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Preparation method of Sn-Cu-Al series lead-free solder

A lead-free solder, sn-cu-al technology, applied in the direction of welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problem of insufficient uniformity of the alloy structure, and achieve the effect of promoting the refinement and solid solution of the structure Ideal for homogenization and improvement of microhardness

Active Publication Date: 2017-03-15
GUANGXI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a preparation method of Sn-Cu-Al lead-free solder, which adopts the combination of ball milling and vacuum arc melting technology; strictly controls the parameters in the ball milling process, so that the ball milling has good mixing performance and ensures The uniformity of the structure in the subsequent smelting process solves the problem that the structure of the Sn-Cu-Al system alloy with a large mutual melting repulsion in the traditional casting smelting process is not uniform enough

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  • Preparation method of Sn-Cu-Al series lead-free solder
  • Preparation method of Sn-Cu-Al series lead-free solder
  • Preparation method of Sn-Cu-Al series lead-free solder

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Embodiment 1

[0028] 1. Raw material formula

[0029] The raw material components and weight percentages are: copper 0.70%, aluminum 0.075%, and the balance is tin. Tin, copper and aluminum raw materials are all 200-mesh metal powder with a purity higher than 99.9%.

[0030] 2. Preparation method

[0031] (1) Raw materials are weighed. According to the weight percentage of each raw material component, tin powder, copper powder, and aluminum powder are respectively weighed and put into a ball mill jar. The weight accuracy of each powder is controlled within ±0.00005g.

[0032] (2) Ball milling mixture, according to the ratio of balls and materials listed in Table 1-1, put stainless steel balls with diameters of 4mm and 6mm into the ball milling tank with the raw materials at a mass ratio of 1:1.3; then pump the ball milling tank Vacuum, the vacuum degree is controlled at 5-10 Pa; then fill with argon, put the ball mill jar into the planetary ball mill, the ball mill operating parameters ar...

Embodiment 2

[0045] 1. Raw material formula: raw material components and weight percentages are: copper 0.70%, aluminum 0.075%, and the balance is tin. Tin, copper and aluminum raw materials are all 200-mesh metal powder with a purity higher than 99.9%.

[0046] 2. Preparation method

[0047] (1) Raw materials are weighed. According to the weight percentage of each raw material component, tin powder, copper powder, and aluminum powder are respectively weighed and put into a ball mill jar. The weight accuracy of each powder is controlled within ±0.00005g.

[0048] (2) Ball mill mixing, according to the ball-to-material ratio of 10:1, put stainless steel balls of two specifications with a diameter of 4mm and 6mm into the ball mill tank with the raw materials at a mass ratio of 1:1.3; then vacuumize the ball mill tank, vacuum The temperature is controlled at 5-10 Pa; then filled with argon, and put into a planetary ball mill. The operating parameters of the ball mill are 5 minutes of alterna...

Embodiment 3

[0056] 1. Raw material formula: raw material components and weight percentages are: copper 0.62%, aluminum 0.055%, and the balance is tin. Tin, copper and aluminum raw materials are all 200-mesh metal powder with a purity higher than 99.9%.

[0057] 2. Preparation method

[0058] (1) Raw materials are weighed. According to the weight percentage of each raw material component, tin powder, copper powder, and aluminum powder are respectively weighed and put into a ball mill jar. The weight accuracy of each powder is controlled within ±0.00005g.

[0059] (2) Ball mill mixing, according to the ball-to-material ratio of 12:1, put stainless steel balls with a diameter of 4mm and 6mm in a mass ratio of 1:1 into the ball mill tank filled with raw materials; then vacuumize the ball mill tank, vacuum The temperature is controlled at 5-10 Pa; then filled with argon, and put into the planetary ball mill. The operating parameters of the ball mill are 8 minutes of alternate operation time, ...

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Abstract

The invention provides a preparation method of Sn-Cu-Al series lead-free solder. The preparation method comprises the following steps of weighing the following components in percentages by weight: tin powder, copper powder and aluminum powder raw materials; evenly mixing the powder by using a planetary ball mill; then pressing the powder into metal blocks; and finally, carrying out smelting by using a nonconsumable vacuum arc furnace, and carrying out cooling to obtain alloy ingots. The lead-free solder can replace traditional solder and are low in price, and meanwhile, the technical problem that aluminum cannot be melted in tin alloy easily is solved. The aluminum serves as a micro-alloyed element, a reinforced phase is formed, the aluminum is uniformly distributed in a tin-copper matrix, and therefore, the microhardness of the matrix is improved effectively.

Description

technical field [0001] The invention belongs to the technical field of lead-free solder, in particular to a preparation method of Sn-Cu series lead-free solder alloy. Background technique [0002] Lead in traditional tin-lead solder, as a toxic heavy metal, seriously pollutes the environment and threatens human health in the process of discarding electronic products. The prohibition and restriction of lead-containing solder has become a rigid requirement for the development of the electronics industry. The research and development of lead-free solder needs to consider whether it meets the requirements of performance from the following aspects: 1) low melting point; 2) suitable physical properties such as electrical conductivity, thermal conductivity, and thermal expansion coefficient; 3) compatibility with existing component substrates, Good wettability of leads and PCB materials; 4) Sufficient mechanical properties: shear strength, creep resistance, isothermal fatigue resis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/02C22C13/00B23K35/26B22F3/02
CPCB22F3/02B22F2998/10B23K35/262C22C1/02C22C13/00B22F1/0003
Inventor 湛永钟杜再翊杨文超李逸泰李吉东邓培基陈才举黄金芳
Owner GUANGXI UNIV
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