Metal patterning method

Abstract

The invention discloses a metal patterning method. The metal patterning method comprises the following steps: A) providing an imprinting plate with a preset micro-nano pattern structure; B) forming an anti-adhesion layer and a metal film layer in sequence on the imprinting plate; C) providing a substrate, and making the substrate come into contact with the imprinting plate being subjected to the step B) under a predetermined pressure and at a predetermined temperature; and D) separating the imprinting plate obtained in the step A) from the substrate to transfer the metal film layer onto the substrate in order to form a nano-metal structure on the substrate. According to the metal patterning method disclosed by the invention, the imprinting plate provided with a structural body of which a side wall is indent is utilized, so that the edge roughness of the nano-metal structure transferred onto the substrate can be reduced effectively, and metal patterning in a vacuum environment can be realized. Moreover, the metal patterning method is high in accuracy and simple in process; the cost of metal patterning, particularly metal nano-structure patterning is lowered greatly; and meanwhile the machining efficiency can be increased.

Description

technical field [0001] The invention belongs to the technical field of micro-nano processing, and in particular relates to a metal patterning method. Background technique [0002] Patterning is one of the most important technologies in the field of micro-nano processing technology. Among them, metal patterning is extremely important for preparing electrodes, realizing optical interconnection and forming etching masks. The metal patterning technology in the prior art generally adopts the technology of optical exposure and development to define the pattern, and forms the pattern by etching. This technique uses a lot of organic reagents, which is difficult to apply to organic electronic devices. In addition, this liquid-phase process technology cannot meet the demand for patterning technology in a vacuum environment. Considering the high-efficiency preparation of nanostructures, common optical exposure techniques are also limited by precision. [0003] Microcontact pattern t...

AI Technical Summary

Problems solved by technology

However, the micro-contact pattern transfer technology in the prior art mostly uses a single layer of organic chemical molecules to coat the imprinted sample to improve the adhesion of the metal film or a single layer of organic chemical molecules to coat the metal film on the embossed plate to form a pattern. etch mask, but this will destroy the direct contact between the metal and the imprinted sample, increasing the contact resistance, and the latter also has the problem of surface diffusion of the monolayer of organic chemical molecules, which affects the accuracy of the pattern

In addition, the graphics on the embossed plates used in these technologies have a positive mesa structure, which is suitable for the transfer of three-dimensional graphics, but greatly increases the edge roughness of the imprinted graphics

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