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Disulfide bond cross-linked C3 polypeptide supermolecule helical polymer and preparation method thereof

A technology of supramolecular polymers and disulfide bonds, which is applied in the field of C3 polypeptide supramolecular helical polymers and its preparation, can solve the problems of limited application and lack of functionalization, and achieve enhanced stability, high thermal stability and solvent resistance , Easier self-assembly effect

Inactive Publication Date: 2016-08-10
SHANGHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But these C 3 The molecular side chain is simple and lacks functionalization, which greatly limits its application

Method used

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  • Disulfide bond cross-linked C3 polypeptide supermolecule helical polymer and preparation method thereof
  • Disulfide bond cross-linked C3 polypeptide supermolecule helical polymer and preparation method thereof
  • Disulfide bond cross-linked C3 polypeptide supermolecule helical polymer and preparation method thereof

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Embodiment 1

[0044] a. Synthesis of dipeptide Boc-GlyCys(Acm)-TEG: Add 1.02 g of Cys(Acm)-TEG and 0.35 g of Boc-Gly-OH to a 100 mL round bottom flask, then add 0.29 g of HOBt and 1.56 g of DiEA, replace N 2 Afterwards, the reaction was carried out in an ice-salt bath for 12 h, and the crude product was respectively washed with saturated KHSO 4 solution and saturated Na 2 CO 3 Washed, dried and filtered over anhydrous magnesium sulfate, and purified by silica gel column chromatography to obtain 1.08 g of dipeptide Boc-GlyCys(Acm)-TEG with a yield of 81%.

[0045] b. Contains Acm protecting group C 3 -Synthesis of GlyCys(Acm)-TEG: Add 300 mg of the deprotected dipeptide GlyCys(Acm)-TEG to a 50 mL round bottom flask, add 500 mg of DiEA dropwise after DCM is dissolved, adjust the pH of the solution to greater than 11, and replace the N 2 Afterwards, 130 mg of pentafluorophenol active trimesic acid was added dropwise, and reacted at room temperature for 48 h. After the reaction was complete...

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Abstract

The invention relates to a preparation method of a disulfide bond cross-linked C3 polypeptide supermolecule helical polymer. C3 polypeptide monomers can form the supermolecule helical polymer through layer-by-layer self-assembly in a tetrahydrofuran solution, and a disulfide bond can be obtained through sulfydryl crosslinking on an oxidation polypeptide side chain to obtain the disulfide bond cross-linked C3 polypeptide supermolecule helical polymer. The assembly chirality of the disulfide bond cross-linked C3 polypeptide supermolecule helical polymer is not greatly changed along with increasing of temperature within a certain temperature interval; the assembly can stably exist and keeps a left-hand helical structure under a good solvent. The supermolecule helical polymer has the advantages of being easy to synthesize, reliable in chirality and stable in structure, and can be applied in the fields of chiral recognition, chiral separation, asymmetry catalysis and the like.

Description

technical field [0001] The present invention relates to a disulfide cross-linked C 3 Polypeptide supramolecular helical polymer and its preparation method. Background technique [0002] At the end of the 20th century, with the introduction and prosperity of supramolecular chemistry, supramolecular polymers have attracted more and more attention. Supramolecular polymers are self-assembled by monomers through non-covalent interactions to form molecular aggregates with specific structures. Among them, non-covalent interactions include hydrogen bonds, electrostatic interactions, coordination interactions, π-π stacking interactions, etc., and their dynamic properties endow supramolecular polymers with unique physical and chemical properties, such as stimuli-responsive properties, degradation properties, and self-healing properties. performance etc. [0003] In supramolecular polymers, based on 1,3,5-triamidobenzene C 3 Symmetric molecules are widely studied. The molecule has...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G83/00
CPCC08G83/008
Inventor 张阿方陈卢青王军章鹏马潇王凌霄
Owner SHANGHAI UNIV
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