C-Si/a-Si/mc-Si solar cell structure and preparation method thereof
A solar cell, mc-si technology, applied in circuits, photovoltaic power generation, electrical components, etc., can solve problems such as increased time cost, passivation failure, unfavorable industrialization, etc., to reduce compounding, simplify production steps, reduce The effect of series resistance
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0025] A method for preparing a c-Si / a-Si / mc-Si structure solar cell, comprising the following steps:
[0026] (a) Provide N-type monocrystalline silicon wafers for cleaning;
[0027] (b) Depositing an intrinsic amorphous silicon layer with a thickness of 52nm on the light-receiving surface of the N-type single crystal silicon wafer by PECVD method, and depositing an intrinsic amorphous silicon layer with a thickness of 52nm on the backlight surface;
[0028](c) Deposit a 180nm boron source layer on the intrinsic amorphous silicon layer on the light-receiving surface by spin coating, then dry it in a box furnace at 100°C, and coat the intrinsic amorphous silicon layer on the backlight surface by spin coating. Deposit a 180nm phosphorus source layer on the crystalline silicon layer, and then dry it in a box furnace at 100°C;
[0029] (d) at 100% N 2 Perform 80J / cm on the intrinsic amorphous silicon layer of the deposited overdoping source under the atmosphere 2 , 10ms instan...
Embodiment 2
[0033] A method for preparing a c-Si / a-Si / mc-Si structure solar cell, comprising the following steps:
[0034] (a) Provide N-type monocrystalline silicon wafers for cleaning;
[0035] (b) Depositing an intrinsic amorphous silicon layer with a thickness of 85nm on the backlight surface of the N-type single crystal silicon wafer by PECVD, and depositing an intrinsic amorphous silicon layer with a thickness of 85nm on the light-receiving surface;
[0036] (c) Deposit a 180nm phosphorus source layer on the intrinsic amorphous silicon layer on the backlight surface by spin coating, then dry it in a box furnace at 150°C, and spin coat the intrinsic amorphous silicon layer on the light receiving surface. Deposit a 180nm boron source layer on the crystalline silicon layer, and then dry it in a box furnace at 150°C;
[0037] (d) at 100% N 2 Perform 100J / cm on the intrinsic amorphous silicon layer of the deposited overdoping source under the atmosphere 2 , 20ms instant irradiation an...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More 

