Modifier and modification method of low melting point impurity element lead in copper and copper alloy

Abstract

The invention provides a modifier for low-melting-point impurity element lead in copper and copper alloy materials and a modifying method for low-melting-point impurity element lead in copper and copper alloy materials. The copper and copper alloy materials to which the modifier and the modifying method are applicable are copper materials comprising, by weight, 0.001-3% of low-melting-point impurity element lead. According to the copper bar, copper pipe and copper wire modified by the modifying method, the room-temperature mechanical property is improved by 1-10 times than before, the high-temperature mechanical property is improved by 1-40 times than before, the electricity conducting and heat conducting property is improved by 1-2 times than before, and the corrosion resistance property is improved by 20-60% than before.

Description

technical field

[0001] The invention relates to a process method for modifying low melting point impurity elements in nonferrous metal materials, in particular to a modifier and modification method for low melting point impurity element lead in copper and copper alloys. Background technique

[0002] Lead, a low-melting impurity element in copper and its alloys, will segregate and precipitate at the grain boundaries during the solidification process of the cast slab, making the chemical composition of copper and copper alloy materials uneven, and causing differential potentials at the grain boundaries and inside the grains Poor, it is easy to cause microgalvanic corrosion of copper and copper alloy parts, so the existence of low melting point impurity elements at the grain boundary will deteriorate the physical and mechanical properties of copper materials, shorten the service life of copper materials, and lead will be dissolved during use , causing irreversible damage to hum...

Images