A lead-free and silver-free tin bar and a preparation method thereof

A lead-free solder and tin bar technology, which is applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems such as difficult to guarantee soldering quality, high silver price, and many broken components, so as to reduce the production cost of enterprises , Reduce the cracking of components and reduce the effect of melting point

Inactive Publication Date: 2016-10-19
中山翰华锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current Sn-Ag (including Sn-Ag-Cu) series, such as Sn3.5Ag0.3, Sn95.5Ag4.0Cu0.5, Sn99.2Ag0.1Cu0.7, etc., still has a minimum melting point of about 220°C, which is difficult to Compared with the low temperature of SnPb solder, and the price of silver remains high, it brings huge pressure on the production cost, and bismuth metal is also added to reduce the temperature of the solder joint, but the physical properties of the SnBi alloy are brittle and difficult to process, and the above formulations The amount of slag is too much compared to solder, which wastes cost, and the components are broken after welding, so the welding quality is difficult to guarantee

Method used

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  • A lead-free and silver-free tin bar and a preparation method thereof
  • A lead-free and silver-free tin bar and a preparation method thereof
  • A lead-free and silver-free tin bar and a preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] A kind of lead-free silver-free tin bar, by weight percentage, its formula consists of:

[0019]

[0020] Preparation method: first melt tin to 400°C, keep warm and stir for 25 minutes, remove tin slag after stirring, add bismuth and continue stirring for 10 minutes, add phosphorus and stir for 10 minutes, add copper, cobalt, nickel and stir for 10-15 minutes, add germanium and stir for 2- After 3 minutes, take a sample to detect that the above components are qualified, and then cool down to about 340°C to start forming a lead-free and silver-free tin bar.

Embodiment 2

[0022] A kind of lead-free silver-free tin bar, by weight percentage, its formula consists of:

[0023]

[0024] Preparation method: first melt tin to 400°C, keep warm and stir for 25 minutes, remove the tin slag after stirring, add bismuth and continue stirring for 10 minutes, add phosphorus and stir for 10 minutes, add copper and cobalt and stir for 10-15 minutes, add germanium and stir for 2-3 minutes, Sampling is carried out to detect that the above components are qualified, and the temperature is lowered to about 340°C to form a lead-free and silver-free tin bar.

Embodiment 3

[0026] A kind of lead-free silver-free tin bar, by weight percentage, its formula consists of:

[0027]

[0028]

[0029] Preparation method: first melt tin to 400°C, keep warm and stir for 25 minutes, remove tin slag after stirring, add bismuth and continue stirring for 15 minutes, add phosphorus and stir for 10 minutes, add copper, cobalt, nickel and stir for 10-15 minutes, add germanium and stir for 2- After 3 minutes, take a sample to detect that the above components are qualified, and then cool down to about 340°C to start forming a lead-free and silver-free tin bar.

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PUM

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Abstract

The invention provides a lead-free and silver-free tin bar and a preparation method thereof. The tin bar contains 0.001-2.2wt% of cobalt, 0.45-0.55wt% of copper, 0-0.2wt% of nickel, 7.0-9.0wt% of bismuth, 0-0.3wt% of phosphor, and 0-0.01wt% of germanium, the rest being tin. The brazing filler in the invention contains no lead and silver and employs cobalt (Co) and bismuth (Bi) alloy, so that the hardness of welding spots is improved and the problem of brittleness thereof is solved while the melting point temperature of the soldering tin bar is reduced to 186-217 and the welding temperature is reduced to 196-227; with the low melting point, when components pass through wave soldering, the fracture phenomena of the components are greatly reduced; during soldering, soldering tine alloy oxidation is prevented, and generation of solder splash scraps is restrained and solder splash is reduced; while the favorable soldering performance of lead-free soldering tin bar alloy is guaranteed, the production cost of enterprises is greatly reduced, so that the tin bar is of great economic benefit.

Description

【Technical field】 [0001] The invention belongs to the technical field of alloy conductive materials, and in particular relates to a lead-free and silver-free tin bar and a preparation method thereof. 【Background technique】 [0002] The commonly used tin-lead alloy solder has been banned by many countries in the world due to the harm of lead and its compounds to the human body and the pollution to the environment. It has now been replaced by lead-free tin bars. The use of environmentally friendly solder materials has become an industry trend. However, in the current use of lead-free solder, one of the main technical problems is that the melting point of the solder and the temperature of the soldering process are too high, and the addition of other materials makes the cost too high, which makes the use of many electronic components and materials face the problem of cost and material selection. . [0003] The current Sn-Ag (including Sn-Ag-Cu) series, such as Sn3.5Ag0.3, Sn95....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
Inventor 李姗龙斌魏河柴庆文苏秋华张春慧梁小伟林展羽罗星李佐杰王灵芝李义成伍玉
Owner 中山翰华锡业有限公司
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