Low-temperature-resistant PBT material with epoxy resin cohesiveness and preparation method thereof
A technology of epoxy resin and adhesion, which is applied in the field of low temperature resistant PBT materials and its preparation, can solve the problems of reduced packaging efficiency, difficulty in controlling the curing process of epoxy resin viscosity changes, etc., and achieve improved adhesion and low temperature resistance enhanced effect
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[0027] Weighing: PBT 70 kg, thermoplastic polyester elastomer 9 kg, cardanol amine 18 kg, polyvinyl alcohol microspheres 18 kg, sodium lauryl sulfonate 6 kg, gelatin 6 kg, styrene butadiene acrylate 2 kg, 8 kg of glass fiber, 2 kg of maleic anhydride styrene copolymer.
[0028] Specific steps are as follows:
[0029] (1) Dry the thermoplastic polyester elastomer and maleic anhydride styrene copolymer in an oven at 90°C for 4 hours, and set aside;
[0030] (2), preparation of microcapsule curing agent:
[0031] ①. Under stirring conditions, add 0.5wt% gelatin aqueous solution and 0.5wt% sodium dodecylsulfonate aqueous solution, and disperse for 40 minutes under mechanical stirring at 800 rpm to obtain an aqueous phase;
[0032] 2. In the dichloromethane solvent, add cardanolamine and polyvinyl alcohol microspheres, and disperse evenly in an ultrasonic instrument to obtain an oil phase, and gradually add the water phase prepared in step 1 into the oil phase;
[0033] ③. Stir ...
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