Method for manufacturing single-layer diamond grinding wheel in laser brazing manner

A single-layer diamond and manufacturing method technology, applied in the direction of welding media, manufacturing tools, welding equipment, etc., can solve problems such as unusable, reduced production efficiency, graphitization of diamond particles, etc., to avoid graphitization, reduce thermal damage, increase The effect of wettability

Active Publication Date: 2016-06-01
启东蓝威金刚石科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Laser brazing is easy to realize the production of tools with small batches and large sizes. However, when the diamond is brazed in the air, the diamond particles will be severely graphitized due to the presence of oxygen, which will reduce the mechanical properties of the diamond and reduce the life of the diamond tool. , or even unusable, so laser brazing needs to be protected by a protective ...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] (1) The matrix of the required diamond grinding wheel is prepared by machining, and 65Mn steel is selected as the matrix of the grinding wheel, and the matrix is ​​degreased and derusted.

[0021] (2) Use NiCrBSi, CuPSn, TiH with a purity exceeding 99.9% by mass 2 , and its mass percentage composition is: NiCrBSi is 20%; CuPSn is 75%; TiH 2 5%, mixed in proportion to make composite solder. The mass percentage of NiCrBSi alloy powder is composed of: C is 0.6-1.2%, Cr is 12-15%, B is 2.5-4.5%, Si is 3-4.5%, and Ni is 75-81%. The mass percentage of CuPSn is composed of: P is 5-6%, Sn is 2-3%, and Cu is 91-93%.

[0022] (3) Mix the composite solder and the pressure-sensitive adhesive at a weight ratio of 1:2.5 to make a solder slurry.

[0023] (4) Coating: The diamond particle size is 280-320 μm, and the solder slurry is evenly coated and fixed on the surface of the grinding wheel steel substrate. The thickness of the coated solder slurry is 100% of the average particle ...

Embodiment 2

[0028] (1) Prepare the substrate of the required diamond grinding wheel by machining, select 45 steel as the substrate of the grinding wheel, and degrease and derust the substrate.

[0029] (2) Use NiCrBSi, CuPSn, TiH with a purity exceeding 99.9% by mass 2 , and its mass percentage composition is: NiCrBSi is 25%; CuPSn is 70%; TiH 2 5%, mixed in proportion to make composite solder. The mass percentage of NiCrBSi alloy powder is composed of: C is 0.6-1.2%, Cr is 12-15%, B is 2.5-4.5%, Si is 3-4.5%, and Ni is 75-81%. The mass percentage of CuPSn is composed of: P is 5-6%, Sn is 2-3%, and Cu is 91-93%.

[0030] (3) Mix the composite solder and the pressure-sensitive adhesive at a weight ratio of 1:2.6 to make a solder slurry.

[0031] (4) Coating: The diamond particle size is 120-150 μm, and the solder slurry is evenly coated and fixed on the surface of the grinding wheel steel substrate. The thickness of the coated solder slurry is 95% of the average particle size of the dia...

Embodiment 3

[0036] (1) Prepare the substrate of the required diamond grinding wheel by machining, select 45 steel as the substrate of the grinding wheel, and degrease and derust the substrate.

[0037] (2) Use NiCrBSi, CuPSn, TiH with a purity exceeding 99.9% by mass 2 , and its mass percentage composition is: NiCrBSi is 18%; CuPSn is 80%; TiH 22%, mixed in proportion to make composite solder. The mass percentage of NiCrBSi alloy powder is composed of: C is 0.6-1.2%, Cr is 12-15%, B is 2.5-4.5%, Si is 3-4.5%, and Ni is 75-81%. The mass percentage of CuPSn is composed of: P is 5-6%, Sn is 2-3%, and Cu is 91-93%.

[0038] (3) Mix the composite solder and the pressure-sensitive adhesive at a weight ratio of 1:2.3 to make a solder slurry.

[0039] (4) Coating: The diamond particle size is 280-320 μm, and the solder slurry is evenly coated and fixed on the surface of the grinding wheel steel substrate. The thickness of the coated solder slurry is 95% of the average particle size of the diam...

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Abstract

The invention relates to a method for brazing single-layer diamond tools, and belongs to the field of manufacturing of superhard material tools. NiCrBSi, CuPSn and TiH2 are mixed to serve as brazing filler metal, TiH2 is decomposed in the laser heating process to generate H2 in real time, and diamond graphitization in the high-temperature brazing process is avoided. Therefore, the single-layer diamond tools are suitable for being brazed with laser beams in air, and high-strength connection between a diamond and a steel substrate can be achieved. A thin layer of carbide is formed on the surface of the diamond after brazing, the hot loss of the Cu-based brazing filler metal on the diamond is small, and the Cu-based brazing filler metal can be used for manufacturing the small-batch and large-size diamond tools. Multiple kinds of alloyed brazing filler metal are mixed, so that the cost of the brazing filler metal is greatly reduced; and ingredient regulation and control are convenient, so that the diamond tools meet the machining requirements of different working conditions and materials.

Description

technical field [0001] The invention belongs to the field of diamond tool manufacture, in particular to the manufacturing technology of brazing single-layer diamond tools. Background technique [0002] At present, diamond tools are mostly used in processing hard and brittle materials. Among them, brazed single-layer diamond tools have excellent characteristics such as high abrasive grain holding strength, high abrasive exposure, sharp tools, high effective utilization of abrasives, and long service life. They have a wide range of applications. application. In addition, the brazing process is basically non-polluting to the environment, so brazed diamond tools are widely regarded as the best replacement for electroplated tools. [0003] Brazing mostly uses Ni, Ag, Cu-based alloyed solder containing active elements (such as Cr, Ti, V, W). Alloyed solder has the advantages of uniform composition and low melting point, but brazing single-layer diamond tools Powdered brazing fil...

Claims

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Application Information

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IPC IPC(8): B24D18/00B23K1/005B23K35/30
CPCB23K1/0056B23K35/302B24D18/009
Inventor 卢金斌马明星王广勋殷振刘威朱其新张旺玺齐文春齐芳娟曹自洋
Owner 启东蓝威金刚石科技有限公司
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