Evaporation process of a metallized polypropylene film dielectric capacitor

A polypropylene film, metallization technology, applied in film/thick film capacitors, metal material coating process, laminated capacitors, etc., can solve the problem of limited discharge current impact capacity, weak capacitor adhesion, poor oxidation resistance, etc. The problem is to save the time of evaporation, improve the self-healing performance, and improve the adhesion.

Inactive Publication Date: 2018-01-26
ZHENGZHOU UNIVERSITY OF AERONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the purpose of the present invention is to provide a metallized polypropylene film dielectric capacitor evaporation process for the deficiencies of the prior art, which solves the problem of weak adhesion of existing capacitors, limited ability to withstand the impact of discharge current, and self-healing Problems of poor ability and poor antioxidant capacity

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  • Evaporation process of a metallized polypropylene film dielectric capacitor
  • Evaporation process of a metallized polypropylene film dielectric capacitor

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Embodiment 1

[0026] An evaporation process for a metallized polypropylene film dielectric capacitor, comprising the following steps:

[0027] 1) Surface treatment of polypropylene film layer: after washing with deionized water, soaking in acetone for 20 hours to remove oil stains, vacuum drying at 80°C, and corona treatment, wherein the conditions of corona treatment are: electrode gap 1 mm; treatment voltage: 5000 volts; power: 200 watts;

[0028] 2) Pretreatment of evaporation material: pulverize and granulate Al, Zn and Zn-Mg alloy respectively, and the particle size is 2 nanometers;

[0029] 3) Evaporation: the polypropylene film pretreated in step 1) is vapor-deposited in turn by vacuum evaporation of a metal Al layer and a Zn-Mg alloy layer as the active area of ​​the electrode, wherein the vacuum degree is 4×10 -5 Pa, the weight ratio of metal aluminum to zinc is 9:0.5; the mass ratio of metal zinc to magnesium is 9:0.5; the Zn-Mg alloy layer is uniformly dispersed and evaporated o...

Embodiment 2

[0031] An evaporation process for a metallized polypropylene film dielectric capacitor, comprising the following steps:

[0032] 1) Surface treatment of polypropylene film layer: after washing with deionized water, soaking in acetone for 24 hours to remove oil stains, vacuum drying at 85°C, and corona treatment, wherein the conditions of corona treatment are: electrode gap 2 mm; treatment voltage: 15000 volts; power: 2000 watts;

[0033]2) Pretreatment of evaporation material: pulverize and granulate Al, Zn and Zn-Mg alloy respectively, and the particle size is 10 nanometers;

[0034] 3) Evaporation: the polypropylene film pretreated in step 1) is vapor-deposited in turn by vacuum evaporation to form a metal Al layer and a Zn-Mg alloy layer as the active area of ​​the electrode, wherein the vacuum degree is 5×10 -5 Pa, the weight ratio of metal aluminum and zinc is 9:1.5; the mass ratio of metal zinc and magnesium is 9:1.5; the Zn-Mg alloy layer is uniformly dispersed and eva...

Embodiment 3

[0036] An evaporation process for a metallized polypropylene film dielectric capacitor, comprising the following steps:

[0037] 1) Surface treatment of polypropylene film layer: after washing with deionized water, soaking in acetone for 22 hours to remove oil stains, vacuum drying at 82°C, and corona treatment, wherein, the conditions of corona treatment are: electrode gap 1.5 mm; treatment voltage: 10000 volts; power: 1100 watts;

[0038] 2) Pretreatment of evaporation material: pulverize and granulate Al, Zn and Zn-Mg alloy respectively, and the particle size is 6 nanometers;

[0039] 3) Evaporation: the polypropylene film pretreated in step 1) is vapor-deposited in turn by vacuum evaporation to form a metal Al layer and a Zn-Mg alloy layer as the active area of ​​the electrode, wherein the vacuum degree is 6×10 -5 Pa, the weight ratio of metal aluminum to zinc is 9:1; the mass ratio of metal zinc to magnesium is 9:1; the Zn-Mg alloy layer is uniformly dispersed and evapor...

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Abstract

The invention discloses an evaporation technology of a metallized polypropylene film dielectric capacitor. The technology comprises steps as follows: 1) surface treatment of a polypropylene film layer; 2) pretreatment of an evaporation material; 3) evaporation. An evaporation layer of a metallized polypropylene film dielectric capacitor obtained with the evaporation technology is firmly combined with a base material and has the excellent surface performance, and the obtained metallized polypropylene film dielectric capacitor is high in self-healing property and has the very high wet resistance.

Description

technical field [0001] The invention relates to an evaporation process of a polypropylene film dielectric, in particular to an evaporation process of a metallized polypropylene film dielectric capacitor. Background technique [0002] In recent years, from the viewpoints of environmental protection and energy saving, capacitors have been developed in the direction of miniaturization and strong resistance. As capacitors used in electric motors, metallized film capacitors with high withstand voltage and low loss electrical characteristics are used. . Furthermore, in view of the desire to be maintenance-free, a metallized film capacitor with a long service life is also required. The metallized film of the metallized film capacitor includes a base material and a vapor deposition layer formed on the base material. At present, metal aluminum plating and silicon oxide plating are more commonly used. 1. The factors affecting the performance of vapor-deposited aluminum-type vapor-de...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/33C23C14/24C23C14/20
CPCC23C14/20C23C14/24H01G4/33
Inventor 苗满香孟建平胡天彤
Owner ZHENGZHOU UNIVERSITY OF AERONAUTICS
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