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Preparation method and application of chemical-bonded thermally-conductive insulation composite filling material

A thermal insulation and composite filler technology, applied in chemical instruments and methods, heat exchange materials, etc., to achieve good thermal conductivity, good dispersion, and good thermal conductivity

Active Publication Date: 2017-02-08
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since carbon-based materials usually also have good electrical conductivity, the application is limited when the material requires high electrical insulation and thermal conductivity, such as LED packaging materials, etc.

Method used

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  • Preparation method and application of chemical-bonded thermally-conductive insulation composite filling material
  • Preparation method and application of chemical-bonded thermally-conductive insulation composite filling material
  • Preparation method and application of chemical-bonded thermally-conductive insulation composite filling material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] (1) Surface modification of chopped carbon fibers: first place the carbon fibers in concentrated acid for 6 hours, then clean them with deionized water, and dry them in vacuum; then prepare ethanol / Water mixed solution (volume ratio 5:1), and 5% chopped carbon fiber were reacted and refluxed at 100°C under nitrogen protection for 3 hours. After the reaction was completed, they were washed with ethanol and dried in vacuum to obtain chopped carbon fibers with amino-modified surfaces.

[0029] (2) Surface modification of magnesium oxide particles: Mix 2 g of dry magnesium oxide particles with 96 g of toluene, and ultrasonically disperse at room temperature for 30 minutes to obtain a suspension, then add 2 g of γ-glycidyl etheroxypropyl trimethoxysilane, and ℃ temperature reaction 10h. After the reaction is completed, suction filter while hot, wash, and vacuum-dry to obtain epoxy group-modified magnesium oxide particles.

[0030] (3) Grafting MgO particles on the surface ...

Embodiment 2

[0034] (1) Surface modification of carbon nanotubes: first place the carbon nanotubes in concentrated acid for 1 hour, wash them with deionized water, and dry them in vacuum; Ethanol / water mixed solution (volume ratio 5:1), reacted with 1% carbon nanotubes under nitrogen protection at 120° C. for 1 h, washed with ethanol after the reaction, and dried in vacuum to obtain amino-modified carbon nanotubes.

[0035] (2) Surface modification of zinc oxide particles: Mix 4 g of dry zinc oxide particles with 93 g of toluene and disperse ultrasonically at room temperature for 30 minutes to obtain a suspension, then add 3 g of γ-glycidyl etheroxypropyl trimethoxy silicon, and Reaction at high temperature for 6h. After the reaction is completed, suction filter while hot, wash, and vacuum-dry to obtain epoxy-modified zinc oxide particles.

[0036] (3) Zinc oxide particles grafted on the surface of carbon nanotubes: ultrasonically disperse 4 g of epoxy-modified zinc oxide particles in tol...

Embodiment 3

[0039] (1) Graphene surface modification: first place graphene in concentrated acid for 0.5h and then clean it with deionized water and dry it in vacuum; Ethanol / water mixed solution (volume ratio 5:1), reacted with 2% graphene at 80° C. under nitrogen protection and refluxed for 5 hours, washed with ethanol after the reaction, and dried in vacuum to obtain amino-modified graphene.

[0040] (2) Surface modification of alumina particles: Mix 3g of dried alumina particles with 93g of toluene (after ultrasonic dispersion at room temperature for 30min to obtain a suspension, then add 4g of γ-glycidyl etheroxypropyltrimethoxysilane, and The reaction was carried out at ℃ for 8 hours. After the reaction was completed, it was filtered while hot, washed, and dried in vacuum to obtain epoxy-modified alumina particles.

[0041] (3) Alumina particles grafted on the surface of graphene: 3g of epoxy-modified Al 2 o 3 The particles were ultrasonically dispersed in toluene for 30 minutes, t...

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Abstract

A preparation method and application of a chemical-bonded thermally-conductive insulation composite filling material belongs to the technical field of a thermally-conductive insulation composite filling material. The objective of the invention is to combine preferable thermal conductivity of carbon materials and insulation of thermally-conductive inorganic nanometer particles, wherein the thermally-conductive inorganic nanometer particles are loaded on the surface of carbon materials through a chemical bonding method. The composite filling material is good in thermal conductivity, and the inorganic nanometer particles block the electric conductivity of the carbon materials. The inorganic nanometer particles improve the surface roughness of carbon materials and improve the interface bonding of the carbon materials and the polymer resin matrix. The filling material is mixed with a polymer resin to prepare a composite excellent in thermal conductivity and insulation in a low filling material loading amount. The composite filling material can be applied to the field requiring thermal conductivity and insulation, such as electronic packaging materials.

Description

technical field [0001] The invention relates to a preparation technology of using thermally conductive inorganic nanoparticles modified carbon materials as thermally conductive and insulating composite fillers, and mixing it with polymers to prepare resin-based thermally conductive and insulating composite materials, which can be applied to the field of electronic packaging materials and belong to thermally conductive and insulating composite fillers technology field. Background technique [0002] Polymer materials have attracted widespread attention because of their chemical corrosion resistance, easy molding process, excellent fatigue resistance, and light weight. However, since most polymer materials are poor conductors of heat, their application in heat conduction is limited. Especially in recent years, with the rapid development of high-power electronic and electrical products, there have been more and more problems such as reduced product efficacy and shortened servic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08K9/12C08K9/06C08K9/10C08K9/02C08K3/04C08K7/06C08K7/24C08K3/22C08K3/38C08K3/34C08L23/06C08L77/02C08L25/06C08L23/12C08L69/00C08L63/00C08L75/04C09K5/14
CPCC08K3/04C08K3/22C08K3/38C08K7/06C08K7/24C08K9/02C08K9/06C08K9/10C08K9/12C08K2003/222C08K2003/2227C08K2003/2296C08K2003/385C08K2201/011C09K5/14C08L77/02C08L23/12C08L23/06C08L63/00
Inventor 张晨张景新杜中杰邹威励杭泉
Owner BEIJING UNIV OF CHEM TECH
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