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Graphite sheet, method for producing same, laminated board for wiring, graphite wiring material, and method for producing wiring board

A manufacturing method and technology of graphite flakes, applied in the direction of graphite, graphene, and other household appliances, can solve the problems of the main body not working normally, accelerated temperature rise, melting fracture, etc.

Active Publication Date: 2016-05-11
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Problems have been reported in smartphones in which communication is interrupted due to heat generation due to long-term use, or the main body does not work normally
In addition, copper wires have a problem that the resistance value of the copper wire increases due to the increase in resistance value as the temperature rises (so-called temperature characteristics of metals), so that the Joule heat generated by the flow of current increases the resistance value of the copper wire, This further accelerates the temperature rise, resulting in melting fracture
In this way, the use of graphite film itself as a wiring material has not yet been realized.

Method used

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  • Graphite sheet, method for producing same, laminated board for wiring, graphite wiring material, and method for producing wiring board
  • Graphite sheet, method for producing same, laminated board for wiring, graphite wiring material, and method for producing wiring board
  • Graphite sheet, method for producing same, laminated board for wiring, graphite wiring material, and method for producing wiring board

Examples

Experimental program
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Effect test

Embodiment

[0235] (first option)

[0236] Examples related to the first aspect are shown below, and the embodiment of the first aspect of the present invention will be described in more detail. Of course, the first solution of the present invention is not limited by these examples, and there can be various solutions for the details.

[0237] (Physical property evaluation method)

[0238]

[0239] There is an error of about ±5 to 10% in the thickness of the polymer film and the graphite sheet used as raw materials. Therefore, let the 10-point average thickness of the obtained film and sheet be the thickness of the sample in the 1st aspect of this invention.

[0240]

[0241] The average crystal grain size of graphite in the first aspect of the present invention is calculated by the following method using the electron backscattering diffraction image method (EBSD). That is, the measurement is performed by irradiating an electron beam to a graphite sheet installed in a lens barrel of...

manufacture example A-1

[0251] Mix 20 g of acetic anhydride and isoquinoline in 100 g of 18 mass % DMF solution of polyamic acid synthesized with pyromellitic anhydride and 4,4'-diaminodiphenyl ether at a molar ratio of 1 / 1. The curing agent composed of 10g was stirred, degassed by centrifugal separation, and then cast and coated on aluminum foil. From stirring to defoaming, proceed while cooling to 0°C. The laminate of the aluminum foil and the polyamic acid solution was heated at 120°C for 150 seconds, and at 300°C, 400°C, and 500°C for 30 seconds each, and then the aluminum foil was removed to prepare a polyimide film (polymer sample A). In addition, in the same manner as sample A, pyromellitic anhydride and p-phenylenediamine were used as raw materials, and a polyimide film (polymer sample B) and 3,3',4,4'-biphenyl tetra Formic dianhydride and p-phenylenediamine were used as raw materials to produce a polyimide film (polymer sample C). Regarding the thickness of the polyimide film, several typ...

Embodiment A-1～8

[0253] Eight types of polyimide films (polymer sample A: area 400 mm) prepared in Production Example A-1 with a thickness in the range of 18 μm to 100 nm were prepared in nitrogen gas using an electric furnace at a rate of 10° C. / min. 2 ) is heated up to 1000°C, and kept at 1000°C for 1 hour for pretreatment. Next, the obtained carbonized sheet was placed inside a cylindrical graphite heater, and the temperature was raised to a treatment temperature (maximum temperature) of 3000° C. at a temperature increase rate of 20° C. / min. This temperature was kept at this temperature for 30 minutes (treatment time), and then the temperature was lowered at a rate of 40° C. / min to produce a graphite sheet. The treatment was performed under a pressure of 0.15 MPa in an argon atmosphere. Due to the different ratios of shrinkage and expansion due to different thicknesses, the area of ​​the obtained graphite sheet is not constant, but they are all within 169mm 2 ~361mm 2 In the range. The ...

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PUM

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Abstract

The present invention is firstly a graphite sheet having a thickness of 9.6 [mu]m or less and more than 50 nm and a thermal conductivity along the a-b plane direction at 25 DEG C of 1950 W / mK or more. The present invention is secondly a graphite sheet having a thickness in a range of less than 9.6 [mu]m and 20 nm or more, an area of 9 mm2 or more, and a carrier mobility along the a-b plane direction at 25 DEG C of 8000 cm2 / V.sec or more.

Description

technical field [0001] The present invention includes a first aspect and a second aspect, and will be described below in order of the first aspect and the second aspect. [0002] (first option) [0003] A first aspect of the present invention relates to a graphite sheet having a thermal conductivity larger than the limit value of the thermal conductivity in the a-b plane direction of graphite known so far, and a method for producing the same. [0004] (plan B) [0005] A second aspect of the present invention relates to a new graphite sheet having high carrier mobility characteristics, preferably a current density resistance characteristic exceeding that of conventional copper wiring, its manufacturing method, a laminated sheet for wiring, and a graphite wiring material and a method of manufacturing a wiring board. Background technique [0006] (Background Art Related to the First Scheme) [0007] In recent years, with the installation of high-performance chipsets, the d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B31/04
CPCB32B9/007B32B9/045B32B27/20B32B27/281B32B27/34B32B2307/206B32B2307/302B32B2457/00C01B32/20C01B32/205C01B32/21B32B2307/202C01B2204/04C01B2204/24C01B2204/32H05K1/0296H05K1/0306H05K1/0353H05K1/09H05K3/027H05K3/4611
Inventor 多多见笃村上睦明立花正满
Owner KANEKA CORP
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