Aluminum alloy substrate thick film circuit intermediate-temperature sintering dielectric paste and preparation method thereof

Abstract

The invention discloses an aluminum alloy substrate thick film circuit middle-temperature sintering dielectric paste and a preparation method thereof. The preparation method is used for preparing the aluminum alloy substrate thick film circuit middle-temperature sintering dielectric paste. The aluminum alloy substrate thick film circuit middle-temperature sintering dielectric paste comprises the following materials in part by weight: 60%-80% of lead-free microcrystalline glass powders, 1%-10% of rare earth oxide and 19%-30% of organic bonding phase, wherein the lead-free microcrystalline glass powders are formed by SiO2, Bi2O3, B2O3, ZnO, K2O, SrO2 and CaO; and the organic bonding phase is a mixture formed by an organic solvent, a high-polymer thickener, a surfactant, a plasticizer, a dispersant, an antifoaming agent and a thixotropic agent. A dielectric layer formed by printing the dielectric paste on an aluminum alloy substrate has the advantages of large adhesive force, large breakdown strength and high insulation resistance, and is capable of being compatible with a thick film circuit of the aluminum alloy substrate with a resistance paste and an electrode paste.

Description

technical field [0001] The invention relates to the technical field of thick-film circuits, in particular to a medium-temperature sintering medium slurry for aluminum alloy substrate thick-film circuits and a preparation method thereof. Background technique [0002] With the development of multilayer and miniaturization of thick film circuit components, corresponding mechanical and thermal performance requirements are put forward for the substrate, especially the thermal conductivity requirements of the substrate. The aluminum alloy substrate has properties such as low density, good ductility, good thermal conductivity, excellent cold and hot forming properties, and good toughness, which make it possible to be used as a substrate material, but this brings about a thermal expansion coefficient that is different from that of commonly used electronics. Slurry mismatch and other issues. [0003] Aluminum alloy as a substrate material puts forward technical requirements differen...

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Problems solved by technology

[0004] At present, dielectric pastes for thick-film circuits based on stainless steel substrates are mature and commercialized on the market, but there are few dielectric pastes applied to aluminum alloy substrates; The Chinese invention patent of "dielectric slurry for circuit and its preparation method" and the Chinese invention patent with the application number of 201510334158.7 and the patent name of "a kind of dielectric slurry for aluminum substrate thick film circuit insulation and its preparation method" have disclosed It is used for thick-film circuit insulation dielectric paste on aluminum substrate and its preparation method, but the sintering temperature of these aluminum-based dielectric pastes is relatively high, and the breakdown voltage and insulation resistance still cannot meet the high requirements of aluminum-based electric heating elements