Auxiliary chemical composition used for monocrystalline silicon or polycrystalline silicon acidic texturization and application thereof

Abstract

The invention provides an auxiliary chemical composition used for monocrystalline silicon or polycrystalline silicon acidic texturization. The auxiliary chemical composition includes: polysaccharide or its derivative, polyol or its derivative. The preparation and use method of the auxiliary chemical composition is simple and easy to implement, and has good repeatability. When used for diamond wire-cut monocrystalline silicon or polycrystalline silicon texturization, the auxiliary chemical composition can increase the texturization temperature, and at the same time can greatly improve the surface texturization uniformity, and the prepared silicon chip has the characteristics of low reflectivity, clean surface, low fragmentation rate, and uniform color after coating, thus greatly improving the photoelectric conversion efficiency of silicon cells.

Description

technical field [0001] The invention belongs to the field of new energy, and in particular relates to an auxiliary chemical composition for texturizing the surface of monocrystalline silicon or polycrystalline silicon for diamond wire cutting, and also relates to the use of the auxiliary chemical composition in preparing monocrystalline silicon or polycrystalline silicon for diamond wire cutting Application in acidic texturing solution for texturing. Background technique [0002] The reflection of incident light on the surface of the silicon wafer greatly reduces the efficiency (current flow) of silicon solar cells. About 40% of the sunlight will be lost if the surface of the silicon cell is not anti-reflective. The anti-reflective treatment must be effective over the entire solar spectrum and at a wide variety of incident light angles. [0003] Currently, antireflection on crystalline silicon photovoltaic cells is achieved through several different techniques. For monocry...

AI Technical Summary

Problems solved by technology

The biggest feature of this process is that it is very simple, but it cannot be directly applied to diamond wire cut silicon wafers; its main problem is that the reflectivity of the texture is high, the uniformity of the texture is very poor, and the color difference of the texture is large (especially different color difference between interfaces), especially the conversion efficiency of silicon cells is not high, etc.

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