A method and device for measuring multi-wavelength tunable microscopic interference

Abstract

The invention discloses a multi-wavelength tunable microscopic interference measurement method and a device thereof. Multi-wavelength tunable lasers output three channels of wavelength tunable laser signals synchronously or time-divisionally through regulation, combine them into one composite laser signal through the beam combining fiber, focus and couple to the surface of the ground glass plate rotating at a uniform speed, and then pass through the collimating beam expander to become Parallel light is incident on the surface of the beam splitter, reflected into the interference microscope objective lens, and irradiated to the surface of the measured element on the stage, and the reflected signal passes through the interference microscope objective lens and beam splitter in turn, and is coupled to the color sensor through the imaging lens. The target surface of the camera is controlled by the computer to control the output signal and synchronize the collected data. The invention adopts the technical scheme of a plurality of single-wavelength tunable laser modules with different wavelengths to realize optical phase shifting and multi-wavelength interference detection, and is especially suitable for fast and accurate measurement of microstructure elements with complex surface changes and discontinuity, which can effectively Suppresses measurement errors introduced by scanning movements of mechanical parts.

Description

technical field [0001] The invention relates to a method and device for microscopic light interference measurement, in particular to a measurement device and method using multi-wavelength tunable microscopic interference, which belongs to the field of advanced manufacturing and detection technology. Background technique [0002] In the design and development of optoelectronic systems, it is often necessary to use a variety of optical components of different types and materials to improve system performance. The surface of some of these components (such as gratings) has complex microstructures formed by processes such as machining, plasma etching, and spray coating; , residual stress, service life, microscopic physical properties and other intrinsic characteristics are closely related. In order to effectively process the above-mentioned devices and make them better meet the design and application requirements of optoelectronic systems, it is necessary to conduct precise insp...

AI Technical Summary

Problems solved by technology

At present, for the surface microstructure of optical parts, ultra-precision detection combined with dual / multi-wavelength interferometry technology has yet to be carried out.

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