Heat-dissipating pouring sealant for packaging electronic devices

Abstract

This case discloses a heat-dissipating encapsulant for encapsulating electronic devices. The encapsulant includes component A and component B, and the mass ratio of component A to component B is (8-10): (4~8), wherein, the A component includes the following materials: epoxy resin, mixed diluent, inorganic mixed thermally conductive filler, spherical silica powder, and the B component includes the following materials: composite curing agent, plasticizer , Epoxy accelerator. The invention provides a heat-dissipating potting glue for encapsulating electronic devices. By adding inorganic mixed heat-conducting fillers and spherical silicon micropowder with a suitable particle size to epoxy resin, a compound with uniform structure, high light transmittance and large refractive index can be obtained. , a potting compound with good elongation, tensile strength, and bonding strength, as well as excellent thermal conductivity and dielectric properties.

Description

technical field [0001] The invention relates to an electronic potting glue, in particular to a heat dissipation potting glue for packaging electronic devices. Background technique [0002] With the development of power devices in the direction of high frequency, high power, and high current density, the requirements for miniaturization, reliability, and life of the device are continuously increasing. Therefore, not only the potting material is required to have excellent thermal conductivity and dielectric properties, but also to have excellent high and low temperature resistance, mechanical properties, flame retardancy and anti-sulfurization reduction properties. At present, the most widely used potting materials are various synthetic polymers, such as: silicone rubber, polyurethane resin and acrylic resin. Silicone rubber has excellent UV aging resistance, high and low temperature chemical stability, can maintain elasticity for a long time in a wide temperature range, low ...

AI Technical Summary

Problems solved by technology

However, in order to obtain electronic potting materials with better thermal conductivity, it is necessary to carry out a large amount of filling modification on silicone rubber, so that the viscosity of electronic potting materials will be greatly increased, which will affect its fluidity, mechanical properties and electrical properties after curing.

For example, Chinese patent CN101054057A discloses a high thermal conductivity silicone potting compound, and CN101407635A discloses a thermally conductive and flame-retardant liquid silicone rubber. More than s, poor fluidity, insufficient tensile strength and elongation at break, not suitable for electronic potting glue