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An oxide-metal multilayer film back-contact crystalline silicon solar cell and preparation method thereof

A solar cell and oxide thin film technology, applied in the field of solar cells, can solve the problems of flammable and explosive raw material silane, reduce the photogenerated current of the cell, and large series resistance, and achieve the effects of low cost, reduced recombination, and simple equipment

Active Publication Date: 2018-01-23
江苏润阳悦达光伏科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, IBC-SHJ solar cells currently have the following problems: 1. The equipment is expensive, and the raw material silane is a flammable and explosive chemical
3. It is necessary to use transparent conductive films such as ITO and low-temperature silver paste, which are expensive and difficult to mass produce
However, the front-junction oxide-metal multilayer film / silicon-based solar cell has the following disadvantages: (1) The emitter of the cell contains a layer of metal film, which will greatly reduce the efficiency of the cell due to the reflection and absorption of light by the metal film. Photogenerated current; (2) The metal electrode on the front surface and the emitter are only partially in contact (~8%), the series resistance is large, and the fill factor is low

Method used

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  • An oxide-metal multilayer film back-contact crystalline silicon solar cell and preparation method thereof
  • An oxide-metal multilayer film back-contact crystalline silicon solar cell and preparation method thereof
  • An oxide-metal multilayer film back-contact crystalline silicon solar cell and preparation method thereof

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Embodiment 1

[0041] like figure 1 As shown in , the structure provided by this embodiment is an oxide-metal multilayer film back-contact crystalline silicon solar cell, including a crystalline silicon wafer 1, and a passivation layer 2 is provided on the front surface and the back surface of the crystalline silicon wafer 1. An emitter, an emitter metal electrode 71 and a base metal electrode 72 are arranged on the layer 2, and the emitter is composed of a first oxide film 4, a metal film 5 and a second oxide film 6; wherein the first oxide film 4 or for WO 3 film, the metal film is Ag film, and the second oxide film 6 is V 2 o 5 film.

[0042] The thickness of the first oxide film 4 is 5-30 nm, the thickness of the metal film 5 is 2-20 nm, and the thickness of the second oxide film 6 is 5-80 nm.

[0043] An antireflection film 3 is provided on the passivation layer 2 of the front surface of the crystalline silicon wafer 1 .

[0044] A gap is provided between the emitter metal electrod...

Embodiment 2

[0053] The structure provided in this embodiment is an oxide-metal multilayer film back-contact crystalline silicon solar cell. The difference from Embodiment 1 is that the passivation layer 2 is Al 2 o 3 passivation layer, the first oxide film 4 is V 2 o 5 , the metal film 5 is an Au film, and the second oxide film 6 is a WO 3 .

[0054] The above structure is an oxide-metal multilayer film back-contact crystalline silicon solar cell, which is prepared by the following method:

[0055] (1) The n-type or p-type single crystal silicon wafer is cleaned by RCA process, and then a layer of Al is deposited on the front and rear surfaces of the silicon wafer by atomic layer deposition (ALD) technology. 2 o 3 Passivation layer, set the deposition temperature to 200°C, Al(TMA), N 2 、H 2 The pulse time of O is: 0.1s, 10s and 0.1s respectively, the flow rate is respectively: 150sccm, 150sccm and 200sccm, carry out 10-30 cycles, and deposit 1-3nm Al on the surface of the silicon w...

Embodiment 3

[0062] The structure provided in this embodiment is an oxide-metal multilayer film back-contact crystalline silicon solar cell. The difference from Embodiment 1 is that the passivation layer 2 is TiO 2 passivation layer, the first oxide film 4 is V 2 o 5 , the metal film 5 is a Pd film, and the second oxide film 6 is NiO.

[0063] The above structure is an oxide-metal multilayer film back-contact crystalline silicon solar cell, which is prepared by the following method:

[0064] (1) Clean the n-type or p-type single crystal silicon wafer with the RCA process, and then deposit a layer of TiO on the front and rear surfaces of the silicon wafer using atomic layer deposition (ALD) technology 2 Passivation layer, set the deposition temperature to 200-300°C, TiCl 4 , N 2 、H 2 The pulse time of O is: 1s, 3s and 1s respectively, the flow rate is respectively: 150sccm, 150sccm and 200sccm, carry out 10~30 cycles, deposit the titanium dioxide of 1~3nm on the silicon chip surface; ...

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Abstract

The invention discloses an oxide-metal multilayer film back contact crystalline silicon solar cell, which comprises a crystalline silicon wafer, wherein passivation layers are arranged on the front surface and the back surface of the crystalline silicon wafer; the passivation layer on the back surface is provided with an emitter, an emitter metal electrode and a base metal electrode; the emitter comprises a first oxide thin film, a metal film and a second oxide thin film; the first oxide thin film or the second oxide thin film is a WO3 thin film, an NiO thin film or a V2O5 thin film; and the metal thin film is an Ag thin film, an Au thin film, a Pd thin film, a Cu thin film, an Ni thin film, an Mo thin film, a W thin film or an Al thin film. The surface of the cell is not shielded by a metal grid line; the raw materials do not include inflammable, explosive or toxic materials and are friendly to environment; expensive devices of a photoetching device, a laser device and the like and a complicated technological process are not needed in the overall preparation process; and the crystalline silicon solar cell disclosed by the invention is free of a high temperature, simple in processing step and suitable for large-scale production, does not need to use a transparent conductive thin film, is low in cost and has a wide application prospect.

Description

technical field [0001] The invention belongs to the technical field of solar cells, and in particular relates to an oxide-metal multilayer film back-contact crystalline silicon solar cell and a preparation method thereof. Background technique [0002] The most common structure type of solar cells is the p-n junction type of inorganic material system, which can be divided into homojunction and heterojunction according to the similarities and differences of materials. Heterojunction solar cells can avoid the high-temperature diffusion process, and prepare thin films and silicon substrates at low temperatures to form p-n junctions. The current commercial silicon-based heterojunction solar cells mainly include a-Si:H / c-Si heterojunction solar cells (Heterojunction with intrinsic Thin layer, HIT) and interdigitated back contact silicon (Interdigitated back contact silicon) solar cells. heterojunction, IBC-SHJ) solar cells. [0003] The front surface of the IBC-SHJ solar cell us...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L31/0224H01L31/0216H01L31/18
CPCH01L31/02167H01L31/02245H01L31/1868Y02E10/50Y02P70/50
Inventor 沈辉包杰吴伟梁刘宗涛
Owner 江苏润阳悦达光伏科技有限公司