Method for manufacturing patterned metal film based on poly-dopamine and product thereof

Abstract

The invention discloses a method for manufacturing a patterned metal film based on poly-dopamine and a product thereof. The manufacture method comprises the steps that first, a clean substrate is dipped in a dopamine solution with the pH value of 6-9 and the concentration of 0.1-10 mg/ml till a poly-dopamine film is formed on the surface of the substrate; the substrate is taken out, is washed with water and then is blow-dried with nitrogen, so that the substrate adhered with the poly-dopamine film is obtained; then a photomask is placed on the substrate adhered with the poly-dopamine, and then the substrate is radiated for 3-15 minutes in the ultraviolet light with the intensity of 10-35 mw/cm<2>, is cleaned with double distilled water, and is blow-dried with nitrogen, so that a substrate with an ultraviolet oxidized poly-dopamine is obtained; and finally metal ions are deposited on the substrate with the ultraviolet oxidized poly-dopamine. The method disclosed by the invention is applicable to any solid materials which can be both planar substrates and curved or porous surface substrates, and different pattered metal films can be manufactured; and the manufactured patterned metal films can be applied to microcircuits, microarrays and bioinstrumentation.

Description

technical field [0001] The invention belongs to the field of electrical components, and in particular relates to a polydopamine-based method for preparing a patterned metal thin film, and also relates to a patterned metal thin film prepared by the method. Background technique [0002] Patterned metal thin films play an important role as electrodes, contacts or connecting lines in various new portable electronic devices. In the traditional microelectronics industry, photolithography and magnetron sputtering are usually used to prepare patterned metal films. This method has high precision, but the cost is high, the cycle is long, and large-scale equipment is required. More importantly, this method is only applicable With a few inorganic hard substrate materials such as silicon wafers, glass, quartz, etc.; another commonly used method is based on printing technology, but this type of technology also needs to treat the surface of the substrate to ensure the printing of metal and...

AI Technical Summary

Problems solved by technology

In the traditional microelectronics industry, photolithography and magnetron sputtering are usually used to prepare patterned metal films. This method has high precision, but it is expensive, long-term, and requires large-scale equipment support. More importantly, this method is only applicable With a few inorganic hard substrate materials such as silicon wafers, glass, quartz, etc.; another commonly used method is based on printing technology, but this type of technology also needs to treat the surface of the substrate to ensure the printing of metal and substrate. Adhesion strength and stability. In many cases, it is necessary to perform post-treatments such as heating annealing, chemical reduction, and light on the printed substrate to improve the adhesion strength and the conductivity of the metal film.

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