Unlock instant, AI-driven research and patent intelligence for your innovation.

Method for preparing iron powder capable of being used for making seed ink

A technology of iron powder and ink, used in metal processing equipment, transportation and packaging, etc., can solve the problems of low carbon conductivity, non-conductivity and high cost, and achieve the effect of reducing manufacturing cost, preventing easy oxidation and good conductivity.

Inactive Publication Date: 2016-08-17
SHANGHAI LIANGZI HUIJING ELECTRONICS CO LTD
View PDF6 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductive inks used all contain precious metal powders such as gold, silver, platinum, and palladium, resulting in high costs
The base metal copper and nickel replace precious metals such as gold, silver, platinum, palladium, etc., because they are easy to oxidize, an oxide layer will be formed on the surface during processing, resulting in non-conductive
In addition, due to the low conductivity of carbon, it cannot meet the requirements of low-resistivity circuits.
The above several hole filling methods also have problems such as the reliability of thermal shock resistance, the stability of resistance value and the weakening of adhesion.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for preparing iron powder capable of being used for making seed ink
  • Method for preparing iron powder capable of being used for making seed ink

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Select iron powder with a diameter of 20 microns to be mixed with silicon dioxide with a diameter of 10 nanometers, wherein the proportion of silicon dioxide in the iron powder is 0.1%, and in an argon atmosphere, use a high-energy, high-speed vibrating disc grinder to grind for 0.5 hours, and the iron powder Mix evenly with nano silicon dioxide to obtain the required iron powder.

Embodiment 2

[0019] Select iron powder with a diameter of 30 microns to be mixed with silicon dioxide with a diameter of 15 nanometers, wherein the proportion of silicon dioxide in the iron powder is 0.5%, and in a nitrogen atmosphere, use a high-energy, high-speed vibrating disc grinder to grind for 2 hours, and iron powder and The nano-silica is mixed evenly to obtain the required iron powder.

Embodiment 3

[0021] Select iron powder with a diameter of 40 microns to be mixed with silicon dioxide with a diameter of 20 nanometers, wherein the proportion of silicon dioxide in the iron powder is 1%, and in an argon atmosphere, use a high-energy, high-speed vibrating disc grinder to grind for 4 hours, and the iron powder Mix evenly with nano silicon dioxide to obtain the required iron powder.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
diameteraaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for preparing iron powder capable of being used for making seed ink. In an inert gas atmosphere, a high-energy high-speed vibration disc type grinder is used for mixing iron powder raw materials and nanosilicon dioxide to be uniform. The method has the beneficial effects that the iron powder preparation process is simple, cost is low, and the iron powder is suitable for making the seed ink in multilayer flexible printed circuit boards (FPC) and multilayer printed circuit boards (PCB) and is used for holes filling for conduction.

Description

technical field [0001] The invention relates to a preparation method of iron powder. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. At present, the through-hole technology of double-sided multilayer circuit boards on the market is mostly electroplating technology. In addition to causing environmental pollution, electroplating technology also puts great pressure on enterprises in terms of production costs. Therefore, more and more printed circuit board companies will consider not using electroplating technology to process through-holes, and generally use conductive ink or conductive paste. However, the conductive inks used all contain precious metal powders such as gold, silver, platinum, and palladium, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F9/04
CPCB22F9/04B22F2009/045B22F1/14
Inventor 冯波
Owner SHANGHAI LIANGZI HUIJING ELECTRONICS CO LTD