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Tin-bismuth alloy plating technology

An electroplating process, tin-bismuth alloy technology, applied in the field of tin-bismuth alloy electroplating process, can solve the problems affecting pure tin coating function, lead poisonous environment pollution, short circuit of electronic components, etc. Stable, easy-to-handle effects

Inactive Publication Date: 2016-06-22
ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The tin-lead alloy coating has good solderability, lead can inhibit the growth of tin whiskers in the coating, etc. The disadvantage is that lead is toxic and pollutes the environment
The pure tin coating has good solderability, low cost, single metal plating, relatively simple process management, and easy environmental protection for wastewater treatment. However, as the use time increases, tin whiskers will gradually grow on the pure tin coating, affecting the function of the pure tin coating, and even Can cause short circuit when electronic components are energized

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] a. Carry out degreasing and activation treatment on the base material;

[0026] b. Plating a pure tin layer on the treated substrate, using Sn 2+ 50g / l, methanesulfonic acid 1N, PF-05M 20ml / L plating solution with a current density of 10A ampere / square decimeter, electrodeposition time of 100 seconds, and then wash and dry with deionized water;

[0027] c. Plating a tin-bismuth layer on the pure tin layer, use 50g / l Sn 2+ , 3g / l Bi 3+ , methanesulfonic acid 1N, 20ml / L PF-05M plating solution, with a current density of 10A ampere / square decimeter, electrodeposition time 45 seconds, then rinse with deionized water and dry;

[0028] d. Neutralize and wash with hot water, then dry.

[0029] The total film thickness of the pure tin layer and the tin-bismuth coating in Example 1 is 7.5 μm, wherein the bismuth layer accounts for 5% of the total film thickness, and the coating has no tin whiskers.

Embodiment 2

[0031] a. Carry out degreasing and activation treatment on the base material;

[0032] b. Plating a pure tin layer on the treated substrate, using Sn 2+ 55g / l, methanesulfonic acid 1.5N, PF-05M30ml / L plating solution with a current density of 8A ampere / square decimeter, electrodeposition time of 150 seconds, and then wash and dry with deionized water;

[0033] c. Plating a tin-bismuth layer on the pure tin layer, use 55g / l Sn 2+ , 4g / l Bi 3+ , methanesulfonic acid 1.5N, PF-05M plating solution of 30ml / L, with a current density of 8A ampere / square decimeter, electrodeposition time of 60 seconds, and then wash and dry with deionized water;

[0034] d. Neutralize and wash with hot water, then dry.

[0035] The total film thickness of the pure tin layer and the tin-bismuth coating in Example 2 is 10.0 μm, wherein the bismuth layer accounts for 8% of the total film thickness, and no tin whiskers are formed in the coating.

Embodiment 3

[0037] a. Carry out degreasing and activation treatment on the base material;

[0038] b. Plating a pure tin layer on the treated substrate, using Sn 2+ 60g / l, methanesulfonic acid 2N, PF-05M40ml / L plating solution with a current density of 5A ampere / square decimeter, electrodeposition time 75 seconds, and then wash and dry with deionized water;

[0039] c. Plating a tin-bismuth layer on the pure tin layer, using 60g / l Sn 2+ , 4g / l Bi 3+ , methanesulfonic acid 2N, PF-05M plating solution of 40ml / L, with a current density of 5A ampere / square decimeter, electrodeposition time of 30 seconds, and then rinse and dry with deionized water;

[0040] d. Neutralize and wash with hot water, then dry.

[0041] The total film thickness of the pure tin layer and the tin-bismuth coating in Example 3 is 9.35 μm, wherein the bismuth layer accounts for 10% of the total film thickness, and the coating has no tin whiskers.

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Abstract

The invention discloses a tin-bismuth alloy electroplating process. A tin-bismuth coating is plated on the pure tin coating of a plated part. The mass ratio of tin and bismuth in the tin-bismuth coating bath is 94:6. The pure tin layer and the tin-bismuth coating The total film thickness of the tin-bismuth coating is 7.5-12.5 μm, wherein the bismuth layer accounts for 5-10% of the total film thickness. The present invention adds a tin-bismuth layer on the basis of the pure tin layer, so that the obtained Sn-Bi alloy coating is uniform and dense, bright, has excellent bonding force and brazing property, and the tin-bismuth alloy coating of the present invention can not only prevent the formation of tin whiskers and The transformation of gray tin has higher quality and is non-toxic and environmentally friendly. The plating solution of the invention is stable, easy to operate, environmentally friendly and non-toxic.

Description

【Technical field】 [0001] The invention relates to a tin-bismuth alloy electroplating process, which belongs to the technical field of electroplating. 【Background technique】 [0002] Tin element symbol Sn, is a kind of slightly bluish white glossy low-melting metal element, it is one of the famous "hardware" gold, silver, copper, iron, tin. Tin is a silver-white soft metal with a specific gravity of 7.3, a melting point of 231.89°C and a boiling point of 2260°C. Tin is widely used in the manufacture of tin alloys, electroplating, and daily life. [0003] Tin and tin alloy plating have excellent corrosion resistance, ductility, conductivity, solderability and decoration, and are widely used in electronics, connectors, etc. At present, tin and tin alloy coatings mainly include: pure tin, tin-lead, tin-copper, tin-silver, tin-zinc, etc., and the systems of potions include sulfuric acid system, fluoroborate and sulfonic acid system, etc. Among them, the fluoroborate system tin...

Claims

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Application Information

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IPC IPC(8): C25D5/10C25D3/30C25D3/60
CPCC25D5/10C25D3/30C25D3/60
Inventor 刘国强徐卉军
Owner ACKOTEC ZHONGSHAN ELECTRONICS PARTS
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