Preparation method of liquid light-cured solder resist ink and photosensitive resin thereof

A technology of solder mask ink and photosensitive resin, which is applied in the direction of ink, optical mechanical equipment, photoplate making process of pattern surface, etc. Good adhesion, good anti-acid effect

Active Publication Date: 2016-07-20
SHANGHAI PHICHEM MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the process of realizing the present invention, the inventors found that there are at least the following problems in the prior art: the existing solder resist ink has low resolution and is not suitable for making high-precision circuit boards

Method used

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  • Preparation method of liquid light-cured solder resist ink and photosensitive resin thereof
  • Preparation method of liquid light-cured solder resist ink and photosensitive resin thereof
  • Preparation method of liquid light-cured solder resist ink and photosensitive resin thereof

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preparation example Construction

[0066] Since the properties of the photosensitive resin affect the properties of the solder resist ink, the second aspect of the present invention provides a method for preparing the photosensitive resin in the liquid photocurable solder resist ink of the first aspect of the present invention, making acrylic acid, acid anhydride and initial epoxy Resin fully reacts, and described preparation method comprises the following steps:

[0067] Step (1), at 75 ℃~85 ℃, epoxy resin is dissolved in the solvent, then add acrylic acid, catalyst and polymerization inhibitor, the mol ratio of the epoxy group of described acrylic acid and epoxy resin is (0.80~ 1.20): (0.80~1.20), heat up to 95°C~115°C for reaction until the acid value is lower than 2mgKOH / g, terminate the reaction to obtain an intermediate product of epoxy acrylate; The resin is selected from at least one of E12, E12A, E13, E14, ECN268, ECN273, ECN280;

[0068] Step (2), according to the hydroxyl molar ratio of acid anhydri...

Embodiment 1

[0083] Step (1), in a 1000mL four-necked bottle equipped with a stirrer, a condenser, and a thermometer, add 200.00g of CYD-012 epoxy resin and 140.94g of diethylene glycol monoethyl ether acetate at 80°C, and stir until the epoxy resin Add 20.45g of acrylic acid after dissolving completely, account for reaction system (epoxy resin, diethylene glycol monoethyl ether acetate, acrylic acid) mass ratio is 2% catalyst triphenylphosphine and 0.01% polymerization inhibitor 2,6-di tert-butyl-4-methylphenol. Gradually raise the temperature to 95°C to carry out the reaction. Measure the acid value according to the GB2895-82 method, until the acid value drops below 2 mgKOH / g, the reaction is terminated to obtain 368.61 g of epoxy acrylate intermediate product.

[0084] Step (2), under stirring, the epoxy acrylate intermediate product obtained in step (1) is warmed up to 60° C., and then adding the catalyst 4- Dimethylaminopyridine and 0.01% polymerization inhibitor 2,6-di-tert-butyl-4...

Embodiment 2

[0086]Step (1), in a 1000mL four-necked bottle equipped with a stirrer, a condenser, and a thermometer, add 200.00g of CYD-012 epoxy resin and 140.94g of diethylene glycol monoethyl ether acetate at 80°C, and stir until the epoxy resin Add 20.45g of acrylic acid after dissolving completely, account for reaction system (epoxy resin, diethylene glycol monoethyl ether acetate, acrylic acid) mass ratio is 2% catalyst triphenylphosphine and 0.01% polymerization inhibitor 2,6-di tert-butyl-4-methylphenol. Gradually raise the temperature to 95°C to carry out the reaction. Measure the acid value according to the GB2895-82 method, until the acid value drops below 2 mgKOH / g, the reaction is terminated to obtain 368.61 g of epoxy acrylate intermediate product.

[0087] Step (2), under stirring, the epoxy acrylate intermediate product obtained in step (1) is warmed up to 80 ° C, and then adding the catalyst 4- Dimethylaminopyridine and 0.01% polymerization inhibitor 2,6-di-tert-butyl-4-...

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Abstract

The invention relates to a preparation method of a liquid light-cured solder resist ink and photosensitive resin thereof, and relates to the technical field of printed circuit board solder resist ink. According to the preparation method of the photosensitive resin in the solder resist ink, acrylic acid and epoxy resin are first subjected to a ring-opening reaction, such that an intermediate epoxy acrylate is obtained; the epoxy acrylate is subjected to a ring-opening reaction with anhydride, such that carboxylation-modified epoxy acrylate resin is obtained. The epoxy resin which is subjected to the ring-opening reaction with acrylic acid is at least one selected from E12, E12A, E13, E14, ECN268, ECN273 and ECN280. Because the carboxylation-modified epoxy acrylate resin has good light curing capacity and appropriate diluted alkali water solubility, the liquid light-cured solder resist ink with the carboxylation-modified epoxy acrylate resin as photosensitive resin has relatively high resolution, and can resolve lines under 40mum. Also, the solder resist ink provided by the invention also has good adhesion to substrates, good acid resistance, good alkali resistance and good solvent resistance.

Description

technical field [0001] The invention relates to a liquid photocurable solder resist ink and a preparation method thereof, belonging to the technical field of solder resist ink for printed circuit boards. Background technique [0002] Solder resist ink is one of the key materials of printed circuit boards (PCB). Its main function is to cover the lines that do not need to be soldered on the surface of the circuit board to prevent short circuit and oxidation during soldering. [0003] Commonly used solder resist inks mainly include liquid heat-curable solder resist inks and liquid light-curable solder resist inks. The liquid photocurable solder resist ink mainly includes carboxylated modified epoxy acrylate resin (component A) and epoxy resin (component B), which are coated on the etched circuit board and preheated to remove the solvent , exposed through a mask to obtain a photocurable latent image, developed by a dilute alkali aqueous solution, and then heated and cured at a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/102G03F7/027G03F7/004C08G59/14C08G59/17
Inventor 孙晓晓苟金龙曹松
Owner SHANGHAI PHICHEM MATERIAL CO LTD
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