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Laminated film

A film and film technology, applied in the field of laminated films, can solve the problems of reduced welding heat resistance, poor appearance, etc.

Inactive Publication Date: 2016-10-12
TAIYO INK MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is known that when there are such wrinkles, not only the appearance is poor, but also the groove part of the wrinkles becomes thinner than the designed film thickness, and thus there is a problem that desired characteristics such as resistance to soldering heat decrease.

Method used

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Examples

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Embodiment

[0159] Hereinafter, examples, comparative examples, and test examples of the present invention are shown, and the present invention will be specifically described, but the present invention is not limited to the following examples. In addition, below, "part" and "%" are mass standards unless otherwise indicated.

[0160] (Synthesis of Carboxyl-containing Resin A-1)

[0161] In an autoclave equipped with a thermometer, a nitrogen gas introduction device, an alkylene oxide introduction device, and a stirring device, 119.4 g of a novolak-type cresol resin (Shonol CRG951 manufactured by Showa Denko Co., Ltd., OH equivalent: 119.4) and 1.19 g of potassium hydroxide were charged. g and 119.4 g of toluene, while stirring, nitrogen replacement was carried out in the system, and then heating was carried out to raise the temperature. Next, slowly drop 63.8g of propylene oxide, at 125-132°C, 0-4.8kg / cm 2 Allow it to react for 16 hours. Thereafter, after cooling to room temperature, 1....

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Abstract

The invention provides a laminated film in which a resin layer is not liable to wrinkle and the thin film is not liable to remain on the resin layer. The laminated film includes a resin layer (A) and the thin film (B) of which the 5% elognation load of each unit width is 90-500 g / mm. The melt viscosity of the resin layer (A) is 10-10000 dPa*s at 80 DEG C.

Description

technical field [0001] This invention relates to laminated films. Background technique [0002] Conventionally, laminated films (dry films) have been used as one of means for forming protective films such as solder resists and interlayer insulating layers and insulating layers provided on printed circuit boards used in electronic equipment (for example, Patent Documents 1 and 2). ), with the thinning of substrates and the miniaturization of circuits in recent years, the demand for laminated films for forming protective films such as solder resist layers and insulating layers is increasing. The laminated film has a resin layer obtained by coating a resin composition having desired properties on a support film and then drying it. Status circulates in the market. The above protective film and insulating layer can be formed on the printed circuit board by bonding (hereinafter also referred to as "lamination") the resin layer of the laminated film to the substrate, followed by ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B37/10B32B37/06H05K3/28
CPCH05K3/28B32B27/06B32B37/06B32B37/10B32B2457/08H05K3/281B32B7/02B32B7/04B32B2307/54B32B2309/68
Inventor 椎名桃子依田健志植田千穂冈田和也伊藤信人
Owner TAIYO INK MFG CO LTD
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