Unlock instant, AI-driven research and patent intelligence for your innovation.

Direct metallization method for ceramic substrate

A ceramic substrate and metallization technology, which is applied in the field of ceramic substrate metallization, can solve the problems of high price, rising production cost, and weak adhesion between substrate and coating

Active Publication Date: 2016-07-27
深圳市鼎华芯泰科技有限公司
View PDF4 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese patent CN101798238.A "Ceramic metallization method" discloses a ceramic metallization method, which uses gold nanoparticle solution as an activator, and the activated ceramic substrate is directly electroless nickel-plated, and the production cost is increased due to the use of gold nanoparticles
U.S. Patent U.ApatNO.4008343 uses a kind of colloidal palladium pretreatment liquid to make electroless plating can carry out smoothly, but the adhesion between substrate and coating is not strong
[0004] The above methods have some problems to varying degrees, such as: although the vacuum method is easy to use, it is expensive and difficult to produce in batches; metal nanoparticles are used as activators to increase the production cost; the chemical vapor deposition method has complicated equipment and is not easy to produce, etc.; and The electroless plating method has simple equipment, low price, and is convenient for batch automatic production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Direct metallization method for ceramic substrate
  • Direct metallization method for ceramic substrate
  • Direct metallization method for ceramic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment example 1

[0028] figure 1 A flow chart of the direct metallization of the ceramic base surface of the present invention is provided; figure 2 Give

[0029] Out of the structure diagram of the surface direct metallization ceramic substrate of the embodiment 1 of the present invention, below in conjunction with the attached Figure 1-2 The direct metallization of the surface of aluminum nitride ceramic substrate is specifically explained:

[0030] The specific process of direct metallization on the surface of aluminum nitride ceramic substrate is as follows: 1) Pretreatment of the ceramic substrate11; 2) Electroless nickel plating on the pretreated ceramic substrate12; 3) Nickel layer oxidation on the ceramic substrate after electroless nickel plating Process 13; 4) flash plating a fresh nickel layer 14 on a ceramic substrate with a nickel oxide layer; 5) electroplating copper 15 on a fresh nickel layer. The structure of the formed aluminum nitride ceramic substrate is: copper platin...

Embodiment example 2

[0044] figure 1 A flow chart of the direct metallization of the ceramic base surface of the present invention is given, image 3 It is a structure diagram of the ceramic substrate after the surface is directly metallized in Example 2 of the present invention. Attached below figure 1 , image 3 The direct metallization on the surface of alumina ceramic substrate is specifically explained:

[0045] The specific process of direct metallization on the surface of alumina ceramic substrate is as follows: 1) ultrasonic pretreatment 11; 2) chemical nickel 12; 3) high temperature nickel oxide 13; 4) nickel flash plating 14;

[0046] The formed alumina ceramic substrate structure is: copper plating layer 101 , nickel flash plating layer 102 , chemical nickel layer 103 , nickel oxide layer 104 , and alumina ceramic substrate layer 201 .

[0047] The specific steps are described as follows:

[0048] Step 1. Ultrasonic pretreatment 11: Put the alumina ceramic substrate in the roughe...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a direct metallization method for a ceramic substrate. The invention aims to provide a method for direct metallization of the surface of the ceramic substrate, wherein the method has simple process and is convenient to operate. The method provided by the invention is realized through the following steps: 1) subjecting the ceramic substrate to pretreatment; 2) subjecting the pretreated ceramic substrate to chemical nickel plating; 3) subjecting the chemical nickel plated ceramic substrate to nickel-layer oxidation treatment; 4) subjecting the ceramic substrate with a nickel oxide layer to flash plating with a fresh nickel layer; and 5) electroplating copper on the fresh nickel layer. The surface-metallized ceramic substrate manufactured by using the method provided by the invention has the following advantages: a metal layer and the ceramic substrate are well bonded; compactness of a copper layer is good; and plated copper on the surface of the substrate is uniform and fine.

Description

technical field [0001] The invention relates to a method for metallizing a ceramic substrate, in particular to a method for directly metallizing a ceramic surface. Background technique [0002] Ceramic substrate materials are widely used in the fields of power electronics, electronic packaging, hybrid microelectronics and multi-chip modules due to their excellent thermal conductivity, air tightness and electrical properties. So far, ceramic substrates are the most commonly used substrate materials in the electronics industry. The methods of ceramic surface metallization mainly include: Mo-Mn method, active metal method, electroless plating, vacuum evaporation method, chemical vapor deposition method, etc. For the metallization of ceramic substrates, domestic Cai Yong and others used the method of magnetron sputtering to metallize the surface of the substrate; Song Xiufeng et al. used anodic oxidation technology to electroless copper plating on alumina ceramic substrates, but...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C04B41/90
Inventor 何忠亮温灵生丁华叶文
Owner 深圳市鼎华芯泰科技有限公司