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Halogen-free resin composition containing ester curing agent for high-frequency and high-speed printed-circuit board

A technology for printed circuit boards and resin compositions, which is applied in the field of halogen-free resin compositions containing ester curing agents, can solve the problem that the dielectric properties, mechanical processing properties and bonding strength of resin compositions cannot meet the requirements of high frequency, High-speed printed circuit boards and other issues, to achieve the effects of excellent heat and humidity resistance and machining performance, good flame retardancy, excellent dielectric properties and thermal expansion coefficient

Active Publication Date: 2017-02-22
无锡宏仁电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the problem that the dielectric properties, machinability and bonding strength of the existing resin composition cannot meet the needs of high-frequency and high-speed printed circuit boards at the same time, and provide a high-frequency, high-speed Halogen-free resin composition containing ester curing agent for high-speed printed circuit board

Method used

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  • Halogen-free resin composition containing ester curing agent for high-frequency and high-speed printed-circuit board
  • Halogen-free resin composition containing ester curing agent for high-frequency and high-speed printed-circuit board
  • Halogen-free resin composition containing ester curing agent for high-frequency and high-speed printed-circuit board

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Embodiment

[0022] Table 1. Each embodiment component / (weight part)

[0023]

[0024]

[0025] Each component code used in embodiment 1~4 in table 1 and corresponding corresponding name are as follows:

[0026] 1. A-1 is o-methyl novolac epoxy resin, model: NP704;

[0027] 2. A-2 is phosphorus-containing phenolic epoxy resin, model: BEP330A70, P(%)=3%;

[0028] 3. B-1-1 is benzoxazine resin, model ORE0700;

[0029] 4. B-1-2 benzoxazine resin, model: KB7170;

[0030] 5. B-2-1 is active ester, model: SHC-4305TM65;

[0031] 6. B-2-2 is active ester, model: SHC-5600TM65;

[0032] 7. B-3 is DOPO-phosphorous phenolic resin, model: 950PM60;

[0033] 8. C is silica fused powder, particle size is 2-4μm, model: FS1002;

[0034] 9.D is a pyridine accelerator, model: DMAP;

[0035] 10. E is a silane coupling agent, model: KH-560.

[0036] Preparation of laminates:

[0037] Use the resin compositions in the above-mentioned examples 1 to 4 to make a glue solution, and set the impregnatio...

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Abstract

The invention discloses a halogen-free resin composition containing an ester curing agent for a high-frequency and high-speed printed-circuit board. The halogen-free resin composition is prepared from the following ingredients in parts by weight: 9 to 12 parts of phenolic epoxy resin, 10 to 14 parts of phosphorus-containing epoxy resin, 15 to 25 parts of benzoxazine, 0 to 10 parts of active esters, 5 to 15 parts of phosphorus-containing environment-friendly halogen-free flame retardant resin, 0.5 to 1.5 parts of accelerants and 15 to 25 parts of silicon dioxide molten powder. The halogen-free resin composition containing the ester curing agent for the high-frequency and high-speed printed-circuit board solves the problem of deficiency of certain performance of a laminated board made from resin composition with single ingredients; the laminated board made from the composition has excellent dielectric property, thermal expansion coefficient, good moisture and heat resistant performance, good mechanical processing performance, good flame retardant performance and the like.

Description

technical field [0001] The invention relates to a resin composition, in particular to a halogen-free resin composition containing an ester curing agent for high-frequency and high-speed printed circuit boards. Background technique [0002] Traditional copper clad laminates (CCL) generally use brominated epoxy resins or added brominated flame retardants to achieve the goal of flame retardant V-0. For example, reactive tetrabromobisphenol A type epoxy resin or additive type bromine-containing flame retardant aluminum bromide, etc., combined with amine or phenolic resin curing agent, the obtained epoxy system substrate material, its vitrification Low transition temperature (Tg), poor heat resistance, high dielectric constant (Dk) and dielectric loss tangent (Df), the Dk value can reach 4.7, and the Df value can also be as high as 0.02, which can basically meet the needs of the 20th century. From the end of the 1990s to the beginning of the 21st century, the development needs o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/04C08L63/04C08L63/00C08L61/06C08K3/36
CPCC08L79/04C08L2201/02C08L2201/22C08L2203/20C08L2205/035C08L63/04C08L63/00C08L61/06C08K3/36
Inventor 聂玲玲方业纬方廷亮姜立勇周飞
Owner 无锡宏仁电子材料科技有限公司
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