A kind of glass fiber mat laminated board and preparation method thereof
A technology of glass fiber felt and alkali-free glass fiber, which is applied in the field of laminates and its preparation, can solve the problems of failure to meet the requirements of heat resistance, poor processing technology, and low test values, and achieve improved tracking resistance , excellent product quality and simple preparation process
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Embodiment 1-1
[0041] At room temperature, add 55 parts of bisphenol-A epoxy resin, 18 parts of boron-modified phenolic resin, and 20 parts of inorganic powder aluminum hydroxide into the glue tank, stir at 70°C for 2 hours, then add the curing agent 35 parts of 4,4-diaminodiphenylmethane, 120 parts of toluene, stir for 1 hour to make it fully dispersed, add 0.5 part of accelerator 2-methylimidazole to adjust the molding time of the glue, take samples, and test with a knife method The molding time of the glue solution (180°C hot plate) is 470 seconds, and the glue solution is prepared.
Embodiment 1-2
[0043] At room temperature, add 33 parts of bisphenol F epoxy resin, 60 parts of silicone modified phenolic resin, and 30 parts of inorganic powder alumina into the glue tank, stir at 130°C for 1 hour, then add curing agent Mix 29 parts of low-molecular-weight polyamide and 110 parts of xylene, stir for 0.42 hours to fully disperse them evenly, add 1 part of accelerator 2-ethyl-4-methylimidazole to adjust the molding time of the glue, take samples, and use the knife method Test the molding time of the glue solution (180°C hot plate) for 520 seconds, and the glue solution is prepared.
Embodiment 1-3
[0045] At room temperature, add 40 parts of polybutadiene epoxy resin, 25 parts of benzoxazine-modified phenolic resin, and 30 parts of inorganic powder aluminum nitride into the glue tank respectively, and stir at 120°C for 2.5 hours. Add 25 parts of curing agent 4,4-diaminodiphenyl sulfone and 130 parts of dimethylformamide, stir for 0.5 hours to make them fully dispersed, then add 0.08 parts of boron trifluoride ethylamine to adjust the molding of the glue Time, sampling, test the molding time of the glue solution (180°C hot plate) for 450 seconds with the knife method, and the glue solution is prepared.
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