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A kind of aramid fiber felt laminated board and preparation method thereof

A technology of aramid fiber and pressing board, applied in the field of laminated board and its preparation, to achieve the effect of reducing production cost, good electrical performance and reducing cost

Active Publication Date: 2018-10-26
SICHUAN DONGFANG INSULATING MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention aims at overcoming the deficiencies in the above-mentioned prior art, especially how to keep the extra-high strength ( Usually refers to the problem that the bending strength is 491-509MPa), and at the same time, the tracking index of 600V is achieved. An aramid fiber felt laminate and its preparation method are provided. The invention provides a Aramid fiber felt laminates are used in the fields of anti-stab, anti-stab, and military industry. On the premise of ensuring the mechanical and electrical properties, the products can achieve long-term high temperature resistance and the tracking index of 600V.

Method used

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  • A kind of aramid fiber felt laminated board and preparation method thereof
  • A kind of aramid fiber felt laminated board and preparation method thereof
  • A kind of aramid fiber felt laminated board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-1

[0040] At room temperature, respectively add 45 parts of polybutadiene epoxy resin, 27 parts of benzoxazine modified phenolic resin, and 33 parts of inorganic powder aluminum nitride into the glue mixing tank, and stir at 120°C for 2.5 hours, Add 28 parts of curing agent 4,4-diaminodiphenyl sulfone and 140 parts of dimethylformamide, stir for 0.5 hours to make them fully dispersed, then add 0.1 part of accelerator boron trifluoride ethylamine to adjust the molding of the glue Time, sampling, test the molding time of the glue solution with a knife method (180°C hot plate) for 360 seconds, and the glue solution is prepared.

Embodiment 1-2

[0042] At room temperature, add 42 parts of biphenyl-type epoxy resin, 35 parts of xylene-modified phenolic resin, and 23 parts of inorganic powder silicon dioxide into the compounding tank, stir at 130°C for 0.5 hours, then add curing agent 25 parts of 4,4-diaminodiphenyl sulfone and 135 parts of dimethylacetamide were stirred for 0.5 hours to make them fully dispersed, and then 0.5 parts of accelerator 2-ethyl-4-methylimidazole was added to adjust the consistency of the glue. Molding time, sampling, test the molding time of the glue solution with a knife method (180°C hot plate) for 450 seconds, and the glue solution is prepared.

Embodiment 1-3

[0044] At room temperature, add 31 parts of bisphenol F epoxy resin, 55 parts of silicone modified phenolic resin, and 28 parts of inorganic powder alumina into the glue tank, stir at 130°C for 1 hour, then add curing agent Mix 25 parts of low-molecular-weight polyamide and 130 parts of xylene, stir for 0.42 hours to fully disperse them evenly, add 0.8 parts of accelerator 2-ethyl-4-methylimidazole to adjust the molding time of the glue, take samples, and use the knife method Test the molding time of the glue solution (180°C hot plate) for 510 seconds, and the glue solution is prepared.

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Abstract

The invention discloses an aramid fiber felt laminated board and a preparation method thereof. The aramid fiber felt laminated board is characterized in that the laminated board is a composite material formed by hot briquetting of one or more layers of overlapped high-strength tracking resistance resin aramid fiber felt prepreg, and the electric leakage resistance mark index is larger than or equal to 600V. The prepreg is formed by dipping or spraying a high-strength tracking resistance resin adhesive on the aramid fiber felt and then baking the high-strength tracking resistance resin adhesive, and the prepreg is the aramid fiber felt impregnated material with the resin prepreg formed on the aramid fiber felt; the high-strength tracking resistance resin adhesive is prepared from the following components in parts by weight: 20-55 parts of high-temperature-resistant epoxy resin, 25-60 parts of modified phenolic resin, 3-35 parts of a curing agent, 5-35 parts of inorganic powder, 0.01-1 part of an accelerant and 125-170 parts of a solvent. The product disclosed by the invention is suitable for the technical fields of various engineering equipment of aviation, spaceflight, high-performance ships, bulletproof, stab-resistance and military industry, electrical equipment, corrosion-resistant appliances, new energy automobiles and the like.

Description

technical field [0001] The present invention belongs to laminated board and its preparation, relates to a kind of aramid fiber felt laminated board and its preparation method, especially relates to a kind of special purpose (aviation, spaceflight, high-performance ship, bulletproof, anti-stab, military industry) various kinds of projects Aramid fiber felt laminates in the fields of equipment, electrical equipment, corrosion-resistant appliances, and new energy vehicles and a preparation method thereof. Background technique [0002] Aramid fiber felt laminates can be widely used due to their unique excellent properties such as isotropy, high mechanical strength, high strength modulus, wear resistance, low electrical conductivity, creepage resistance, no warping, and no delamination. In the fields of various engineering equipment, electrical equipment, corrosion-resistant appliances and new energy vehicles for special purposes (aviation, aerospace, high-performance ships, bull...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B27/02B32B27/04B32B27/12B32B27/34B32B7/12B32B33/00B32B37/06B32B37/10B32B37/12C08L63/00C08L61/14C08K3/28C08K3/36C08K3/22
CPCB32B5/02B32B7/12B32B27/12B32B27/34B32B33/00B32B37/06B32B37/10B32B37/12B32B2250/20B32B2255/02B32B2255/26B32B2260/021B32B2260/046B32B2262/0269B32B2307/206B32B2307/306B32B2307/546C08L61/14C08L63/00C08L2201/08C08K2003/282C08K3/36C08K2003/2227C08K2003/222
Inventor 杜旻刘锋黄洪驰彭晓伟邵亚婷
Owner SICHUAN DONGFANG INSULATING MATERIAL
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