Modified light-cured resin composition and preparation method thereof

A technology of light-curing resin and composition, applied in the field of light-curing materials, can solve the problems of poor dimensional stability, low use temperature, large volume shrinkage, etc., and achieve the effects of good aging resistance, reduced shrinkage, and reduced dispersion problems

Inactive Publication Date: 2017-03-08
HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The inventor considers that POSS is introduced into the photocurable resin to improve the disadvantages of the current resin system, such as poor temperature resistance, low service temperature, relatively large volume shrinkage after curing, and poor dimensional stability.

Method used

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  • Modified light-cured resin composition and preparation method thereof
  • Modified light-cured resin composition and preparation method thereof
  • Modified light-cured resin composition and preparation method thereof

Examples

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preparation example Construction

[0029] Correspondingly, the present invention also provides a preparation method of a modified photocurable resin composition, comprising the following steps: adding 1-5 parts by weight of semi-cage POSS resin to 2-10 parts by weight of the first epoxy resin, stirring Obtain POSS epoxy resin solution afterward; With 20-60 weight part acrylic resin, 20-68 weight part second epoxy resin, 20-40 weight part reactive diluent, 0.1-8 weight part free radical initiator, 0.1-8 Parts by weight of cationic initiator, 5-15 parts by weight of polyol, 0.1-0.5 parts by weight of leveling agent, 0.1-0.5 parts by weight of defoamer, 0.1-1 part by weight of wetting and dispersing agent, the POSS epoxy resin solution, 1-5 parts by weight of nano silicon dioxide and pigment are mixed, stirred at high speed in a mixer, and after uniform dispersion, put into an ultrasonic cleaning machine for ultrasonic vibration to obtain a modified photocurable resin composition.

[0030] Wherein, the first epoxy...

Embodiment 1

[0036] A semi-cage POSS modified photocurable resin is composed of the following weight component raw materials: 5 parts by weight of CN104 (Sartomer), 5 parts by weight of EB639 (Cytec), 3,4-epoxycyclohexylcarboxylic acid-3' , 52 parts by weight of 4'-epoxycyclohexyl methyl ester, 16 parts by weight of reactive diluent 1,6-ethylene glycol diacrylate, 2 parts by weight of free radical initiator 1173, triarylsulfonium hexafluoroantimonate ( cationic initiator) 4 parts by weight, polycaprolactone glycol 10 parts by weight, leveling agent 0.3 parts by weight, defoamer 0.3 parts by weight, wetting and dispersing agent 0.3 parts by weight, semi-cage POSS resin 2 parts by weight, 3 parts by weight of nano-silica, and 0.1 part by weight of titanium dioxide.

[0037] The preparation technology of described photocurable resin comprises the following steps:

[0038] 1. Weigh 2 parts by weight of semi-cage POSS resin, add it to 4 parts by weight of 3,4-epoxycyclohexylcarboxylate-3',4'-e...

Embodiment 2

[0041] A semi-cage POSS modified photocurable resin is composed of the following weight component raw materials: 5 parts by weight of CN104 (Sartomer), 5 parts by weight of EB639 (Cytec), 3,4-epoxycyclohexylcarboxylic acid-3' , 50 parts by weight of 4'-epoxycyclohexyl methyl ester, 16 parts by weight of reactive diluent 1,6-ethylene glycol diacrylate, 2 parts by weight of free radical initiator 1173, triarylsulfonium hexafluoroantimonate ( Cationic initiator) 4 parts by weight, polycaprolactone glycol 10 parts by weight, leveling agent 0.3 parts by weight, defoamer 0.3 parts by weight, wetting and dispersing agent 0.3 parts by weight, semi-cage POSS (self-made) 4 parts by weight parts, 3 parts by weight of nano silicon dioxide, and 0.1 parts by weight of titanium dioxide.

[0042] The preparation technology of described photocurable resin comprises the following steps:

[0043] 1. Weigh 4 parts by weight of semi-cage POSS resin, add it to 8 parts by weight of epoxy resin 3,4-...

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Abstract

The invention discloses a modified light-cured resin and a preparation method thereof. The modified light-cured resin composition is prepared from acrylic resin, epoxy resin, reactive diluent, radical initiator, kation initiator, polyhydric alcohols, flatting agent, flatting agent, wetting dispersant, half-cage type POSS, nanosilicon dioxide, and pigment. Compared with the prior art, the invention applies the half-cage type POSS to modify the light-cured resin; the POSS resin has excellent temperature resistance, and is able to effectively improve the vitrification transformation temperature of the resin system, and the aging resistance is good; moreover, the POSS can effectively fill gaps in the polymer, and reduce the contraction of the polymer. Meanwhile, the half-cage type POSS is in good compatibility with resin, and can completely dissolve in the epoxy resin, thus the dispersing problem during the resin preparation process is reduced. Therefore, the modified light-cured resin prepared by the invention is featured by high temperature resistance, high strength, aging resistance, and stable dimension.

Description

technical field [0001] The invention relates to the technical field of photocurable materials, in particular to a modified photocurable resin composition and a preparation method thereof. Background technique [0002] Photocuring technology is an efficient, environmentally friendly, energy-saving, high-quality material surface treatment technology, known as a new technology for the green industry in the 21st century. Photocuring resin is the most important part of photocuring technology. It is composed of resin monomers and prepolymers, contains active functional groups, and can be polymerized by photoinitiators under ultraviolet light irradiation. [0003] Photocurable resins are mainly divided into cationic photocurable resins and free radical photocurable resins according to different initiators. Cationic photocurable resins include low molecular weight resins with C=C unsaturated groups, such as acryloxy, methacrylic Acyloxy, vinyl, propenyl, etc. Cationic photocurable...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F291/06C08F291/10C08F291/12C08F291/00C08F291/08C08K3/36C08K3/22
CPCC08F265/04C08F283/008C08F283/02C08F283/10C08F283/12C08K3/22C08K3/36C08K2003/2241C08K2201/011
Inventor 徐瑞金应慧春张小敏刘波
Owner HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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