Heat preservation and insulation ultra-thin type decoration base plate

Abstract

The invention discloses a heat preservation and insulation ultra-thin type decoration base plate which is composed of a surface layer, a core material and a glued layer. The surface layer is any of cement coating felt or alkali-free glass fiber felt. The core material is any of no-glue alkali-free glass fiber mesh or glue impregnated alkali-free glass fiber mesh. The glued layer is mixed by an inorganic gel material, waterborne latex, water, hollow beads, acrylate paraffin phase transformation microcapsule and a matching auxiliary. The thickness of the ultra-thin type decoration base plate can be discretionarily controlled. The thermal conduction coefficient of a 3mm plate is smaller than 0.07 W / m.k. A variety of decoration plates made by spraying various coating, stone-like coating and the like on the surfaces of the base plate have excellent heat preservation and insulation performance; compared with a traditional heat preservation mortar-coating facing system, a heat preservation mortar layer is omitted, in addition, construction is easy, and cost performance is prominent.

Description

technical field [0001] The invention relates to a thermal insulation ultra-thin decorative substrate, in particular to a decorative thermal insulation integrated board used for decoration of high-rise exterior walls, special-shaped surfaces and other parts, belonging to the field of building thermal insulation materials. Background technique [0002] With the continuous deepening of the concept of energy saving and emission reduction in various fields of society, building insulation has naturally become a hot spot nowadays. At present, the commonly used method of building insulation is to adopt a three-layer insulation structure of "insulation layer-leveling layer-decoration layer". The structure requires at least three construction procedures, the construction period is long, and the cost is high. At present, organic insulation boards are commonly used for wall insulation, such as EPS, XPS, polyurethane boards, etc. These materials are compatible with the inorganic materials...

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Problems solved by technology

[0002] With the continuous deepening of the concept of energy saving and emission reduction in various fields of society, building insulation has naturally become a hot spot nowadays. At present, the commonly used method of building insulation is to adopt a three-layer insulation structure of "insulation layer-leveling layer-decoration layer". The structure requires at least three construction procedures, the construction period is long, and the cost is high. At present, organic insulation boards are commonly used for wall insulation, such as EPS, XPS, polyurethane boards, etc. These materials are compatible with the inorganic materials of the wall, especially the mortar used to level the surface of the insulation layer The thermal expansion coefficients of the layers are quite different, so the walls may crack or even fall off during the long-term cycle use in winter and summer, and the service life is limited; while the thermal insulation integrated board currently being promoted has overcome the thermal expansion of the organic layer-inorganic layer to a certain extent. The problem of large differences in coefficients, but the disadvantages of high cost and exposed insulation layer still restrict its service life and product promotion

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