Epoxy-resin-based conductive adhesive and preparation method thereof

A technology of epoxy resin and conductive adhesive, applied in epoxy resin adhesive, conductive adhesive, adhesive and other directions, can solve the problem that there is no research on the conductive properties of epoxy resin-based composite materials, the conductive properties of composite materials are not significantly improved, and the raw material silver powder Expensive electrical conductivity and other issues, to achieve the effect of improving interface compatibility, simple curing method and good electrical conductivity

Active Publication Date: 2016-10-26
ANHUI UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

CN201310111361.9 discloses a method for preparing a submicron / micron silver composite system epoxy resin conductive adhesive. The raw material silver powder is expensive and only depends on filling flake silver powder to obtain electrical conductivity. The silver powder is easily oxidized during the curing process, resulting in a decrease in electrical conductivity.
CN201310704209.1 discloses a heat-cured epoxy resin conductive system. The volume resistivity of the patent’s conductivity test meets the requirements of polymer conductive materials. The heating equipment completes the curing, the process operation is cumbersome, and it is difficult to realize industrial production
Ji Xiaoyong et al. (Journal of Composite Materials, 2009, 26(5): 39-46) studied the influence of carbon black dispersion state on the conductive properties of carbon black / epoxy resin conductive composites, and explored the dispersion modification of carbon black, but the composite The electrical conductivity of the material did not improve significantly
Recently, Hajime Kishi et al. (Polymer, 2016, 82:93-99) used silver-based fillers as conductive materials to study the conductive properties of epoxy resin / polyethersulfone / silver adhesive conductive adhesives, making the conductive epoxy conductive adhesive The performance and adhesion have been greatly improved, but the dissolution of polyethersulfone requires the addition of special solvents and high temperatures, and the addition of polyethersulfone makes the processing and molding of materials very difficult
In addition, the existing literature on the modification of epoxy resin by magnetic field (Engineering Plastics Application, 2015, 43(10): 7-12; Journal of Composite Materials, 2013, 30(6): 54-59) mainly focuses on In exploring the influence of magnetic field on the morphology and structure of epoxy resin matrix composites, there is no research on the electrical conductivity of epoxy resin matrix composites

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  • Epoxy-resin-based conductive adhesive and preparation method thereof
  • Epoxy-resin-based conductive adhesive and preparation method thereof
  • Epoxy-resin-based conductive adhesive and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] 1. Ingredients

[0035] In this embodiment, the raw materials of epoxy resin-based conductive adhesive are composed as follows in parts by mass:

[0036] 10 parts of bisphenol A epoxy resin, 0.6 parts of micron iron powder (average particle size 5.5 microns), 1.2 parts of curing agent diethylenetriamine, accelerator 2,4,6-tri-(dimethylaminomethyl) 0.2 parts of phenol, 1 part of toughening agent dioctyl phthalate, 0.6 parts of coupling agent KH560.

[0037] 2. Preparation

[0038] (1) Modification of micron iron powder

[0039] Using absolute ethanol as the reaction medium, add a coupling agent to the micron iron powder, mix well and then stir and react at 60°C for 4 hours; after the reaction is completed, cool to room temperature, filter and dry at 100°C for 2 hours to obtain the modified Sexual micron iron powder;

[0040] (2) Preparation of composite materials

[0041] Heat the epoxy resin to 60°C, add the toughening agent, stir and react for 1 hour, then add the...

Embodiment 2

[0053] 1. Ingredients

[0054] In this embodiment, the raw materials of epoxy resin-based conductive adhesive are composed as follows in parts by mass:

[0055] 10 parts of bisphenol A epoxy resin, 2 parts of micron iron powder (average particle size 3.4 microns), 1.2 parts of curing agent diethylenetriamine, accelerator 2,4,6-tri-(dimethylaminomethyl) 0.2 parts of phenol, 1 part of toughening agent dioctyl phthalate, 2 parts of coupling agent KH560.

[0056] 2. Preparation

[0057] (1) Modification of micron iron powder

[0058] Using absolute ethanol as the reaction medium, add a coupling agent to the micron iron powder, mix well and then stir and react at 60°C for 4 hours; after the reaction is completed, cool to room temperature, filter and dry at 100°C for 2 hours to obtain the modified Sexual micron iron powder;

[0059] (2) Preparation of composite materials

[0060] Heat the epoxy resin to 60°C, add the toughening agent, stir and react for 1 hour, then add the mod...

Embodiment 3

[0072] 1. Ingredients

[0073] In this embodiment, the raw materials of epoxy resin-based conductive adhesive are composed as follows in parts by mass:

[0074] 10 parts of bisphenol A epoxy resin, 4.8 parts of micron iron powder (average particle size 8 microns), 1.2 parts of curing agent diethylenetriamine, accelerator 2,4,6-tri-(dimethylaminomethyl) 0.2 parts of phenol, 1 part of toughening agent dioctyl phthalate, 4.8 parts of coupling agent KH560.

[0075] 2. Preparation

[0076] (1) Modification of micron iron powder

[0077] Using absolute ethanol as the reaction medium, add a coupling agent to the micron iron powder, mix well and then stir and react at 60°C for 4 hours; after the reaction is completed, cool to room temperature, filter and dry at 100°C for 2 hours to obtain the modified Sexual micron iron powder.

[0078] (2) Preparation of composite materials

[0079] Heat the epoxy resin to 60°C, add the toughening agent, stir and react for 1 hour, then add the m...

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Abstract

The invention discloses an epoxy-resin-based conductive adhesive and a preparation method thereof. The epoxy-resin-based conductive adhesive is composed of, by mass, 10-20 parts of epoxy resin, 0.5-5 parts of magnetic filler, 1-2 parts of solidifying agent, 0.1-0.3 part of promoter, 0.5-2 parts of flexibilizer and 0.5-5 parts of coupling agent. The epoxy-resin-based conductive adhesive has high conductive performance; magnetic field regulation is adopted to enable the magnetic filler to be in oriented distribution in an epoxy resin matrix, so that conductive performance of the epoxy-resin-based conductive adhesive is remarkably improved than that of conventional epoxy-resin-based conductive adhesive modified by filling. The e epoxy-resin-based conductive adhesive has the advantages of simple and convenient process and low filler consumption, meets requirements of high polymer conductive materials and is suitable for being used to prepare composite materials like conductive paint and conductive adhesives.

Description

1. Technical field [0001] The invention relates to a conductive material and a preparation method thereof, in particular to an epoxy resin-based conductive adhesive and a preparation method thereof. 2. Background technology [0002] With the rapid development of semiconductor integrated circuit packaging industry, various electronic products play an increasingly important role in daily life, and how to choose electronic packaging materials becomes more important. Adhesive materials are used for most integrated circuit chips, and conductive adhesives for connecting various electronic components are the most common adhesive materials, and have also attracted widespread attention. [0003] Traditional electronic packaging materials mainly include traditional lead-tin solder and lead-free solder, as well as emerging electronic packaging materials polymer-based conductive adhesives. Conductive adhesives are referred to as conductive adhesives, which can effectively bond various ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J9/02
CPCC08K3/08C08K5/12C08K5/18C08K9/06C08K13/06C08K2003/0856C09J9/02C09J11/04C09J11/06C09J163/00
Inventor 杨斌石优钱家盛夏茹苏丽芬郑争志曹明陆华阳邓艳丽陈鹏苗继斌
Owner ANHUI UNIVERSITY
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