Method for preparing polymer-based composite material with high dielectric constant

A technology of high dielectric constant and composite materials, which is applied in the field of preparing polymer matrix composite materials with high dielectric constant, can solve the problem of reduced mechanical properties and heat dissipation properties of composite materials, limited increase in dielectric constant, poor matrix interface, etc. problems, to achieve the effect of promoting mutual penetration and diffusion, excellent mechanical properties, and high dielectric constant

Inactive Publication Date: 2016-07-27
SOUTHWEST JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the content of conductive filler reaches a certain value, the filler particles will communicate with each other to form a conductive network. At this time, the material will change from a dielectric to a conductor, so the increase in its dielectric constant is limited; these conduc

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  • Method for preparing polymer-based composite material with high dielectric constant
  • Method for preparing polymer-based composite material with high dielectric constant
  • Method for preparing polymer-based composite material with high dielectric constant

Examples

Experimental program
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Effect test

Embodiment 1

[0030] A method for preparing a polymer-based composite material with a high dielectric constant, the steps of which are as follows:

[0031] A. Preparation of masterbatch by solution blending: Dissolve 100 parts by weight of polyvinylidene fluoride in N,N-dimethylformamide to obtain solution 1; the temperature during dissolution is 55°C, the dissolution time is 20 minutes, and with Stirring, the stirring rate is 50r / min.

[0032] Ultrasonic disperse 10 parts by weight of hexagonal boron nitride with a sheet diameter of 3-5 μm in N,N-dimethylformamide to obtain solution 2; the temperature during ultrasonic dispersion is 55°C, the ultrasonic time is 2 hours, and the ultrasonic power 100W.

[0033] Disperse 1.6 parts by weight of single-walled carbon nanotubes with a diameter of 0.5nm and a length of 10-30μm in N,N-dimethylformamide to obtain solution 3; the temperature during dispersion is 55°C

[0034] Then, solution 1, solution 2 and solution 3 were mixed and subjected to u...

Embodiment 2

[0038] A method for preparing a polymer-based composite material with a high dielectric constant, the steps of which are as follows:

[0039] A. Preparation of masterbatch by solution blending: Dissolve 100 parts by weight of polyvinylidene fluoride in N,N-dimethylformamide to obtain solution 1; the temperature during dissolution is 70°C, the dissolution time is 30 minutes, and with Stirring, the stirring rate is 80r / min.

[0040] Ultrasonic disperse 10 parts by weight of hexagonal boron nitride with a sheet diameter of 3-5 μm in N,N-dimethylformamide to obtain solution 2; the temperature during ultrasonic dispersion is 70°C, the ultrasonic time is 3 hours, and the ultrasonic power It is 80W.

[0041] Disperse 1.8 parts by weight of multi-walled carbon nanotubes with a diameter of 100nm and a length of 10-30μm in N,N-dimethylformamide to obtain solution 3; the temperature during dispersion is 70°C

[0042] Then, solution 1, solution 2 and solution 3 were mixed and subjected ...

Embodiment 3

[0046] A method for preparing a polymer-based composite material with a high dielectric constant, the steps of which are as follows:

[0047] A. Preparation of masterbatch by solution blending: Dissolve 100 parts by weight of polyvinylidene fluoride in N,N-dimethylformamide to obtain solution 1; the temperature during dissolution is 80°C, the dissolution time is 40 minutes, and with Stirring, the stirring rate is 100r / min.

[0048] Ultrasonic disperse 10 parts by weight of hexagonal boron nitride with a sheet diameter of 3-5 μm in N,N-dimethylformamide to obtain solution 2; the temperature during ultrasonic dispersion is 80°C, the ultrasonic time is 4 hours, and the ultrasonic power 100W.

[0049] Disperse 2 weights of multi-walled carbon nanotubes with a diameter of 200nm and a length of 10-30μm in N,N-dimethylformamide to obtain solution 3; the temperature during dispersion is 80°C

[0050] Then, solution 1, solution 2 and solution 3 were mixed and subjected to ultrasonic ...

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Abstract

The invention discloses a method for preparing a polymer-based composite material with a high dielectric constant. The method comprises the following steps: A, co-blending solutions to prepare master batch: dissolving 100 parts by weight of polyvinylidene fluoride into N,N-dimethyl formamide to obtain a solution I; ultrasonically dispersing 10 parts by weight of boron nitride into the N,N-dimethyl formamide to obtain a solution II; dispersing 1.6-2 parts by weight of carbon nanotube into the N,N-dimethyl formamide to obtain a solution III; mixing the solution I, the solution II and the solution III, and performing ultrasonic treatment to obtain a mixed solution; heating the mixed solution to 70-100 DEG C, preserving heat for 2-4 hours, and putting the mixed solution into a vacuum oven for drying to obtain the master batch; B, melt blending: extruding and granulating the master batch in a micro-extruder at the temperature of 190 DEG C for 6-10 minutes to obtain the polymer-based composite material. The composite material prepared with the method has the advantages of extremely high dielectric constant, low dielectric loss, high heat conductivity, simple process and contribution to large-scale production.

Description

technical field [0001] The present invention relates to a method for preparing polymer-based composite materials with a high dielectric constant. Background technique [0002] With the further development of the electrical and electronic industry, polymer matrix composites with high dielectric constant and low dielectric loss have received extensive attention. In the field of electrical engineering, such materials can be used as dielectric materials for capacitors with high energy storage density; in the field of microelectronics, polymer-based composite materials with excellent dielectric properties can be used as embedded capacitors and ensure the high speed and safety of integrated circuits run. The important thing is that composite materials with polymer as the matrix have the advantages of light weight, low cost, and easy processing in actual production, and have become an important development direction for the preparation of dielectric materials. [0003] Currently,...

Claims

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Application Information

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IPC IPC(8): C08L27/16C08K3/38C08K7/24
CPCC08K3/38C08K7/24C08K2003/385C08K2201/001C08K2201/011C08L27/16
Inventor 王勇肖燕君杨静晖黄婷张楠
Owner SOUTHWEST JIAOTONG UNIV
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