Preparation method of liquid light-cured solder resist ink and photosensitive resin thereof

A technology of solder mask ink and photosensitive resin, which is applied in the direction of ink, optical mechanical equipment, photoplate making process of pattern surface, etc. Good adhesion, good anti-acid effect
CN105778618AActive Publication Date: 2016-07-20SHANGHAI PHICHEM MATERIAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI PHICHEM MATERIAL CO LTD
Publication Date
2016-07-20

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Abstract

The invention relates to a preparation method of a liquid light-cured solder resist ink and photosensitive resin thereof, and relates to the technical field of printed circuit board solder resist ink. According to the preparation method of the photosensitive resin in the solder resist ink, acrylic acid and epoxy resin are first subjected to a ring-opening reaction, such that an intermediate epoxy acrylate is obtained; the epoxy acrylate is subjected to a ring-opening reaction with anhydride, such that carboxylation-modified epoxy acrylate resin is obtained. The epoxy resin which is subjected to the ring-opening reaction with acrylic acid is at least one selected from E12, E12A, E13, E14, ECN268, ECN273 and ECN280. Because the carboxylation-modified epoxy acrylate resin has good light curing capacity and appropriate diluted alkali water solubility, the liquid light-cured solder resist ink with the carboxylation-modified epoxy acrylate resin as photosensitive resin has relatively high resolution, and can resolve lines under 40mum. Also, the solder resist ink provided by the invention also has good adhesion to substrates, good acid resistance, good alkali resistance and good solvent resistance.
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Description

technical field

[0001] The invention relates to a liquid photocurable solder resist ink and a preparation method thereof, belonging to the technical field of solder resist ink for printed circuit boards. Background technique

[0002] Solder resist ink is one of the key materials of printed circuit boards (PCB). Its main function is to cover the lines that do not need to be soldered on the surface of the circuit board to prevent short circuit and oxidation during soldering.

[0003] Commonly used solder resist inks mainly include liquid heat-curable solder resist inks and liquid light-curable solder resist inks. The liquid photocurable solder resist ink mainly includes carboxylated modified epoxy acrylate resin (component A) and epoxy resin (component B), which are coated on the etched circuit board and preheated to remove the solvent , exposed through a mask to obtain a photocurable latent image, developed by a dilute alkali aqueous solution, and then heated and cured at a ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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