavy unevenness even with high gloss, so it is difficult to balance mechanical properties and surface appearance
Furthermore, in order to mix a large amount of carbon fiber, there are problems such as: the carbon fiber is broken and the mechanical properties are lowered due to the shear during melt kneading, and the polyamide resin is easily deteriorated and thermal stability is lowered due to the shear heat generated by a large amount of carbon fiber. Low fluidity, difficulty in thin-wall molding, etc.

Method used

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  • Carbon fiber-reinforced resin composition, pellets, molded product, and housing for electronic equipment
  • Carbon fiber-reinforced resin composition, pellets, molded product, and housing for electronic equipment
  • Carbon fiber-reinforced resin composition, pellets, molded product, and housing for electronic equipment

Examples

Experimental program
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Effect test

Embodiment

[0145] In order to demonstrate this invention more concretely, although an Example and a comparative example are given and demonstrated below, this invention is not limited to these Examples. In addition, various characteristics in the examples were evaluated by the following methods.

[0146] (1) Intrinsic viscosity of polyamide resin

[0147] 0.1 g of polyamide resin was dissolved in 50 mL of 98% sulfuric acid solution, and the flow-down seconds of the sample solution were measured at 30°C±0.05°C using an Ubbelohde viscometer, and the intrinsic viscosity was calculated based on the following formula.

[0148] [η]=η SP / [C(1+0.205η SP )], η SP =(t-t 0 ) / t 0

[0149] In the above formula, [η] represents intrinsic viscosity (dL / g), and η SP Represents the specific viscosity, C represents the sample concentration (g / dL), t represents the flow of the sample solution in seconds (seconds), t 0 Indicates the number of seconds (seconds) for the flow of sulfuric acid.

[0150...

manufacture example 1

[0192] (Production example 1) Production of polyamide resin (A-1)

[0193] A mixture of 4,539.3 g (27.3 moles) of terephthalic acid, (a) 1,9-nonanediamine and (b) 2-methyl-1,8-octanediamine [(a) / (b)=50 / 50 (molar ratio)] 4,478.8g (28.3 moles), benzoic acid 101.6g (0.83 moles), sodium hypophosphite monohydrate 9.12g (0.1% by mass relative to the total mass of raw materials) and 2.5 liters of distilled water were put into Nitrogen replacement was performed in an autoclave with an inner volume of 20 liters. This mixture was stirred at 100° C. for 30 minutes, and the temperature inside the autoclave was raised to 220° C. over 2 hours. At this time, the pressure inside the autoclave was increased to 2 MPa. After continuing the reaction in this way for 2 hours, the temperature was raised to 230° C., and then the temperature was maintained at 230° C. for 2 hours, and the water vapor was gradually drawn out to react while maintaining the pressure at 2 MPa. Next, the pressure was lo...

manufacture example 2

[0195] (Production example 2) Production of polyamide resin (A-2)

[0196] In Production Example 1, the polyamide resin (A-2) having a melting point of 262° C. and an intrinsic viscosity of 0.52 dL / g was produced by only changing the solid-phase polymerization time to 2 hours.

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Abstract

A carbon fiber-reinforced resin composition is prepared by blending (B) 60-200 parts by weight of carbon fiber and (C) 0.01-10 parts by weight of dendritic polyester with respect to 100 parts by weight of (A) semi-aromatic polyamide resin , the melting point of the semi-aromatic polyamide resin is 220-300°C, which is obtained by polycondensation of dicarboxylic acid and diamine, and the dicarboxylic acid contains 60-100 mol% of para- Phthalic acid, wherein the diamine contains a total of 60-100 mole % of 1,9-nonanediamine and / or 2-methyl-1,8-octanediamine in the total amount of diamines. A pellet. A molding. An electronic equipment casing. The present invention provides a carbon fiber-reinforced resin composition, pellets, and a thin-wall molded product for an electronic device case obtained by injection molding the same, the carbon fiber-reinforced resin composition has thermal stability, retention stability, fluidity, and thin-wall molding It has excellent rigidity, a metal-equivalent level of rigidity, excellent surface appearance and water absorption characteristics, and a molded product with reduced warpage can be obtained.

Description

technical field [0001] The present invention relates to a carbon fiber-reinforced resin composition, a pellet obtained by molding the pellet, a molded article obtained by injection molding the pellet, and an electronic device case. Background technique [0002] Polyamide resins are used in various fields such as electrics / electronics, automobiles, machinery, and building materials due to their excellent mechanical properties such as rigidity and strength, and heat resistance. Recently, the use of resin as a substitute for metal has been promoted, and mechanical properties such as rigidity and strength at the same level as metal are required for resin. In particular, home appliance components such as casings of electronic equipment represented by OA equipment such as personal computers and mobile phones are required to have excellent surface appearance, low water absorption, and thinner walls. Therefore, not only mechanical properties are required for materials, but also It ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/06C08G69/26C08K7/06C08L67/00
CPCC08L77/06C08G69/265C08K7/06C08L67/02B29B7/90B29B9/12B29B9/14C08J5/042C08K3/30C08K5/09C08K7/02
Inventor 服部公彦玉井晃义歌崎宪一
Owner TORAY IND INC
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