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Seed ink

A kind of ink and seed technology, applied in the direction of ink, application, household utensils, etc., can solve the problems of resistance value stability and adhesion weakening, can not meet the requirements of low resistivity circuit, low carbon conductivity, etc., to achieve simple use method , low resistivity, good conductivity

Inactive Publication Date: 2016-09-07
SHANGHAI LIANGZI HUIJING ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conductive inks used all contain precious metal powders such as gold, silver, platinum, and palladium, resulting in high costs
The base metal copper and nickel replace precious metals such as gold, silver, platinum, palladium, etc., because they are easy to oxidize, an oxide layer will be formed on the surface during processing, resulting in non-conductive
In addition, due to the low conductivity of carbon, it cannot meet the requirements of low-resistivity circuits.
The above several hole filling methods also have problems such as the reliability of thermal shock resistance, the stability of resistance value and the weakening of adhesion.

Method used

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Embodiment Construction

[0020] The present invention is specifically carried out according to the following steps: 1) in an inert gas atmosphere, use a high-energy, high-speed vibrating disc grinder to mix the iron powder raw material with nano silicon dioxide evenly to obtain the iron powder required by the present invention; 2) mix the organic carrier Soluble in an organic solvent; 3) Dissolve iron powder and additives in an organic solvent and mix evenly to obtain seed ink.

[0021] In the embodiment of the present invention, what organic vehicle adopts respectively is polyurethane, polyester, vinyl chloride-vinyl acetate copolymer, acrylic resin, phenolic resin, vinyl acetate-vinyl chloride-vinyl alcohol copolymer, phenoxy resin and acetic acid Ethylene-vinyl chloride-hydroxyalkyl acrylate copolymer. In addition, the organic carrier can also use polycarbonate, polyvinyl chloride, polymethyl methacrylate and their mutual combination, etc. can implement the present invention, and obtain the same or...

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Abstract

The invention discloses seed ink. The seed ink is prepared from, by weight, 30-85 parts of iron powder, 3-16 parts of organic carrier and 12-65 parts of organic solvent. The surface of the iron powder is treated with nano-silica to form an antioxidative protection film. Compared with the prior art, the seed ink has the advantages of being simple in process, low in cost and suitable for grouting breakover of a multilayer flexible printed circuitboard (FPC) and a multilayer printed circuitboard (PCB).

Description

technical field [0001] The invention relates to a PCB or FPC circuit board potting material, in particular to a seed ink. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. At present, the through-hole technology of double-sided multilayer circuit boards on the market is mostly electroplating technology. In addition to causing environmental pollution, electroplating technology also puts great pressure on enterprises in terms of production costs. Therefore, more and more printed circuit board companies will consider not using electroplating technology to process through-holes, and generally use conductive ink or conductive paste. However, the conductive inks used all contain precious metal powders such as go...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/107C09D11/102C09D11/104C09D11/106C09D11/033C09D11/03B22F1/00B22F9/04
CPCC09D11/03C09D11/033C09D11/102C09D11/104C09D11/106C09D11/107B22F9/04B22F2009/045B22F1/14
Inventor 冯波
Owner SHANGHAI LIANGZI HUIJING ELECTRONICS CO LTD