Modified epoxide resin adhesive with high strength and preparing method thereof

A technology of epoxy resin glue and epoxy resin, applied in the direction of epoxy resin glue, adhesive, adhesive additive, etc., can solve the problems of poor durability and low bonding strength, and achieve strong insulation performance and ablation resistance. , the effect of good bond strength and durability

Inactive Publication Date: 2017-01-18
穆勇华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The current high-performance modified epoxy resin adhesives have good bonding strength and durability when bonding metals and non-metals that have undergone strict surface treatment, but bonding metals and non-metals that have not been strictly surface-treated is not only adhesive Low bonding strength and poor durability
For example, the commonly used high-performance epoxy resin adhesive modified E51 epoxy resin is the main resin, and the adhesive prepared by 200# polyamide curing agent has good bonding strength and durability. Aluminum alloy surface, the normal temperature shear strength can reach 37MPa, 55 degrees RH98-100% damp heat aging for 1000 hours and 90 degrees salt spray aging for 300 hours, the shear strength is improved compared with the bonding performance at room temperature, and the durability Good, but the shear strength at room temperature is only 19.23MPa when bonding sandpaper-polished aluminum alloy, or even the cross-section of the plate without deliberate surface treatment, 55 degrees RH98-100% damp heat aging for 1000 hours and 90 degrees salt spray aging for 300 hours After the shear strength is almost zero
At present, there is no adhesive in China that has good bonding strength and durability for metal or non-metal surfaces or cross-sections that have not been strictly surface-treated.

Method used

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Embodiment Construction

[0012] A high-strength modified epoxy resin adhesive and a preparation method thereof. The modified epoxy resin adhesive is based on 90 parts by mass of epoxy resin, 16.2 parts of carboxyl butyronitrile latex, and 6 parts of polyacrylic acid. Ester latex, 7 parts of quartz powder, 1.3 parts of aluminum silicate, 2.5 parts of anti-settling agent, 35 parts of polyamide curing agent and 1.1 parts of γ-aminopropyl triethoxysilane; and the carboxyl nitrile latex The mass ratio with polyacrylate latex is 2.7:1;

[0013] The preparation method of the modified epoxy resin adhesive includes the following steps:

[0014] (a) After the carboxyl nitrile latex is demulsified, it is dried for later use;

[0015] (b) After the polyacrylate latex is demulsified, it is dried for later use;

[0016] (c) Add the carboxyl nitrile latex after step (a) to the epoxy resin, react for 2h at a temperature of 120°C, and add the polyacrylate latex and γ-aminopropyl after step (b) in sequence Triethoxysilane is...

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Abstract

The invention discloses a modified epoxide resin adhesive with high strength and a preparing method thereof. The modified epoxide resin adhesive is prepared from, by weight, 80-100 parts of epoxide resin, 3-21 parts of carboxylic acrylonitrile butadiene rubber latex, 1.1-7.7 parts of polyacrylate latex, 5-10 parts of quartz powder, 1.1-1.5 parts of aluminium silicate, 2-3 parts of anti-settling agent, 1-3 parts of aminopropyltriethoxysilan; the ratio of carboxylic acrylonitrile butadiene rubber latex to polyacrylate latex is 2.7:1; the modified epoxide resin adhesive with high strength has good properties of ablation resistance, acid and alkali resistance, moisture absorption and thermal stability, aging resistance, anti-shearing force, high insulation and high sealing, and in terms of electrical insulation property, due to quartz powder added in the formula, and the product after solidification has stronger insulation property and ablation resistance property.

Description

Technical field [0001] The invention relates to the technical field of epoxy resin adhesives, in particular to a high-strength modified epoxy resin adhesive and a preparation method thereof. Background technique [0002] The current high-performance modified epoxy resin adhesives have good bonding strength and durability for bonding metals and non-metals that have undergone strict surface treatment. The joint strength is low, and the durability is poor. For example, the commonly used high-performance epoxy resin adhesive modified E51 epoxy resin is the main resin, and the adhesive prepared by 200# polyamide curing agent has good bonding strength and durability. It is bonded to phosphoric acid anodized LY2CZ. Aluminum alloy surface, the shear strength at room temperature can reach 37MPa, 55 degrees RH98-100% damp heat aging for 1000 hours and 90 degrees salt spray aging for 300 hours, the shear strength is improved compared with the bonding performance at room temperature, durabi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC09J163/00C08L2205/03C09J11/04C09J11/06C09J11/08C08L13/02C08L33/04C08K13/02C08K3/36C08K3/34C08K5/544
Inventor 穆勇华
Owner 穆勇华
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