A method for increasing the coercive force of sintered NdFeB by infiltrating heavy rare earth by magnetron sputtering
A magnetron sputtering, heavy rare earth technology, applied in sputtering coating, inductor/transformer/magnet manufacturing, magnetic objects and other directions, can solve the problems of poor temperature stability, affecting normal use, low Curie temperature, etc. The thickness can be precisely controlled, the utilization rate can be improved, and the waste can be reduced.
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Embodiment 1
[0042] Example 1 After sputtering a Tb heavy rare earth layer on the surface of a 1.8mm thick 52H magnet, conduct grain boundary diffusion heat treatment
[0043] A commercial magnet 52H is selected, the magnet size is 40mm x 20mm x 2mm. After the magnet has been degreased and derusted, it is put into the magnetron sputtering vacuum chamber, and the vacuum is pumped to 1.0×10 -3 Pa, pass high-purity Ar gas to activate surface ions: adjust the working pressure to 6×10 -2 Pa, anode voltage 150V, anode current 1.0A, activation 5min. Subsequently, a 3 μm Tb heavy rare earth layer was deposited on the surface of the 52H magnet by DC magnetron sputtering: the working pressure was 0.1 Pa, and the target power density of the sputtering target was 5 W / cm 2 , the target head and the horizontal plane are 60°, the target-base distance is 12cm, and the deposition time is 1.5h. Put the magnet deposited with Tb layer into the furnace, and evacuate to (1~3)×10 -3 Pa, slowly heated to 900°...
Embodiment 2
[0047] Example 2 After sputtering a Tb heavy rare earth layer and a Cr barrier layer on the surface of a 4mm thick 42SH magnet, conduct grain boundary diffusion heat treatment
[0048] A commercial magnet 42SH is selected, and the magnet size is 40mm x 20mm x 4mm. After the magnet has been degreased and derusted, it is put into the magnetron sputtering vacuum chamber, and the vacuum is pumped to 1.0×10 -3 Pa, pass high-purity Ar gas to activate surface ions: adjust the working pressure to 6×10 -2 Pa, anode voltage 150V, anode current 1.0A, activation 5min. Subsequently, a 3 μm Tb heavy rare earth layer was deposited on the surface of the 42SH magnet by DC magnetron sputtering: the working pressure was 0.1Pa, and the target power density of the sputtering target was 5W / cm 2 , the target head and the horizontal plane are 60°, the target-base distance is 12cm, and the deposition time is 1.5h. Then deposit a Cr barrier layer of about 1 μm on the surface of the 42SH magnet depos...
Embodiment 3
[0052] Example 3 The surface of a 10mm thick 45H magnet is sputtered with a Dy heavy rare earth layer and then heat-treated by grain boundary diffusion
[0053] Select a commercially available magnet 45H with a magnet size of After the magnet has been degreased and derusted, it is put into the magnetron sputtering vacuum chamber, and the vacuum is pumped to 1.0×10 -3 Pa, pass high-purity Ar gas to activate surface ions: adjust the working pressure to 6×10 -2 Pa, anode voltage 150V, anode current 1.0A, activation 5min. Deposit the Dy heavy rare earth layer on the surface of the 45H magnet by DC magnetron sputtering: the working pressure is adjusted to 0.1Pa, and the target power density of the sputtering target is 5W / cm 2 , the target head is 60° to the horizontal plane, the target-base distance is 12cm, and the deposition time is 5h. Put the magnet into the furnace and evacuate to (1-3)×10 -3 Pa, slowly heat to 900°C, keep warm for 10h, cool to room temperature, heat agai...
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