An oxide-metal multilayer film back-contact crystalline silicon solar cell and preparation method thereof
A solar cell and oxide thin film technology, applied in the field of solar cells, can solve the problems of flammable and explosive raw material silane, reduce the photogenerated current of the cell, and large series resistance, and achieve the effects of low cost, reduced recombination, and simple equipment
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Embodiment 1
[0041] like figure 1 As shown in , the structure provided by this embodiment is an oxide-metal multilayer film back-contact crystalline silicon solar cell, including a crystalline silicon wafer 1, and a passivation layer 2 is provided on the front surface and the back surface of the crystalline silicon wafer 1. An emitter, an emitter metal electrode 71 and a base metal electrode 72 are arranged on the layer 2, and the emitter is composed of a first oxide film 4, a metal film 5 and a second oxide film 6; wherein the first oxide film 4 or for WO 3 film, the metal film is Ag film, and the second oxide film 6 is V 2 o 5 film.
[0042] The thickness of the first oxide film 4 is 5-30 nm, the thickness of the metal film 5 is 2-20 nm, and the thickness of the second oxide film 6 is 5-80 nm.
[0043] An antireflection film 3 is provided on the passivation layer 2 of the front surface of the crystalline silicon wafer 1 .
[0044] A gap is provided between the emitter metal electrod...
Embodiment 2
[0053] The structure provided in this embodiment is an oxide-metal multilayer film back-contact crystalline silicon solar cell. The difference from Embodiment 1 is that the passivation layer 2 is Al 2 o 3 passivation layer, the first oxide film 4 is V 2 o 5 , the metal film 5 is an Au film, and the second oxide film 6 is a WO 3 .
[0054] The above structure is an oxide-metal multilayer film back-contact crystalline silicon solar cell, which is prepared by the following method:
[0055] (1) The n-type or p-type single crystal silicon wafer is cleaned by RCA process, and then a layer of Al is deposited on the front and rear surfaces of the silicon wafer by atomic layer deposition (ALD) technology. 2 o 3 Passivation layer, set the deposition temperature to 200°C, Al(TMA), N 2 、H 2 The pulse time of O is: 0.1s, 10s and 0.1s respectively, the flow rate is respectively: 150sccm, 150sccm and 200sccm, carry out 10-30 cycles, and deposit 1-3nm Al on the surface of the silicon w...
Embodiment 3
[0062] The structure provided in this embodiment is an oxide-metal multilayer film back-contact crystalline silicon solar cell. The difference from Embodiment 1 is that the passivation layer 2 is TiO 2 passivation layer, the first oxide film 4 is V 2 o 5 , the metal film 5 is a Pd film, and the second oxide film 6 is NiO.
[0063] The above structure is an oxide-metal multilayer film back-contact crystalline silicon solar cell, which is prepared by the following method:
[0064] (1) Clean the n-type or p-type single crystal silicon wafer with the RCA process, and then deposit a layer of TiO on the front and rear surfaces of the silicon wafer using atomic layer deposition (ALD) technology 2 Passivation layer, set the deposition temperature to 200-300°C, TiCl 4 , N 2 、H 2 The pulse time of O is: 1s, 3s and 1s respectively, the flow rate is respectively: 150sccm, 150sccm and 200sccm, carry out 10~30 cycles, deposit the titanium dioxide of 1~3nm on the silicon chip surface; ...
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Abstract
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