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Epoxy resin based cooling powder coating with high adhesion and manufacturing method thereof

A technology of epoxy resin and powder coatings, which is applied in the field of powder coatings. It can solve the problems of single function of composite powder coatings, poor performance of composite materials, poor dispersion and easy agglomeration, etc., so as to improve interface bonding force, compatibility and adhesion ability Strong, improved dispersion effect

Inactive Publication Date: 2016-11-23
合肥燕美新材料科技有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor dispersion of carbon nanotubes in composite powder coatings and easy agglomeration, when the content of carbon nanotubes continues to increase, the performance of the composite material will deteriorate again, and the composite powder coatings prepared by using the production process and formula in this paper The function is relatively single, and the product structure is single and featureless, which cannot meet the requirements of special environments and needs to be improved

Method used

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Embodiment Construction

[0014] An epoxy resin-based heat-dissipating powder coating with strong adhesion, made of the following raw materials in parts by weight: bisphenol A34, epichlorohydrin 18, carbon nanotubes 2.9, chitosan 2, aluminate coupling agent DL -411 2.6, triglycidyl isocyanurate 5, triethylenetetramine 3, eucalyptus oil 6, polyester fiber 7, pepper 5, black tea residue 9, expanded perlite 8, rosin emulsion 7, pigment 8.

[0015] A method for making an epoxy resin-based heat-dissipating powder coating with strong adhesion comprises the following steps:

[0016] (1) Dried Chinese prickly ash and black tea dregs, crushed and ground through a 200-mesh sieve, added rosin emulsion, stirred and mixed for 12-14 hours, granulated, and sintered at 800-1000°C for 20-30 minutes under nitrogen protection to obtain pre- mix;

[0017] (2) Calcinate the expanded perlite at 730-800°C for 2-3 hours, cool the discharge to 60°C-80°C, add aluminate coupling agent DL-411, ultrasonically disperse polyester f...

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Abstract

The invention discloses an epoxy resin based cooling powder coating with high adhesion. Bisphenol A and epichlorohydrin are used as raw materials, and carbon nanotubes are used as thermal conducting fillers, so that modified epoxy resin is obtained through in-situ polymerization, the carbon nanotubes and epoxy groups form acting force which is much larger than Van der Waals force, stress transfer between the carbon nanotubes and the epoxy groups is facilitated, the interface bonding force and compatibility between the carbon nanotubes and the epoxy groups are increased, and the storage stability of the coating is improved; additionally, chitosan, modified assistant and the like are added as reinforcing fillers, so that the stretching vibration intensity of carbon chlorine keys in composite materials is reduced, the binding force of C and Cl atoms and surrounding atoms is increased, the dispersibility of all components in the coating is improved, thus, the carbon nanotubes make full contact with the coating, and the effect of an additional physical crossing point is achieved, so that a cooling channel is formed, and heat dissipation is facilitated. The cooling coating has the advantages of high cohesion of molecules, ageing resistance and high adhesion.

Description

technical field [0001] The invention relates to the technical field of powder coatings, in particular to an epoxy resin-based heat-dissipating powder coating with strong adhesion and a manufacturing method thereof. Background technique [0002] With the rapid development of modern science and technology, the high frequency and high speed of electronic devices and the density and miniaturization of integrated circuits have greatly increased the total power density and calorific value of electronic devices per unit volume, thus making the cooling of electronic devices more difficult. increasingly prominent. However, the cooling capacity achieved by conventional cooling systems is greatly challenged, especially in the fields of energy, automobiles, air conditioning, agriculture, chemicals, heating, aerospace, microelectronics, information, etc. put forward higher requirements. The heat dissipation coating is a special coating that improves the heat dissipation efficiency of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D163/00C09D7/12C09D5/03C08G59/06C08K7/00C08K3/04
CPCC08G59/063C08K3/04C08K7/00C08K2201/011C08L2201/08C08L2205/035C08L2205/16C09D5/033C09D7/62C09D7/65C09D163/00C08L5/08C08L67/02C08K13/06C08K9/04C08K7/26C08K3/34
Inventor 陈俊刘学涛赵遵刚霍柏林李正孙红兴
Owner 合肥燕美新材料科技有限公司
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