Modifier and modification method of low melting point impurity element lead in copper and copper alloy

A technology of impurity elements and low melting point, which is applied in the field of modification of low melting point impurity elements and can solve problems such as hazards

Active Publication Date: 2018-03-30
YANTAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the defects and harm caused by the low-melting-point impurity element lead in copper and copper alloy materials in the prior art, the present invention provides a modifier for low-melting-point impurity element lead in copper and copper alloy materials, as well as a modifier for copper and copper alloys. Modification method of low melting point impurity element lead in alloy material

Method used

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  • Modifier and modification method of low melting point impurity element lead in copper and copper alloy
  • Modifier and modification method of low melting point impurity element lead in copper and copper alloy
  • Modifier and modification method of low melting point impurity element lead in copper and copper alloy

Examples

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Embodiment 1

[0033] Example 1 A process for modifying lead as an impurity element with a low melting point in copper. The specific steps are to melt 9.91 kg (by weight percentage) of miscellaneous copper containing 0.1% lead at 1190 ° C, and cover the surface of the copper liquid with a Layer thickness is the charcoal layer of 5 centimeters, add 21 grams of copper-phosphorus master alloys of phosphorus content 13%, react for 0.5 hours, then take samples and analyze before furnace, measure the phosphorus content and oxygen content in copper liquid by direct-reading spectrometer, wherein, copper The phosphorus content in the liquid is controlled at 70-80ppm, and the oxygen content is controlled at 0-3ppm; after pre-deoxidation, the temperature of the copper liquid is raised to 1250°C, and 33 grams of low melting point impurity element modifiers are added, including 7.1 grams of lanthanum, cerium 18.3 grams, 4.7 grams of yttrium, 2.9 grams of neodymium, electromagnetic stirring for 22 minutes,...

Embodiment 2

[0034] Example 2 A process for modifying lead as an impurity element with a low melting point in copper. The specific steps are to melt 9.99 kg (by weight percentage) of miscellaneous copper containing 0.01% lead at 1200 ° C, and cover the surface of the copper liquid with a The thickness of the charcoal layer is 5.5 cm. Add 20 grams of copper-phosphorus master alloy with a phosphorus content of 14%, react for 0.7 hours, then take a sample and analyze it before the furnace, and measure the phosphorus content and oxygen content in the copper liquid by a direct-reading spectrometer. Among them, copper The phosphorus content in the liquid is controlled at 80-100ppm, and the oxygen content is controlled at 0-5ppm; after pre-deoxidation, the temperature of the copper liquid is raised to 1260°C, and 3.1 grams of low melting point impurity element modifiers are added, including 0.7 grams of lanthanum, cerium 1.8 grams, 0.5 grams of yttrium, 0.1 grams of neodymium, electromagnetic stir...

Embodiment 3

[0035] Example 3 A process for modifying lead as an impurity element with a low melting point in copper. The specific steps are to melt 10.27 kg (by weight percentage) of miscellaneous copper containing 0.5% lead at 1180 ° C, and cover the surface of the copper liquid with a Layer thickness is 5.8 centimeters charcoal layer, add 18 grams of copper-phosphorus master alloys with phosphorus content 12%, react for 0.6 hours, then take samples and analyze before furnace, measure phosphorus content and oxygen content in copper liquid by direct-reading spectrometer, wherein, copper The phosphorus content in the liquid is controlled at 75-85ppm, and the oxygen content is controlled at 0-8ppm; after pre-deoxidation, the temperature of the copper liquid is raised to 1255°C, and 98 grams of low melting point impurity element modifiers are added, including 19.6 grams of lanthanum, cerium 58..8 grams, 9.8 grams of yttrium, 9.8 grams of neodymium, electromagnetic stirring for 23 minutes, aft...

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Abstract

The invention provides a modifier for low-melting-point impurity element lead in copper and copper alloy materials and a modifying method for low-melting-point impurity element lead in copper and copper alloy materials. The copper and copper alloy materials to which the modifier and the modifying method are applicable are copper materials comprising, by weight, 0.001-3% of low-melting-point impurity element lead. According to the copper bar, copper pipe and copper wire modified by the modifying method, the room-temperature mechanical property is improved by 1-10 times than before, the high-temperature mechanical property is improved by 1-40 times than before, the electricity conducting and heat conducting property is improved by 1-2 times than before, and the corrosion resistance property is improved by 20-60% than before.

Description

technical field [0001] The invention relates to a process method for modifying low melting point impurity elements in nonferrous metal materials, in particular to a modifier and modification method for low melting point impurity element lead in copper and copper alloys. Background technique [0002] Lead, a low-melting impurity element in copper and its alloys, will segregate and precipitate at the grain boundaries during the solidification process of the cast slab, making the chemical composition of copper and copper alloy materials uneven, and causing differential potentials at the grain boundaries and inside the grains Poor, it is easy to cause microgalvanic corrosion of copper and copper alloy parts, so the existence of low melting point impurity elements at the grain boundary will deteriorate the physical and mechanical properties of copper materials, shorten the service life of copper materials, and lead will be dissolved during use , causing irreversible damage to hum...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C28/00C22C1/06C22C1/03C22C9/00C22B9/10C22B15/14
CPCC22B9/10C22B15/006C22C1/03C22C1/06C22C9/00C22C28/00
Inventor 李海红闫鑫升王颖杰孙学勤张尚洲
Owner YANTAI UNIV
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