Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photosensitive ink and electromagnetic shielding structure employing same, circuit board, and electronic device

A technology of electromagnetic shielding structure and photosensitive ink, which is applied in the fields of magnetic/electric field shielding, ink, application, etc., and can solve the problems of expensive silver and long curing time of conductive ink

Inactive Publication Date: 2016-08-03
AVARY HLDG (SHENZHEN) CO LTD +1
View PDF7 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method avoids the use of conductive cloth, the silver it uses is relatively expensive, and the curing time of the conductive ink commonly used in this method is longer

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photosensitive ink and electromagnetic shielding structure employing same, circuit board, and electronic device
  • Photosensitive ink and electromagnetic shielding structure employing same, circuit board, and electronic device
  • Photosensitive ink and electromagnetic shielding structure employing same, circuit board, and electronic device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] In this embodiment, the photosensitive ink is composed of aromatic urethane resin, tripropylene glycol diacrylate, 1-hydroxycyclohexyl phenyl ketone, palladium acetate, isophorone and hydroxyethyl acrylate. Wherein the massfraction of aromatic urethane resin is 45%, the massfraction of tripropylene glycol diacrylate is 20%, the massfraction of 1-hydroxycyclohexyl phenyl ketone is 2%, the massfraction of palladium acetate The fraction is 1%, the mass fraction of isophorone is 30%, and the mass fraction of hydroxyethyl acrylate is 2%.

[0032] The general structural formula of the aromatic urethane resin is

[0033]

[0034] Among them, R 1 is a carbon-carbon double bond (C=C), R 2 One of the following structural formulas:-(CH 2 -CH 2 -O), , , , , , R 3 for H or CH 3 .

[0035] The structural formula of described tripropylene glycol diacrylate is

[0036] .

[0037] The structural formula of the 1-hydroxycyclohexyl phenyl ketone is

[0038] .

...

Embodiment 2

[0047] In this embodiment, the photosensitive ink is composed of urethane acrylate, hexafunctional aliphatic urethane acrylate, dimethylammonia-oxazetidinone, palladium acetate, isophorone and polydimethylsiloxane. Wherein the massfraction of urethane acrylate is 55%, the massfraction of hexafunctional aliphatic urethane acrylate is 15%, the massfraction of dimethylammonium-oxazeridone is 2%, and the massfraction of palladium acetate is 1 %, the mass fraction of isophorone is 25%, and the mass fraction of polydimethylsiloxane is 2%.

Embodiment 3

[0049] In this embodiment, the photosensitive ink is composed of polyether acrylate, tripropylene glycol methyl ether monoacrylate, 1-hydroxycyclohexyl phenyl ketone, palladium chloride, cyclohexane and polydimethylsiloxane. Wherein, the mass fraction of polyether acrylate is 20%, the mass fraction of tripropylene glycol methyl ether monoacrylate is 50%, the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 4%, the mass fraction of palladium chloride The mass fraction of cyclohexane is 21%, and the mass fraction of polydimethylsiloxane is 3%.

[0050] When using the photosensitive ink, the photosensitive ink is first coated on the surface of a substrate (not shown in the figure), and then irradiated with ultraviolet light. Under the irradiation of ultraviolet light, the photoinitiator generates an initial reaction free radical, which attacks the photosensitive monomer to form a reaction unit, and the reaction unit then attacks the double bond of the photosensitive oligomer...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided is photosensitive ink which contains photosensitive oligomers, photosensitive monomers, a photo-initiator, and solvents, and further contains catalytic reagents. The photosensitive oligomers include one or more of aromatic carbamic acrylic resin, epoxy acrylate, urethane acrylate, polyester acrylate, acrylate, aliphatic urethane triacrylate, aliphatic urethane diacrylate, and aliphatic hexa-functional urethane acrylate. The photosensitive monomers include one or more of alkane series, ester series, aromatic ring structure, aliphatic structure and ether structure compounds. The catalytic reagents include one or two of palladium acetate and palladium oxide. In addition, the invention provides an electromagnetic shielding structure employing the photosensitive ink, a circuit board employing the electromagnetic shielding structure, and an electronic device employing the circuit board.

Description

technical field [0001] The invention relates to a photosensitive ink, an electromagnetic shielding structure using the photosensitive ink, a circuit board and an electronic device, in particular to a conductive photosensitive ink and an electromagnetic shielding structure using the photosensitive ink, a circuit board and an electronic device. Background technique [0002] In recent years, small and multi-functional electronic products are widely favored, which requires high-density integration of circuits and electronic components on flexible circuit boards for electronic product applications. Therefore, the requirements for electromagnetic shielding performance of flexible circuit boards are increasing. high. [0003] There are two methods commonly used to avoid electromagnetic interference. One method is to use conductive cloth to make an electromagnetic shielding structure. The electromagnetic shielding structure includes an anisotropic conductive adhesive layer, a metal...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00C09D11/101
Inventor 徐茂峰
Owner AVARY HLDG (SHENZHEN) CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com