Environment-friendly efficient concentrated tin paste cleaning agent and preparation method thereof

Abstract

The invention discloses an environment-friendly efficient concentrated tin paste cleaning agent. The environment-friendly efficient concentrated tin paste cleaning agent is prepared from, by weight, 5%-35% of tetrahydrofurfuryl alcohol, 10%-70% of dipropylene glycol, 1%-10% of limonene, 0.5%-10% of sec-butyl ether and 5%-80% of deionized water. The cleaning purpose is achieved by adopting the similarity and intermiscibility principle and dissolving solder tin particles through the cleaning agent. The cleaning agent has the advantages of being free of lightning, surfactants and halogen, easy to biodegrade, safe, environmentally friendly and not capable of polluting the environment; through the neutral pH value, the cleaning agent has the outstanding intermiscibility on screen plates, mesh stretching glue and plastic, and the cleaning agent can be used for cleaning the screen plates and tin paste and surface-mounted glue which are misprinted on circuit boards; in addition, the cleaning agent can be used at room temperature, is compatible with most standard screen plate cleaning equipment, can be used in soaking type, spraying type and ultrasonic cleaning systems and is economical and practical.

Description

Technical field [0001] The invention relates to the technical field of cleaning agents, in particular to an environment-friendly high-efficiency concentrated solder paste cleaning agent and a preparation method thereof. Background technique [0002] Solder paste is a creamy mixture formed by mixing solder powder, flux and other additives. The solder paste has a certain viscosity at room temperature, which can initially bond the electronic components to the predetermined position. At the soldering temperature, with the volatilization of the solvent and some additives, the soldered components and the printed circuit pads will be welded together to form Permanently connected. [0003] But if the solder paste is misprinted or soiled tools, dried solder paste, template and board misalignment, it may cause undesirable solder paste on the bottom surface of the template or even the assembly. For fine-pitch templates, if the thin template cross-section bending causes damage between the pi...

AI Technical Summary

Problems solved by technology

[0003] However, misprinting of solder paste or dirty tools, dry solder paste, misalignment of stencil and board can cause unwanted solder paste on the underside of the stencil or even on the assembly

For fine-pitch stencils, if there is damage between pins due to thin stencil cross-section bending, it can cause solder paste to deposit between pins, resulting in printing defects and/or shorts

Low viscosity solder paste may also cause printing defects

For example, high printing press operating temperature or high squeegee speed can reduce the stickiness of solder paste in use, cause printing defects and bridging due to depositing too much solder paste

And more flux residues of

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